WO2000004395A1 - Device for the electric testing of integrated circuits - Google Patents

Device for the electric testing of integrated circuits Download PDF

Info

Publication number
WO2000004395A1
WO2000004395A1 PCT/DE1999/001983 DE9901983W WO0004395A1 WO 2000004395 A1 WO2000004395 A1 WO 2000004395A1 DE 9901983 W DE9901983 W DE 9901983W WO 0004395 A1 WO0004395 A1 WO 0004395A1
Authority
WO
WIPO (PCT)
Prior art keywords
ics
carrier plate
kontaktieremrichtung
prober
elements
Prior art date
Application number
PCT/DE1999/001983
Other languages
German (de)
French (fr)
Inventor
Dieter SCHÜTZ
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO2000004395A1 publication Critical patent/WO2000004395A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Definitions

  • the invention relates to a device for electrical testing of ICs by means of a contacting device, which is provided with resilient contact elements which can be contacted with connection elements of the IC.
  • the invention has for its object to provide a device with high stucco performance with little development effort.
  • a Prober is a high-performance testing device that can be used to test chips that have been combined in the wafer.
  • the wafer is moved in two coordinate directions under the contacting device with a very short cycle time.
  • the exchangeable adapter plate carries different contacting devices depending on the chip type.
  • the adapter plates In order to also use the Prober for testing finished To be able to use domestic ICs, the adapter plates must be provided with a contact device that is adapted to the type of IC to be tested.
  • a particular advantage is that the prober to-use test equipment used largely unchanged ⁇ the can, the development effort so limited essentially to the adjustment of Adapterplatme.
  • the electrical ⁇ cal testing may remain unchanged compared to the unpackaged chip.
  • a particular advantage is that the lifting table of the prober can be moved on the level of the carrier plate. As a result, ICs of different dimensions and numbers can be contacted by means of simple control measures, without the need for a large number of specifically arranged contacting devices.
  • the carrier plate can be designed in such a way that it can accommodate the Ics still combined in the lead frame, the Ics still being held in the lead frame. This applies to all ICs in which a galvanic isolation of the connection elements in the lead frame is possible. Other ICs can e.g. a multiple mount of the carrier plate can be used individually.
  • the carrier plate is moved successively from IC to IC under the contacting direction, the connection elements being contacted with the contact springs of the contact device. Particularly in the case of small ICs with a small number of connection elements, it is possible to provide several contacting devices for testing several ICs in groups.
  • the contact elements are not used in a base, but rather directly in the adapter plate, so that the free line lengths can be kept correspondingly short. This makes it possible to carry out measurements with the highest test frequencies.
  • the Kunststofffe ⁇ be countries on the connection elements immediately adjacent to the outlet from the housing ⁇ placed, thereby increasing the contact force and the free performance Langen can be further shortened.
  • FIG. 1 shows a side view of a device for testing ICs by means of a contacting device
  • FIG. 2 shows a plan view of the device according to FIG. 1
  • FIG. 3 shows an enlarged section from the device according to FIG. 1.
  • FIG. 4 shows an enlarged section from the device according to FIG another contacting device.
  • FIGS. 1 and 2 a large number of ICs 1 m lead frames 2 are combined, which are placed in a charging station 3 on a carrier plate 4. From there, the exchanger is a ⁇ plate 4 is provided with a prober test station 5 6 m transported. This has contacting devices 10 which can be contacted with connection elements 12 (FIG. 3) of the ICs 1.
  • the carrier plate 4 rests on a lifting table 7 which can be moved horizontally in two coordinate directions.
  • the contacting devices 10 are located on an interchangeable adapter plate 8 of the prober 5 arranged above the lifting table 7.
  • the lifting table 7 can be moved step by step under the contacting devices 10 and raised to the prober 5h in such a way that all the ICs 1 successively contact the contacting devices 10 and can be tested.
  • the carrier plate 4 is moved to an unloading station 9, which can be used to remove the faulty ICs.
  • Figure 3 shows a section of the adapter plate 8 with the underlying support plate 4 m of the upper stroke ⁇ position of the lifting table 7.
  • the contacting device 10 On the adapter plate 8, the contacting device 10 is attached, the oblique spring springs 11 designed as spiral springs, the free ends of which Connection elements 12 of one of the ICs 1 are placed in the immediate vicinity of the IC housing.
  • the Biegefe ⁇ countries 11 are as far as bent to sit with sufficient spring force on the connecting elements 12th
  • the spring contacts are designed as axially resilient styli 13, which are held and contacted directly in the adapter plate.
  • the connection elements 12 are printed here against the stylus tips of the styli.
  • the free cable length is considerably shorter here than with the spiral springs 11 according to FIG. 3, so that high-frequency test signals can be transmitted without interference.

Abstract

According to the invention, the integrated circuits (1) are gathered in a locating seat (for example, 4) and tested with high precision and speed in a tester (5) which is provided with resilient contact elements (for example, 11, 13) which can be contacted with connecting elements (12) of the integrated circuit (1). This significantly reduces testing times.

Description

Beschreibungdescription
Vorrichtung zum elektrischen Testen von ICsDevice for electrical testing of ICs
Die Erfindung bezieht sich auf eine Vorrichtung zum elektrischen Testen von ICs mittels einer Kontaktiereinrichtung, die mit federnden Kontaktelementen versehen ist, die mit Anschlußelementen des IC kontaktierbar sind.The invention relates to a device for electrical testing of ICs by means of a contacting device, which is provided with resilient contact elements which can be contacted with connection elements of the IC.
Es ist üblich, die einzelnen mit einem Gehäuse versehenen ICs mittels einer Prüfemπchtung zu testen, bei der die Anschlußelemente des IC gegen Federkontakte einer Kontak- tieremrichtung gedruckt werden. Bei einer derartigen Test¬ einrichtung bedingt der Wechsel der einzelnen Prüflinge einer erheblichen Zeitaufwand.It is customary to test the individual ICs provided with a housing by means of a test device in which the connection elements of the IC are printed against spring contacts of a contact device. In such a test device , the change of the individual test items requires a considerable amount of time.
Ferner ist es durch die US 5,463,325 bekannt, eine Vielzahl von gehausten ICs m einer Tragerplatte aufzunehmen, die un¬ ter eine Prüfemπchtung verfahrbar ist. Diese ist mit einer entsprechend der Lage der ICs mit einer Vielzahl der Testein¬ richtungen versehen, die mit ihren Federkontakten auf die An¬ schlußelemente der ICs abgesenkt werden können. Dadurch ist es möglich, alle ICs zeitsparend gleichzeitig zu kontaktieren und zu testen.Further, by the US 5,463,325 is known, a plurality of ICs m gehausten a support plate receiving the un ¬ ter a Prüfemπchtung is movable. This is provided with a corresponding to the position of the ICs having a plurality of testing equipment ¬ directions provided that the IC circuit elements with their spring contacts on the at ¬ can be lowered. This makes it possible to contact and test all ICs at the same time to save time.
Der Erfindung liegt die Aufgabe zugrunde, mit geringem Entwicklungsaufwand eine Vorrichtung von hoher Stuckleistung zu schaffen.The invention has for its object to provide a device with high stucco performance with little development effort.
Diese Aufgabe wird durch die Erfindung gemäß Anspruch 1 gelost. Bei einem Prober handelt es sich um eine hochleistungsfähige Prüfemrichtung, mit der im Wafer zusammengefaßte Chips getestet werden können. Dabei wird der Wafer m zwei Koordinatenrichtungen unter der Kontaktiereinrichtung mit sehr kurzer Taktzeit verfahren. Die austauschbare Adapterplatte tragt j e nach Chiptyp unterschiedliche Kontaktierem- richtungen. Um den Prober auch für die Prüfung von fertig ge- hausten ICs einsetzen zu können, muß die Adapterplatme mit einer an dem jeweils zu prüfenden IC-Typ angepaßten Kontak- tieremrichtung versehen werden.This object is achieved by the invention according to claim 1. A Prober is a high-performance testing device that can be used to test chips that have been combined in the wafer. The wafer is moved in two coordinate directions under the contacting device with a very short cycle time. The exchangeable adapter plate carries different contacting devices depending on the chip type. In order to also use the Prober for testing finished To be able to use domestic ICs, the adapter plates must be provided with a contact device that is adapted to the type of IC to be tested.
Ein besonderer Vorteil besteht darin, daß die den Prober nutzende Testeinrichtung weitgehend unverändert eingesetzt wer¬ den kann, sodaß sich der Entwicklungsaufwand im wesentlichen auf die Anpassung der Adapterplatme beschrankt. Die elektri¬ sche Prüfung kann gegenüber dem ungehausten Chip unverändert bleiben. Ein besonderer Vorteil besteht darin, daß der Hubtisch des Probers m der Ebene der Tragerplatte verfahrbar ist. Dadurch können ICs von unterschiedlicher Ausdehnung und Anzahl durch blose Steuerungsmaßnahmen kontaktiert werden, ohne daß dazu eine Vielzahl von spezifisch angeordneten Kon- taktieremrichtungen erfordlich wäre.A particular advantage is that the prober to-use test equipment used largely unchanged ¬ the can, the development effort so limited essentially to the adjustment of Adapterplatme. The electrical ¬ cal testing may remain unchanged compared to the unpackaged chip. A particular advantage is that the lifting table of the prober can be moved on the level of the carrier plate. As a result, ICs of different dimensions and numbers can be contacted by means of simple control measures, without the need for a large number of specifically arranged contacting devices.
Die Tragerplatte kann derart ausgebildet sein, daß sie die noch im lead frame zusammengefaßten Ics aufnehmen kann, wobei die Ics noch im Stanzgitter gehalten sind. Dies kommt für al- le ICs m Frage, bei denen eine galvanische Trennung der Anschlußelemente im lead frame möglich ist. Andere ICs können z.B. einzeln m eine Vielfachaufnahme der Tragerplatte eingesetzt werden. Die Tragerplatte wird unter der Kontaktiere - πchtung sukzessive von IC zu IC verfahren, wobei die An- Schlußelemente jeweils mit den Kontaktfedern der Kontakteinrichtung kontaktiert werden. Insbesondere bei kleinen ICs mit einer geringen Anzahl an Anschlußelementen ist es möglich, mehrere Kontaktiereinrichtung zum gruppenweisen Testen mehrerer ICs vorzusehen.The carrier plate can be designed in such a way that it can accommodate the Ics still combined in the lead frame, the Ics still being held in the lead frame. This applies to all ICs in which a galvanic isolation of the connection elements in the lead frame is possible. Other ICs can e.g. a multiple mount of the carrier plate can be used individually. The carrier plate is moved successively from IC to IC under the contacting direction, the connection elements being contacted with the contact springs of the contact device. Particularly in the case of small ICs with a small number of connection elements, it is possible to provide several contacting devices for testing several ICs in groups.
Nach einer vorteilhaften Weiterbildung der Erfindung gemäß Anspruch 2 sind die Kontaktelemente nicht m einen Sockel, sondern direkt m d e Adapterplatme eingesetzt, so daß die freien Leitungslangen entsprechend kurz gehalten werden kon- nen. Dadurch ist es möglich, Messungen mit höchsten Testfrequenzen durchzufuhren. Bei der Weiterbildung nach Anspruch 3 werden die Kontaktfe¬ dern auf die Anschlußelemente unmittelbar neben den Austritt¬ stellen aus dem Gehäuse aufgesetzt, wodurch die Kontaktkraft erhöht und die freien Leistungslangen noch weiter verkürzt werden können.According to an advantageous development of the invention according to claim 2, the contact elements are not used in a base, but rather directly in the adapter plate, so that the free line lengths can be kept correspondingly short. This makes it possible to carry out measurements with the highest test frequencies. In the further development according to claim 3, the Kontaktfe ¬ be countries on the connection elements immediately adjacent to the outlet from the housing ¬ placed, thereby increasing the contact force and the free performance Langen can be further shortened.
Im Folgenden wird die Erfindung anhand eines m der Zeichnung dargestellten Ausfuhrungsbeispieles naher erläutert.The invention is explained in more detail below with reference to an exemplary embodiment shown in the drawing.
Figur 1 zeigt eine Seitenansicht einer Vorrichtung zum Testen von ICs mittels einer Kontaktiereinrichtung, Figur 2 eine Draufsicht auf die Vorrichtung nach Figur 1, Figur 3 einen vergrößerten Ausschnitt aus der Vorrichtung nach Figur 1. Figur 4 einen vergrößerten Ausschnitt aus der Vorrichtung nach Figur 1 mit einer anderen Kontaktiereinrichtung .1 shows a side view of a device for testing ICs by means of a contacting device, FIG. 2 shows a plan view of the device according to FIG. 1, FIG. 3 shows an enlarged section from the device according to FIG. 1. FIG. 4 shows an enlarged section from the device according to FIG another contacting device.
Nach den Figuren 1 und 2 ist eine Vielzahl von ICs 1 m lead frames 2 zusammengefaßt, die m einer Ladestation 3 auf eine Tragerplatte 4 aufgelegt werden. Von dort wird die Trager¬ platte 4 m eine mit einem Prober 5 versehene Teststation 6 transportiert. Diese weißt Kontaktiereinrichtungen 10 auf, die mit Anschlußelementen 12 (Fig. 3) der ICs 1 kontaktierbar sind. Die Tragerplatte 4 liegt dabei auf einem m zwei Koor- dinatenrlchtungen waagerecht verfahrbaren Hubtisch 7 auf.According to FIGS. 1 and 2, a large number of ICs 1 m lead frames 2 are combined, which are placed in a charging station 3 on a carrier plate 4. From there, the exchanger is a ¬ plate 4 is provided with a prober test station 5 6 m transported. This has contacting devices 10 which can be contacted with connection elements 12 (FIG. 3) of the ICs 1. The carrier plate 4 rests on a lifting table 7 which can be moved horizontally in two coordinate directions.
Die Kontaktiereinrichtungen 10 befinden sich auf einer über dem Hubtisch 7 angeordneten auswechselbaren Adapterplatme 8 des Probers 5. Der Hubtisch 7 kann unter den Kontaktierem- richtungen 10 schrittweise derart verfahren und zum Prober 5 h angehoben werden, daß sukzessive sämtliche ICs 1 mit den Kontaktiereinrichtungen 10 kontaktiert und getestet werden können. Nach Beendigung dieser Testvorgange wird die Tragerplatte 4 zu einer Entladestation 9 verfahren, der die feh- lerhaften ICs ausgemustert werden können. Figur 3 zeigt einen Ausschnitt aus der Adapterplatme 8 mit der darunter befindlichen Tragerplatte 4 m der oberen Hub¬ stellung des Hubtisches 7. An der Adapterplatme 8 ist die Kontaktiereinrichtung 10 befestigt, die schragstehende, als Biegefedern 11 ausgebildete Federkontakte tragt, deren freie Enden auf die Anschlußelemente 12 eines der ICs 1 unmittelbarer Nahe des IC-Gehauses aufgesetzt sind. Die Biegefe¬ dern 11 sind dabei soweit durchgebogen, daß sie mit hinreichender Federkraft an den Anschlußelementen 12 aufsitzen.The contacting devices 10 are located on an interchangeable adapter plate 8 of the prober 5 arranged above the lifting table 7. The lifting table 7 can be moved step by step under the contacting devices 10 and raised to the prober 5h in such a way that all the ICs 1 successively contact the contacting devices 10 and can be tested. After completion of these test processes, the carrier plate 4 is moved to an unloading station 9, which can be used to remove the faulty ICs. Figure 3 shows a section of the adapter plate 8 with the underlying support plate 4 m of the upper stroke ¬ position of the lifting table 7. On the adapter plate 8, the contacting device 10 is attached, the oblique spring springs 11 designed as spiral springs, the free ends of which Connection elements 12 of one of the ICs 1 are placed in the immediate vicinity of the IC housing. The Biegefe ¬ countries 11 are as far as bent to sit with sufficient spring force on the connecting elements 12th
Nach Figur 4 sind die Federkontakte als axial federnde Taststifte 13 ausgebildet, die m der Adapterplatme unmittelbar gehalten und kontaktiert sind. Die Anschlußelemente 12 sind hier gegen die Tastspitzen der Taststifte gedruckt. Die freie Leitungslange ist hier erheblich kurzer als bei den Biegefedern 11 nach Figur 3, so daß hoherfrequente Testsignale störungsfrei übertragen werden können. According to FIG. 4, the spring contacts are designed as axially resilient styli 13, which are held and contacted directly in the adapter plate. The connection elements 12 are printed here against the stylus tips of the styli. The free cable length is considerably shorter here than with the spiral springs 11 according to FIG. 3, so that high-frequency test signals can be transmitted without interference.

Claims

Patentansprüche claims
1. Vorrichtung zum elektrischen Testen von ICs (1) mittels zumindest einer Kontaktieremrichtung (10), die mit federnden Kontaktelementen (z.B. 11, 13) versehen ist, die mit An¬ schlußelementen (12) des IC (1) kontaktierbar sind, wobei eine Vielzahl der ICs (1) m einer Ladestation (3) m eine Tragerplatte (4) einsetzbar ist, wobei eine nachfolgende Teststation (6) eine Testeinrichtung (z.B. 5) mit zumindest einer der Kontaktieremrichtungen (10) aufweist und wobei die die Tragerplatte mit den einliegenden ICs durch ei¬ ne relative Hubbwegung gegen die Kontaktieremrichtung druck¬ 1. An apparatus for electrically testing of ICs (1) connected to ¬ locking elements (12) of the IC (1) are contacted by means of at least one Kontaktieremrichtung (10), which is provided with resilient contact elements (eg 11, 13), wherein a A large number of ICs (1) m a charging station (3) m a carrier plate (4) can be used, a subsequent test station (6) having a test device (for example 5) with at least one of the contacting devices (10) and the carrier plate with the inset ICs by ei ¬ ne relative Hubbwegung against Kontaktieremrichtung pressure ¬
dadurch gekennzeichnet, daß die Testeinrichtung als Prober (5) ausgebildet ist, daß die Kontaktieremrichtung (10) m eine wechselbare Adap¬ terplatme (8) des Probers (5) eingesetzt ist, daß die Tragerplatte (4) auf einem Hubtisch (7) des Probers (5) fixierbar ist, daß der Hubtisch (7) mit der Tragerplatte (5) gegenüber der Kontaktieremrichtung (10) m der Ebene der Tragerplatte ver¬ fahrbar gelagert ist, daß die ICs einzeln oder gruppenweise sukzessive mit der Te- stemrichtung kontaktierbar sind und daß die ICs m eines nachfolgenden Entladestation von der Tragerplatte entnehmbar sind.characterized in that the testing device is designed as a prober (5), that the Kontaktieremrichtung (10) m a removable Adap ¬ terplatme (8) of the prober (5) is inserted, that the carrier plate (4) on a lifting table (7) prober is fixed (5), that the lifting table (7) m with the carrier plate (5) opposite the Kontaktieremrichtung (10) is mounted movable to the plane of the support plate ver ¬ that the ICs individually or in groups, successively stemrichtung with the Te are contactable and that the ICs in a subsequent unloading station can be removed from the carrier plate.
2. Vorrichtung nach Anspruch 1, dadurch gekennzeichnet, daß die Kontaktieremrichtung (10) durch eine Gesamtheit der einzelnen Kontaktelemente gebildet ist, die als axial federnde Taststifte (13) ausgebildet und m Kontaktlocher der Adapterplatme (8) eingesetzt sind.2. Device according to claim 1, characterized in that the Kontaktieremrichtung (10) is formed by an entirety of the individual contact elements which are designed as axially resilient styli (13) and m contact holes of the adapter plates (8) are used.
3 . Vorrichtung nach Anspruch 1 oder 2 , d a d u r c h g e k e n n z e i c h n e t , daß die Kontaktelemente (z.B. 11, 13) in unmittelbarer Nähe eines IC-Gehäuses auf die Anschlußelemente (12) aufsetzbar sind. 3rd Device according to claim 1 or 2, characterized in that that the contact elements (eg 11, 13) can be placed on the connection elements (12) in the immediate vicinity of an IC housing.
PCT/DE1999/001983 1998-07-15 1999-07-01 Device for the electric testing of integrated circuits WO2000004395A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19831827 1998-07-15
DE19831827.8 1998-07-15

Publications (1)

Publication Number Publication Date
WO2000004395A1 true WO2000004395A1 (en) 2000-01-27

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5384531A (en) * 1991-09-05 1995-01-24 Mitsubishi Electrical Engineering Co. Ltd. Apparatus for inspecting characteristics of semiconductor chips
US5463325A (en) * 1992-05-28 1995-10-31 Rohm Co., Ltd. Apparatus for measuring characteristics of electronic parts
US5559444A (en) * 1991-06-04 1996-09-24 Micron Technology, Inc. Method and apparatus for testing unpackaged semiconductor dice
JPH08330370A (en) * 1995-05-31 1996-12-13 Mitsumi Electric Co Ltd Semiconductor inspecting device
GB2320964A (en) * 1993-11-25 1998-07-08 Motorola Inc Method for testing electronic devices attached to a leadframe

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5559444A (en) * 1991-06-04 1996-09-24 Micron Technology, Inc. Method and apparatus for testing unpackaged semiconductor dice
US5384531A (en) * 1991-09-05 1995-01-24 Mitsubishi Electrical Engineering Co. Ltd. Apparatus for inspecting characteristics of semiconductor chips
US5463325A (en) * 1992-05-28 1995-10-31 Rohm Co., Ltd. Apparatus for measuring characteristics of electronic parts
GB2320964A (en) * 1993-11-25 1998-07-08 Motorola Inc Method for testing electronic devices attached to a leadframe
JPH08330370A (en) * 1995-05-31 1996-12-13 Mitsumi Electric Co Ltd Semiconductor inspecting device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 04 30 April 1997 (1997-04-30) *

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