WO2000017924A2 - Method and device for buried chips - Google Patents
Method and device for buried chips Download PDFInfo
- Publication number
- WO2000017924A2 WO2000017924A2 PCT/SE1999/001643 SE9901643W WO0017924A2 WO 2000017924 A2 WO2000017924 A2 WO 2000017924A2 SE 9901643 W SE9901643 W SE 9901643W WO 0017924 A2 WO0017924 A2 WO 0017924A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- connecting means
- carrier
- dielectric layer
- main surface
- contact points
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/19—Manufacturing methods of high density interconnect preforms
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/12105—Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
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- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/241—Disposition
- H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/24227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73267—Layer and HDI connectors
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- H01L2924/01006—Carbon [C]
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- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
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- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H01L2924/1904—Component type
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- H01L2924/30105—Capacitance
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- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP99951342A EP1116268A2 (en) | 1998-09-21 | 1999-09-21 | Method and device for buried chips |
AU63799/99A AU6379999A (en) | 1998-09-21 | 1999-09-21 | Method and device for buried chips |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9803204-8 | 1998-09-21 | ||
SE9803204A SE514529C2 (en) | 1998-09-21 | 1998-09-21 | Method and apparatus for buried electronics components |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2000017924A2 true WO2000017924A2 (en) | 2000-03-30 |
WO2000017924A3 WO2000017924A3 (en) | 2000-08-17 |
Family
ID=20412669
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/SE1999/001643 WO2000017924A2 (en) | 1998-09-21 | 1999-09-21 | Method and device for buried chips |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1116268A2 (en) |
AU (1) | AU6379999A (en) |
SE (1) | SE514529C2 (en) |
WO (1) | WO2000017924A2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6690583B1 (en) | 1999-05-19 | 2004-02-10 | Telefonaktiebolaget Lm Ericsson (Publ) | Carrier for electronic components |
WO2012011933A1 (en) | 2010-07-23 | 2012-01-26 | Tessera, Inc. | Microelectronic elements with post-assembly planarization |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS577147A (en) * | 1980-06-17 | 1982-01-14 | Citizen Watch Co Ltd | Mounting construction of semiconductor device |
GB2313713A (en) * | 1996-05-31 | 1997-12-03 | Nec Corp | High-density mounting method for and structure of electronic circuit board |
US5745984A (en) * | 1995-07-10 | 1998-05-05 | Martin Marietta Corporation | Method for making an electronic module |
-
1998
- 1998-09-21 SE SE9803204A patent/SE514529C2/en not_active IP Right Cessation
-
1999
- 1999-09-21 WO PCT/SE1999/001643 patent/WO2000017924A2/en active Application Filing
- 1999-09-21 EP EP99951342A patent/EP1116268A2/en not_active Withdrawn
- 1999-09-21 AU AU63799/99A patent/AU6379999A/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS577147A (en) * | 1980-06-17 | 1982-01-14 | Citizen Watch Co Ltd | Mounting construction of semiconductor device |
US5745984A (en) * | 1995-07-10 | 1998-05-05 | Martin Marietta Corporation | Method for making an electronic module |
GB2313713A (en) * | 1996-05-31 | 1997-12-03 | Nec Corp | High-density mounting method for and structure of electronic circuit board |
Non-Patent Citations (2)
Title |
---|
PATENT ABSTRACTS OF JAPAN & JP 57 007 147 A (CITIZEN WATCH CO LTD) 14 January 1982 * |
See also references of EP1116268A2 * |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6690583B1 (en) | 1999-05-19 | 2004-02-10 | Telefonaktiebolaget Lm Ericsson (Publ) | Carrier for electronic components |
WO2012011933A1 (en) | 2010-07-23 | 2012-01-26 | Tessera, Inc. | Microelectronic elements with post-assembly planarization |
US9659812B2 (en) | 2010-07-23 | 2017-05-23 | Tessera, Inc. | Microelectronic elements with post-assembly planarization |
EP2596689A4 (en) * | 2010-07-23 | 2017-07-26 | Tessera, Inc. | Microelectronic elements with post-assembly planarization |
US9966303B2 (en) | 2010-07-23 | 2018-05-08 | Tessera, Inc. | Microelectronic elements with post-assembly planarization |
US10559494B2 (en) | 2010-07-23 | 2020-02-11 | Tessera, Inc. | Microelectronic elements with post-assembly planarization |
Also Published As
Publication number | Publication date |
---|---|
SE514529C2 (en) | 2001-03-05 |
SE9803204L (en) | 2000-03-22 |
EP1116268A2 (en) | 2001-07-18 |
AU6379999A (en) | 2000-04-10 |
WO2000017924A3 (en) | 2000-08-17 |
SE9803204D0 (en) | 1998-09-21 |
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