WO2000008505A1 - Optical module - Google Patents
Optical module Download PDFInfo
- Publication number
- WO2000008505A1 WO2000008505A1 PCT/JP1999/003927 JP9903927W WO0008505A1 WO 2000008505 A1 WO2000008505 A1 WO 2000008505A1 JP 9903927 W JP9903927 W JP 9903927W WO 0008505 A1 WO0008505 A1 WO 0008505A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- optical
- optical module
- light
- optical element
- main surface
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 221
- 239000004065 semiconductor Substances 0.000 claims description 34
- 229920005989 resin Polymers 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 15
- 238000007789 sealing Methods 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 26
- 238000010586 diagram Methods 0.000 description 5
- 230000010354 integration Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000013307 optical fiber Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73257—Bump and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Integrated Circuits (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
- Pivots And Pivotal Connections (AREA)
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP99931488A EP1020747A4 (en) | 1998-08-05 | 1999-07-22 | OPTICAL MODULE |
KR10-2000-7003642A KR100489147B1 (ko) | 1998-08-05 | 1999-07-22 | 광 모듈 |
US09/509,669 US6793405B1 (en) | 1998-08-05 | 1999-07-22 | Optical module |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23360898 | 1998-08-05 | ||
JP10/233608 | 1998-08-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000008505A1 true WO2000008505A1 (en) | 2000-02-17 |
Family
ID=16957725
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1999/003927 WO2000008505A1 (en) | 1998-08-05 | 1999-07-22 | Optical module |
Country Status (6)
Country | Link |
---|---|
US (1) | US6793405B1 (ja) |
EP (1) | EP1020747A4 (ja) |
KR (1) | KR100489147B1 (ja) |
CN (1) | CN1287624A (ja) |
TW (1) | TW432236B (ja) |
WO (1) | WO2000008505A1 (ja) |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005265885A (ja) * | 2004-03-16 | 2005-09-29 | Sony Corp | 光結合装置、光結合装置用の支持体、及びこれらの製造方法 |
JP2006323316A (ja) * | 2005-05-20 | 2006-11-30 | Sumitomo Bakelite Co Ltd | 光導波路構造体 |
JP2006323317A (ja) * | 2005-05-20 | 2006-11-30 | Sumitomo Bakelite Co Ltd | 光導波路構造体 |
US7217957B2 (en) | 2002-02-14 | 2007-05-15 | Sumitomo Electric Industries, Ltd. | Optical transmission module |
JP2007156026A (ja) * | 2005-12-02 | 2007-06-21 | Kyocera Corp | 光配線モジュール |
JP2007178950A (ja) * | 2005-12-28 | 2007-07-12 | Kyocera Corp | 光配線基板および光配線モジュール |
US7248768B2 (en) | 2005-09-30 | 2007-07-24 | Doosan Corporation | Optical interconnection module and method of manufacturing the same |
US7257297B2 (en) | 2002-06-18 | 2007-08-14 | Seiko Epson Corporation | Optical communication module with particular fiber guide hole, optical-communication-module production method, and electronic device |
JP2008065287A (ja) * | 2006-08-10 | 2008-03-21 | Matsushita Electric Works Ltd | 光電気変換装置 |
JP2008176071A (ja) * | 2007-01-18 | 2008-07-31 | Omron Corp | 光伝送モジュール、電子機器、及び光伝送モジュールの製造方法 |
JP2008216712A (ja) * | 2007-03-06 | 2008-09-18 | Furukawa Electric Co Ltd:The | 光部品の実装方法 |
JP2009145817A (ja) * | 2007-12-18 | 2009-07-02 | Toppan Printing Co Ltd | 光基板およびその製造方法 |
JP2009163178A (ja) * | 2008-01-10 | 2009-07-23 | Hitachi Cable Ltd | 光素子と基板との接合構造及び光送受信モジュール並びに光モジュールの製造方法 |
JP2009223340A (ja) * | 2009-07-06 | 2009-10-01 | Mitsubishi Electric Corp | 光学部品、およびそれに用いられる光路変換デバイス |
JP2010061171A (ja) * | 2009-12-16 | 2010-03-18 | Sony Corp | 光結合装置及びその製造方法 |
US8045829B2 (en) | 2005-12-02 | 2011-10-25 | Kyocera Corporation | Optical waveguide member, optical wiring board, optical wiring module and method for manufacturing optical waveguide member and optical wiring board |
JP2017194579A (ja) * | 2016-04-21 | 2017-10-26 | 日本電信電話株式会社 | 光電子集積回路の実装方法 |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW460717B (en) * | 1999-03-30 | 2001-10-21 | Toppan Printing Co Ltd | Optical wiring layer, optoelectric wiring substrate mounted substrate, and methods for manufacturing the same |
KR100523992B1 (ko) * | 2002-03-19 | 2005-10-26 | 학교법인 한국정보통신학원 | 광연결을 가지는 다칩 모듈 구조 |
KR100492697B1 (ko) * | 2002-11-14 | 2005-06-07 | 학교법인 한국정보통신학원 | 조립형 렌즈를 이용한 광 연결 방법 |
DE10314495B3 (de) * | 2003-03-27 | 2004-12-16 | Infineon Technologies Ag | Optische Koppeleinheit |
US7452140B2 (en) * | 2003-07-16 | 2008-11-18 | Ibiden Co., Ltd. | Protective sealing of optoelectronic modules |
JP2005115346A (ja) | 2003-09-17 | 2005-04-28 | Fujitsu Ltd | 光導波路構造体及び光モジュール |
KR100583646B1 (ko) * | 2003-12-24 | 2006-05-26 | 한국전자통신연구원 | 병렬 광접속 모듈용 광접속 장치 및 이를 이용한 병렬광접속 모듈 |
JP5240821B2 (ja) * | 2005-02-28 | 2013-07-17 | 日本電気株式会社 | 2次元アレイ状光素子と光回路の接続構造 |
CN101176024B (zh) * | 2005-05-19 | 2010-10-27 | 株式会社藤仓 | 连接器座、带连接器座的光电转换器、光连接器固定结构、以及连接器座的组装方法 |
KR100696178B1 (ko) * | 2005-09-13 | 2007-03-20 | 한국전자통신연구원 | 광 도파로 마스터 및 그 제조 방법 |
US7492982B2 (en) * | 2006-02-06 | 2009-02-17 | Samsung Electronics Co., Ltd. | Optical module |
KR100770853B1 (ko) | 2006-02-09 | 2007-10-26 | 삼성전자주식회사 | 광 모듈 |
KR100848543B1 (ko) * | 2006-09-27 | 2008-07-25 | 한국전자통신연구원 | 광송수신 소자의 광 연결 방법 및 그 광 연결 구조물 |
KR100871252B1 (ko) * | 2007-01-19 | 2008-11-28 | 삼성전자주식회사 | 광섬유를 이용한 광/전기 배선을 갖는 연성 인쇄회로기판 |
JP5106348B2 (ja) | 2008-10-28 | 2012-12-26 | 日東電工株式会社 | 光電気混載モジュールの製造方法およびそれによって得られた光電気混載モジュール |
US11262605B2 (en) * | 2017-08-31 | 2022-03-01 | Lightwave Logic Inc. | Active region-less polymer modulator integrated on a common PIC platform and method |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03290606A (ja) * | 1990-04-09 | 1991-12-20 | Fujitsu Ltd | 光半導体装置 |
JPH04152584A (ja) * | 1990-10-16 | 1992-05-26 | Ricoh Co Ltd | 光電子集積デバイス及びその製造方法 |
JPH06222230A (ja) * | 1993-01-26 | 1994-08-12 | Nippon Telegr & Teleph Corp <Ntt> | フレキシブル電気・光配線回路モジュールとその製造方法 |
JPH06223402A (ja) * | 1992-10-15 | 1994-08-12 | Eastman Kodak Co | 集積化された電気光学導波路装置 |
JPH07168039A (ja) * | 1993-12-15 | 1995-07-04 | Ricoh Co Ltd | 光導波路デバイス |
JPH0832046A (ja) * | 1994-07-14 | 1996-02-02 | Hitachi Ltd | 光電子集積化素子 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4756590A (en) * | 1985-09-03 | 1988-07-12 | American Telephone And Telegraph Company, At&T Bell Laboratories | Optical component package |
JPH0448674A (ja) | 1990-06-14 | 1992-02-18 | Rohm Co Ltd | 半導体レーザ |
US5125054A (en) | 1991-07-25 | 1992-06-23 | Motorola, Inc. | Laminated polymer optical waveguide interface and method of making same |
SE513183C2 (sv) * | 1994-03-18 | 2000-07-24 | Ericsson Telefon Ab L M | Förfarande för framställning av en optokomponent samt kapslad optokomponent |
DE19616969A1 (de) * | 1996-04-27 | 1997-10-30 | Bosch Gmbh Robert | Optische Baugruppe zur Ankopplung eines Lichtwellenleiters und Verfahren zur Herstellung derselben |
DE19714170C1 (de) * | 1997-03-21 | 1998-07-30 | Siemens Ag | Elektrooptisches Modul |
-
1999
- 1999-07-22 KR KR10-2000-7003642A patent/KR100489147B1/ko not_active IP Right Cessation
- 1999-07-22 US US09/509,669 patent/US6793405B1/en not_active Expired - Fee Related
- 1999-07-22 WO PCT/JP1999/003927 patent/WO2000008505A1/ja not_active Application Discontinuation
- 1999-07-22 EP EP99931488A patent/EP1020747A4/en not_active Withdrawn
- 1999-07-22 CN CN99801754.XA patent/CN1287624A/zh active Pending
- 1999-07-28 TW TW088112827A patent/TW432236B/zh not_active IP Right Cessation
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03290606A (ja) * | 1990-04-09 | 1991-12-20 | Fujitsu Ltd | 光半導体装置 |
JPH04152584A (ja) * | 1990-10-16 | 1992-05-26 | Ricoh Co Ltd | 光電子集積デバイス及びその製造方法 |
JPH06223402A (ja) * | 1992-10-15 | 1994-08-12 | Eastman Kodak Co | 集積化された電気光学導波路装置 |
JPH06222230A (ja) * | 1993-01-26 | 1994-08-12 | Nippon Telegr & Teleph Corp <Ntt> | フレキシブル電気・光配線回路モジュールとその製造方法 |
JPH07168039A (ja) * | 1993-12-15 | 1995-07-04 | Ricoh Co Ltd | 光導波路デバイス |
JPH0832046A (ja) * | 1994-07-14 | 1996-02-02 | Hitachi Ltd | 光電子集積化素子 |
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7217957B2 (en) | 2002-02-14 | 2007-05-15 | Sumitomo Electric Industries, Ltd. | Optical transmission module |
US7257297B2 (en) | 2002-06-18 | 2007-08-14 | Seiko Epson Corporation | Optical communication module with particular fiber guide hole, optical-communication-module production method, and electronic device |
JP4506216B2 (ja) * | 2004-03-16 | 2010-07-21 | ソニー株式会社 | 光結合装置及びその製造方法 |
JP2005265885A (ja) * | 2004-03-16 | 2005-09-29 | Sony Corp | 光結合装置、光結合装置用の支持体、及びこれらの製造方法 |
JP2006323316A (ja) * | 2005-05-20 | 2006-11-30 | Sumitomo Bakelite Co Ltd | 光導波路構造体 |
JP2006323317A (ja) * | 2005-05-20 | 2006-11-30 | Sumitomo Bakelite Co Ltd | 光導波路構造体 |
US7248768B2 (en) | 2005-09-30 | 2007-07-24 | Doosan Corporation | Optical interconnection module and method of manufacturing the same |
JP2007156026A (ja) * | 2005-12-02 | 2007-06-21 | Kyocera Corp | 光配線モジュール |
US8045829B2 (en) | 2005-12-02 | 2011-10-25 | Kyocera Corporation | Optical waveguide member, optical wiring board, optical wiring module and method for manufacturing optical waveguide member and optical wiring board |
JP4668049B2 (ja) * | 2005-12-02 | 2011-04-13 | 京セラ株式会社 | 光配線モジュール |
JP2007178950A (ja) * | 2005-12-28 | 2007-07-12 | Kyocera Corp | 光配線基板および光配線モジュール |
JP2008065287A (ja) * | 2006-08-10 | 2008-03-21 | Matsushita Electric Works Ltd | 光電気変換装置 |
US8575529B2 (en) | 2006-08-10 | 2013-11-05 | Panasonic Corporation | Photoelectric converter providing a waveguide along the surface of the mount substrate |
JP2008176071A (ja) * | 2007-01-18 | 2008-07-31 | Omron Corp | 光伝送モジュール、電子機器、及び光伝送モジュールの製造方法 |
JP2008216712A (ja) * | 2007-03-06 | 2008-09-18 | Furukawa Electric Co Ltd:The | 光部品の実装方法 |
JP2009145817A (ja) * | 2007-12-18 | 2009-07-02 | Toppan Printing Co Ltd | 光基板およびその製造方法 |
JP2009163178A (ja) * | 2008-01-10 | 2009-07-23 | Hitachi Cable Ltd | 光素子と基板との接合構造及び光送受信モジュール並びに光モジュールの製造方法 |
JP2009223340A (ja) * | 2009-07-06 | 2009-10-01 | Mitsubishi Electric Corp | 光学部品、およびそれに用いられる光路変換デバイス |
JP2010061171A (ja) * | 2009-12-16 | 2010-03-18 | Sony Corp | 光結合装置及びその製造方法 |
JP2017194579A (ja) * | 2016-04-21 | 2017-10-26 | 日本電信電話株式会社 | 光電子集積回路の実装方法 |
Also Published As
Publication number | Publication date |
---|---|
KR100489147B1 (ko) | 2005-05-17 |
EP1020747A1 (en) | 2000-07-19 |
US6793405B1 (en) | 2004-09-21 |
EP1020747A4 (en) | 2003-01-02 |
KR20010024407A (ko) | 2001-03-26 |
TW432236B (en) | 2001-05-01 |
CN1287624A (zh) | 2001-03-14 |
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