WO2000019445B1 - Read/write buffers for complete hiding of the refresh of a semiconductor memory and method of operating same - Google Patents

Read/write buffers for complete hiding of the refresh of a semiconductor memory and method of operating same

Info

Publication number
WO2000019445B1
WO2000019445B1 PCT/US1999/022894 US9922894W WO0019445B1 WO 2000019445 B1 WO2000019445 B1 WO 2000019445B1 US 9922894 W US9922894 W US 9922894W WO 0019445 B1 WO0019445 B1 WO 0019445B1
Authority
WO
WIPO (PCT)
Prior art keywords
memory
refresh
buffer
bank
memory device
Prior art date
Application number
PCT/US1999/022894
Other languages
French (fr)
Other versions
WO2000019445A1 (en
Inventor
Wingyu Leung
Fu-Chieh Hsu
Original Assignee
Monolithic System Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/405,607 external-priority patent/US6415353B1/en
Application filed by Monolithic System Tech Inc filed Critical Monolithic System Tech Inc
Priority to DE69913366T priority Critical patent/DE69913366T2/en
Priority to JP2000572859A priority patent/JP4025509B2/en
Priority to EP99950102A priority patent/EP1119862B1/en
Publication of WO2000019445A1 publication Critical patent/WO2000019445A1/en
Publication of WO2000019445B1 publication Critical patent/WO2000019445B1/en

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/406Management or control of the refreshing or charge-regeneration cycles
    • G11C11/40618Refresh operations over multiple banks or interleaving
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F12/00Accessing, addressing or allocating within memory systems or architectures
    • G06F12/02Addressing or allocation; Relocation
    • G06F12/08Addressing or allocation; Relocation in hierarchically structured memory systems, e.g. virtual memory systems
    • G06F12/0802Addressing of a memory level in which the access to the desired data or data block requires associative addressing means, e.g. caches
    • G06F12/0893Caches characterised by their organisation or structure
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/005Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor comprising combined but independently operative RAM-ROM, RAM-PROM, RAM-EPROM cells
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/406Management or control of the refreshing or charge-regeneration cycles
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2212/00Indexing scheme relating to accessing, addressing or allocation within memory systems or architectures
    • G06F2212/30Providing cache or TLB in specific location of a processing system
    • G06F2212/304In main memory subsystem
    • G06F2212/3042In main memory subsystem being part of a memory device, e.g. cache DRAM

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Dram (AREA)
  • Static Random-Access Memory (AREA)
  • Memory System Of A Hierarchy Structure (AREA)

Abstract

A method and apparatus for handling the refresh of a DRAM array or other memory array requiring periodic refresh operations so that the refresh does not require explicit control signaling nor handshake communication between the memory array and the memory controller. The method and apparatus handles external accesses and refresh operations such that the refresh operations do not interfere with the external accesses under any conditions. As a result, an SRAM compatible device can be built from DRAM or 1-Transistor cells. A multi-bank refresh scheme is used to cut down the number of collisions between memory refresh operations and memory data access operations. A read buffer is used to buffer read data, thereby allowing memory refresh operations to be performed when consecutive read accesses hit the address range of a particular memory bank for a long period of time. A write buffer is used to buffer write data, thereby allowing memory refresh operations to be performed when consecutive write accesses hit the address range of a particular memory bank for a long period of time. Both the read buffer and the write buffer can be constructed of DRAM cells.

Claims

- 98 -AMENDED CLAIMS treceived by the International Bureau on 30 March 2000 (30.03.00); original claims 1, 3, 6, 7, 10, 14 and 25 amended; original claim 2 cancelled; remaining claims unchanged (7 pages)]
1. A memory device comprising: a plurality of memory cells configured in a plurality of banks, wherein each of the memory cells must be refreshed within a predetermined refresh period to retain a data value; and a control circuit for accessing and refreshing the memory cells, the control circuit being configured to enable the memory cells to be randomly accessed during each memory cycle without any delays for refresh operations, the control circuit being configured to perform a refresh operation to a bank only if the bank has no pending external access request, and the control circuit being configured to always refresh all of the memory cells within the predetermined refresh period.
Claim 2 cancelled.
3. The memory device of Claim 1, wherein the control circuit comprises a static random access memory (SRAM) cache.
4. The memory device of Claim 3, wherein the SRAM cache implements a write-back policy.
5. The memory device of Claim 3, wherein the SRAM cache is configured as a direct map cache.
6. The memory device of Claim 1, wherein the control circuit comprises circuitry for independently controlling refresh operations within each bank.
- 99 - 7. The memory device of Claim 3, wherein the SRAM cache has a capacity sufficient to ensure that each of the multiple banks is refreshed properly within the refresh period.
8. The memory device of Claim 3, further comprising: a read buffer, wherein the banks are coupled to the read buffer in parallel, and wherein data read from any one of the banks is provided to the read buffer; and a cache write buffer coupled between the SRAM cache and the read buffer.
9. The memory device of Claim 3, further comprising: a write buffer, wherein the banks are coupled to the write buffer in parallel, and wherein data is written from the write buffer to any one of the banks; and a cache read buffer coupled between the SRAM cache and the write buffer.
10. The memory device of Claim 1, further comprising: a read buffer coupled to the banks and the control circuit, wherein the read buffer has a capacity greater than or equal to the capacity of a bank minus one row of memory cells; and a write buffer coupled to the banks and the control circuit, wherein the write buffer has a capacity greater than or equal to the capacity of a bank minus one row of memory cells.
11. The memory device of Claim 10, further comprising: a write-only port that couples the write buffer to the banks; and a read-write port that couples the read buffer to the banks.
12. The memory device of Claim 10, wherein the read buffer and the write buffer are constructed from static random access memory (SRAM) cells.
13. The memory device of Claim 10, wherein the read buffer and the write buffer are constructed from dynamic random access memory (DRAM) cells.
14. The memory device of Claim 1, further comprising: a plurality of access control circuits, wherein each of the access control circuits is associated with one of the banks, each access control circuit enabling a refresh operation in its associated bank only when there is a refresh pending in the associated bank and there is no access requirement to the associated bank; a central refresh timer for periodically asserting a refresh request signal; and daisy-chained connections extending between the access control circuits, wherein the daisy-chain connections sequentially pass the refresh request signal to the access control circuits in response to a clock signal.
15. The memory device of Claim 14, further comprising a refresh address generator for generating a - 101 - refresh address, the refresh address generator being coupled in parallel to all of the access control circuits, wherein the refresh address generator increments the refresh address in response to the refresh request signal.
16. The memory device of Claim 14, further comprising: a read buffer; and a write buffer, wherein the daisy-chained connections extend to the read buffer and write buffer, such that the daisy-chain connections sequentially pass the refresh request signal to the read buffer and write buffer in response to the clock signal.
17. A memory device comprising: a plurality of memory cells configured in a plurality of banks, wherein the memory cells must be periodically refreshed to retain data values, and wherein each of the banks includes a plurality of rows and columns of memory cells; a memory controller for controlling the accessing and refreshing of the memory cells such that the refreshing of the memory cells does not interfere with any external read accesses to the memory cells; and a read buffer coupled to the banks and the memory controller, wherein the read buffer has a capacity greater than or equal to the capacity of a bank minus one row of memory cells.
18. The memory device of Claim 17, wherein the read buffer is constructed from static random access memory (SRAM) cells.
19. The memory device of Claim 17, wherein the read buffer is constructed from dynamic random access memory (DRAM) cells.
20. The memory device of Claim 17, wherein the read buffer includes a plurality of entries for storing data values, and wherein the memory controller further comprises: a read buffer bank address memory for storing an address of a bank associated with valid data currently stored in one or more entries of the read buffer; and a read buffer valid bit memory for storing a plurality of valid indicator bits, wherein each of the entries of the read buffer is associated with a corresponding one of the valid indicator bits.
21. A memory device comprising: a plurality of memory cells configured in a plurality of banks, wherein the memory cells must be periodically refreshed to retain data values, and wherein each of the banks includes a plurality of rows and columns of memory cells; a memory controller for controlling the accessing and refreshing of the memory cells such that the refreshing of the memory cells does not interfere with any external write accesses to the memory cells; and - 103 - a write buffer coupled to the banks and the memory controller, wherein the write buffer has a capacity greater than or equal to the capacity of a bank minus one row of memory cells.
22. The memory device of Claim 21, wherein the write buffer is constructed from static random access memory (SRAM) cells.
23. The memory device of Claim 21, wherein the write buffer is constructed from dynamic random access memory (DRAM) cells.
24. The memory device of Claim 21, wherein the write buffer includes a plurality of entries for storing data values, and wherein the memory controller further comprises: a write buffer bank address memory for storing an address of a bank associated with valid data currently stored in one or more entries of the write buffer; and a write buffer valid bit memory for storing a plurality of valid indicator bits, wherein each of the entries of the write buffer is associated with a corresponding one of the valid indicator bits.
25. A method of operating a multi-bank memory comprising a plurality of memory cells that each must be refreshed within a predetermined refresh period to retain a data value, the method comprising the steps of: receiving external access requests to the multi-bank memory; - 104 - generating refresh requests within the multi- bank memory; immediately processing each of the external access requests; and processing a refresh request to a bank of the multi-bank memory only if the bank has no pending external access request, whereby all of the memory cells are always refreshed within the predetermined refresh period. I I I I / I I I I I I /
PCT/US1999/022894 1998-10-01 1999-10-01 Read/write buffers for complete hiding of the refresh of a semiconductor memory and method of operating same WO2000019445A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE69913366T DE69913366T2 (en) 1998-10-01 1999-10-01 READ / WRITE BUFFERS FOR A COMPLETE COVERING OF THE SEMI-FINISHING OF A SEMICONDUCTOR MEMORY AND METHOD FOR OPERATING THE SAME
JP2000572859A JP4025509B2 (en) 1998-10-01 1999-10-01 Read / write buffer which is completely unaffected by refresh of semiconductor memory and its operation method
EP99950102A EP1119862B1 (en) 1998-10-01 1999-10-01 Read/write buffers for complete hiding of the refresh of a semiconductor memory and method of operating same

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US09/165,228 1998-10-01
US09/165,228 US5999474A (en) 1998-10-01 1998-10-01 Method and apparatus for complete hiding of the refresh of a semiconductor memory
US09/405,607 1999-09-24
US09/405,607 US6415353B1 (en) 1998-10-01 1999-09-24 Read/write buffers for complete hiding of the refresh of a semiconductor memory and method of operating same

Publications (2)

Publication Number Publication Date
WO2000019445A1 WO2000019445A1 (en) 2000-04-06
WO2000019445B1 true WO2000019445B1 (en) 2000-05-25

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Country Status (6)

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US (2) US5999474A (en)
EP (1) EP1119862B1 (en)
JP (1) JP4025509B2 (en)
DE (1) DE69913366T2 (en)
TW (1) TW476960B (en)
WO (1) WO2000019445A1 (en)

Families Citing this family (121)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9007790D0 (en) 1990-04-06 1990-06-06 Lines Valerie L Dynamic memory wordline driver scheme
US5796673A (en) 1994-10-06 1998-08-18 Mosaid Technologies Incorporated Delay locked loop implementation in a synchronous dynamic random access memory
US6468855B2 (en) * 1998-08-14 2002-10-22 Monolithic System Technology, Inc. Reduced topography DRAM cell fabricated using a modified logic process and method for operating same
US6370073B2 (en) * 1998-10-01 2002-04-09 Monlithic System Technology, Inc. Single-port multi-bank memory system having read and write buffers and method of operating same
US6707743B2 (en) 1998-10-01 2004-03-16 Monolithic System Technology, Inc. Method and apparatus for completely hiding refresh operations in a DRAM device using multiple clock division
US6898140B2 (en) 1998-10-01 2005-05-24 Monolithic System Technology, Inc. Method and apparatus for temperature adaptive refresh in 1T-SRAM compatible memory using the subthreshold characteristics of MOSFET transistors
US6504780B2 (en) 1998-10-01 2003-01-07 Monolithic System Technology, Inc. Method and apparatus for completely hiding refresh operations in a dram device using clock division
US6415353B1 (en) * 1998-10-01 2002-07-02 Monolithic System Technology, Inc. Read/write buffers for complete hiding of the refresh of a semiconductor memory and method of operating same
US5999474A (en) 1998-10-01 1999-12-07 Monolithic System Tech Inc Method and apparatus for complete hiding of the refresh of a semiconductor memory
US6496437B2 (en) 1999-01-20 2002-12-17 Monolithic Systems Technology, Inc. Method and apparatus for forcing idle cycles to enable refresh operations in a semiconductor memory
US6222785B1 (en) * 1999-01-20 2001-04-24 Monolithic System Technology, Inc. Method and apparatus for refreshing a semiconductor memory using idle memory cycles
US6356485B1 (en) 1999-02-13 2002-03-12 Integrated Device Technology, Inc. Merging write cycles by comparing at least a portion of the respective write cycle addresses
JP3807582B2 (en) 1999-02-18 2006-08-09 株式会社ルネサステクノロジ Information processing apparatus and semiconductor device
JP2000251467A (en) * 1999-03-02 2000-09-14 Nec Ibaraki Ltd Memory refresh controller and control method therefor
DE60012081T2 (en) * 1999-05-11 2004-11-18 Fujitsu Ltd., Kawasaki Non-volatile semiconductor memory device that allows a data read operation during a data write / erase operation
TW522399B (en) 1999-12-08 2003-03-01 Hitachi Ltd Semiconductor device
US6553552B1 (en) * 2000-01-27 2003-04-22 National Semiconductor Corporation Method of designing an integrated circuit memory architecture
US6151236A (en) * 2000-02-29 2000-11-21 Enhanced Memory Systems, Inc. Enhanced bus turnaround integrated circuit dynamic random access memory device
US6430098B1 (en) 2000-05-16 2002-08-06 Broadcom Corporation Transparent continuous refresh RAM cell architecture
JP2001332084A (en) * 2000-05-22 2001-11-30 Fujitsu Ltd Semiconductor memory and refreshing method for semiconductor memory
JP3871853B2 (en) * 2000-05-26 2007-01-24 株式会社ルネサステクノロジ Semiconductor device and operation method thereof
US6552923B2 (en) * 2000-06-13 2003-04-22 Texas Instruments Incorporated SRAM with write-back on read
JP3531592B2 (en) 2000-07-21 2004-05-31 セイコーエプソン株式会社 Semiconductor devices and electronic equipment
US6445636B1 (en) * 2000-08-17 2002-09-03 Micron Technology, Inc. Method and system for hiding refreshes in a dynamic random access memory
US6862654B1 (en) * 2000-08-17 2005-03-01 Micron Technology, Inc. Method and system for using dynamic random access memory as cache memory
US6941415B1 (en) * 2000-08-21 2005-09-06 Micron Technology, Inc. DRAM with hidden refresh
US6779076B1 (en) 2000-10-05 2004-08-17 Micron Technology, Inc. Method and system for using dynamic random access memory as cache memory
JP2002140890A (en) * 2000-10-31 2002-05-17 Hitachi Ltd Semiconductor device
JP3938842B2 (en) * 2000-12-04 2007-06-27 富士通株式会社 Semiconductor memory device
KR100367690B1 (en) * 2000-12-04 2003-01-14 (주)실리콘세븐 Asynchronous SRAM using DRAM cell and Operating Method thereof
US6366516B1 (en) 2000-12-29 2002-04-02 Intel Corporation Memory subsystem employing pool of refresh candidates
KR100381615B1 (en) * 2001-01-04 2003-04-26 (주)실리콘세븐 SRAM Compatible Memory For Complete Hiding of The Refresh Operation Using a DRAM Cache Memory
JP2004288226A (en) * 2001-03-30 2004-10-14 Internatl Business Mach Corp <Ibm> Dram and dram refresh method
US7085186B2 (en) * 2001-04-05 2006-08-01 Purple Mountain Server Llc Method for hiding a refresh in a pseudo-static memory
US6829682B2 (en) * 2001-04-26 2004-12-07 International Business Machines Corporation Destructive read architecture for dynamic random access memories
KR100394587B1 (en) * 2001-05-19 2003-08-14 (주)실리콘세븐 Refresh circuit in sram using dram cell
KR100394322B1 (en) * 2001-05-19 2003-08-09 (주)이엠엘에스아이 Sram using dram cell capable of controlling refresh operation of the dram
KR100401235B1 (en) * 2001-05-22 2003-10-17 (주)실리콘세븐 Row control circuit in sram using dram cell
JP4768163B2 (en) * 2001-08-03 2011-09-07 富士通セミコンダクター株式会社 Semiconductor memory
JP3985889B2 (en) * 2001-08-08 2007-10-03 株式会社ルネサステクノロジ Semiconductor device
US6757784B2 (en) * 2001-09-28 2004-06-29 Intel Corporation Hiding refresh of memory and refresh-hidden memory
US7333388B2 (en) * 2001-10-03 2008-02-19 Infineon Technologies Aktiengesellschaft Multi-port memory cells
TW533413B (en) * 2001-10-11 2003-05-21 Cascade Semiconductor Corp Asynchronous hidden refresh of semiconductor memory
WO2003032170A1 (en) 2001-10-11 2003-04-17 Cascade Semiconductor Corporation Asynchronous hidden refresh of semiconductor memory
US6643205B2 (en) * 2001-10-23 2003-11-04 Coremagic, Inc. Apparatus and method for refresh and data input device in SRAM having storage capacitor cell
US6882562B2 (en) * 2001-11-01 2005-04-19 Agilent Technologies, Inc. Method and apparatus for providing pseudo 2-port RAM functionality using a 1-port memory cell
US6643732B1 (en) 2001-11-14 2003-11-04 Etron Technology, Inc. Delayed read/write scheme for SRAM interface compatible DRAM
US6748497B1 (en) * 2001-11-20 2004-06-08 Cirrus Logic, Inc. Systems and methods for buffering memory transactions
US20030097519A1 (en) * 2001-11-21 2003-05-22 Yoon Ha Ryong Memory subsystem
JP4249412B2 (en) * 2001-12-27 2009-04-02 Necエレクトロニクス株式会社 Semiconductor memory device
US6638813B1 (en) 2002-01-29 2003-10-28 Taiwan Semiconductor Manufacturing Company Method of forming a composite spacer to eliminate polysilicon stringers between elements in a pseudo SRAM cell
EP1345234A1 (en) * 2002-03-11 2003-09-17 STMicroelectronics S.r.l. Semiconductor memory with self-refresh capability
US6906978B2 (en) * 2002-03-19 2005-06-14 Intel Corporation Flexible integrated memory
JP2003282823A (en) * 2002-03-26 2003-10-03 Toshiba Corp Semiconductor integrated circuit
US7146454B1 (en) * 2002-04-16 2006-12-05 Cypress Semiconductor Corporation Hiding refresh in 1T-SRAM architecture
US6741515B2 (en) * 2002-06-18 2004-05-25 Nanoamp Solutions, Inc. DRAM with total self refresh and control circuit
US7043599B1 (en) * 2002-06-20 2006-05-09 Rambus Inc. Dynamic memory supporting simultaneous refresh and data-access transactions
KR100455393B1 (en) * 2002-08-12 2004-11-06 삼성전자주식회사 Semiconductor memory device and semiconductor memory system with outputting refresh flag
KR100481819B1 (en) * 2002-08-27 2005-04-11 (주)실리콘세븐 SRAM compatible and Synchronous Memory Device being controlled by a signal, the signal activating in Chip disable period
US20040064657A1 (en) * 2002-09-27 2004-04-01 Muraleedhara Navada Memory structure including information storage elements and associated validity storage elements
KR100482380B1 (en) * 2002-11-11 2005-04-14 (주)실리콘세븐 SRAM compatable memory having memory banks capable of indepedently writing access and Operating Method thereof
US7073026B2 (en) * 2002-11-26 2006-07-04 Advanced Micro Devices, Inc. Microprocessor including cache memory supporting multiple accesses per cycle
US6795364B1 (en) * 2003-02-28 2004-09-21 Monolithic System Technology, Inc. Method and apparatus for lengthening the data-retention time of a DRAM device in standby mode
JP2004310879A (en) * 2003-04-04 2004-11-04 Renesas Technology Corp Semiconductor memory device
JP4241175B2 (en) 2003-05-09 2009-03-18 株式会社日立製作所 Semiconductor device
DE10329369B4 (en) * 2003-06-30 2010-01-28 Qimonda Ag Circuit and method for refreshing memory cells of a dynamic memory
US20050067934A1 (en) * 2003-09-26 2005-03-31 Ishikawajima-Harima Heavy Industries Co., Ltd. Discharge apparatus, plasma processing method and solar cell
US6985398B2 (en) 2003-09-26 2006-01-10 Infineon Technologies Ag Memory device having multiple array structure for increased bandwidth
US6859407B1 (en) * 2004-01-14 2005-02-22 Infineon Technologies Ag Memory with auto refresh to designated banks
WO2005076137A1 (en) * 2004-02-05 2005-08-18 Research In Motion Limited Memory controller interface
US20050226079A1 (en) * 2004-04-08 2005-10-13 Yiming Zhu Methods and apparatus for dual port memory devices having hidden refresh and double bandwidth
US8122187B2 (en) * 2004-07-02 2012-02-21 Qualcomm Incorporated Refreshing dynamic volatile memory
KR100564633B1 (en) 2004-09-25 2006-03-28 삼성전자주식회사 Semiconductor memory device having improved operation performance and access control method of the same
KR100652380B1 (en) * 2004-10-25 2006-12-01 삼성전자주식회사 Memory device for refreshing using buffer and method thereof
US7307912B1 (en) * 2004-10-25 2007-12-11 Lattice Semiconductor Corporation Variable data width memory systems and methods
KR100607334B1 (en) * 2004-12-30 2006-08-01 주식회사 하이닉스반도체 Refresh control circuit for pseudo static random access memory
US7685372B1 (en) 2005-01-13 2010-03-23 Marvell International Ltd. Transparent level 2 cache controller
US8347034B1 (en) 2005-01-13 2013-01-01 Marvell International Ltd. Transparent level 2 cache that uses independent tag and valid random access memory arrays for cache access
US7323379B2 (en) * 2005-02-03 2008-01-29 Mosys, Inc. Fabrication process for increased capacitance in an embedded DRAM memory
US7640392B2 (en) * 2005-06-23 2009-12-29 Qualcomm Incorporated Non-DRAM indicator and method of accessing data not stored in DRAM array
US7620783B2 (en) * 2005-02-14 2009-11-17 Qualcomm Incorporated Method and apparatus for obtaining memory status information cross-reference to related applications
US20060190678A1 (en) * 2005-02-22 2006-08-24 Butler Douglas B Static random access memory (SRAM) compatible, high availability memory array and method employing synchronous dynamic random access memory (DRAM) in conjunction with a single DRAM cache and tag
US7506100B2 (en) * 2005-02-23 2009-03-17 United Memories, Inc. Static random access memory (SRAM) compatible, high availability memory array and method employing synchronous dynamic random access memory (DRAM) in conjunction with a data cache and separate read and write registers and tag blocks
KR100672029B1 (en) * 2005-05-27 2007-01-19 삼성전자주식회사 Apparatus and method for reducing operation time delay generated DRAM hidden refresh operation
US7274618B2 (en) * 2005-06-24 2007-09-25 Monolithic System Technology, Inc. Word line driver for DRAM embedded in a logic process
JP4518563B2 (en) * 2005-09-02 2010-08-04 インターナショナル・ビジネス・マシーンズ・コーポレーション Semiconductor memory device
DE102005048582A1 (en) * 2005-10-06 2007-04-12 Robert Bosch Gmbh Subscriber interface between a microcontroller and a FlexRay communication module, FlexRay subscriber and method for transmitting messages via such an interface
US7349258B2 (en) * 2005-12-06 2008-03-25 Sandisk Corporation Reducing read disturb for non-volatile storage
KR101197624B1 (en) * 2006-01-18 2012-11-07 에스케이하이닉스 주식회사 Control circuit for bank of a semiconductor memory device
US20070170489A1 (en) * 2006-01-26 2007-07-26 Fang Gang-Feng Method to increase charge retention of non-volatile memory manufactured in a single-gate logic process
US7382658B2 (en) * 2006-01-26 2008-06-03 Mosys, Inc. Non-volatile memory embedded in a conventional logic process and methods for operating same
US9262326B2 (en) * 2006-08-14 2016-02-16 Qualcomm Incorporated Method and apparatus to enable the cooperative signaling of a shared bus interrupt in a multi-rank memory subsystem
US20080162869A1 (en) * 2006-12-29 2008-07-03 Intel Corporation Address hashing to help distribute accesses across portions of destructive read cache memory
US7613061B2 (en) * 2007-11-30 2009-11-03 Agere Systems Inc. Method and apparatus for idle cycle refresh request in DRAM
US8112604B2 (en) * 2007-12-17 2012-02-07 International Business Machines Corporation Tracking load store ordering hazards
US8131953B2 (en) * 2007-12-17 2012-03-06 International Business Machines Corporation Tracking store ordering hazards in an out-of-order store queue
US20090182977A1 (en) * 2008-01-16 2009-07-16 S. Aqua Semiconductor Llc Cascaded memory arrangement
JP5189887B2 (en) 2008-04-28 2013-04-24 ローム株式会社 Ferroelectric memory device and operation method thereof
JP5237731B2 (en) * 2008-09-10 2013-07-17 スパンション エルエルシー Memory system, memory device, and memory access method
US9442846B2 (en) 2009-03-17 2016-09-13 Cisco Technology, Inc. High speed memory systems and methods for designing hierarchical memory systems
US8433880B2 (en) 2009-03-17 2013-04-30 Memoir Systems, Inc. System and method for storing data in a virtualized high speed memory system
TWI425508B (en) * 2009-04-23 2014-02-01 Orise Technology Co Ltd A sram compatible embedded dram system with hidden refresh and dual port capability
US8108624B2 (en) * 2009-05-27 2012-01-31 Via Technologies, Inc. Data cache with modified bit array
US8108621B2 (en) * 2009-05-27 2012-01-31 Via Technologies, Inc. Data cache with modified bit array
US8347027B2 (en) * 2009-11-05 2013-01-01 Honeywell International Inc. Reducing power consumption for dynamic memories using distributed refresh control
WO2011075167A1 (en) * 2009-12-15 2011-06-23 Memoir Systems,Inc. System and method for reduced latency caching
US20130329553A1 (en) * 2012-06-06 2013-12-12 Mosys, Inc. Traffic metering and shaping for network packets
US9496009B2 (en) 2012-06-06 2016-11-15 Mosys, Inc. Memory with bank-conflict-resolution (BCR) module including cache
US8484418B2 (en) * 2010-10-22 2013-07-09 Intel Corporation Methods and apparatuses for idle-prioritized memory ranks
US8570790B2 (en) 2011-01-13 2013-10-29 Cypress Semiconductor Corporation Memory devices and methods for high random transaction rate
WO2013106210A1 (en) 2012-01-10 2013-07-18 Intel Corporation Electronic apparatus having parallel memory banks
US8824196B2 (en) 2012-03-30 2014-09-02 International Business Machines Corporation Single cycle data copy for two-port SRAM
US9213640B2 (en) * 2013-04-17 2015-12-15 Advanced Micro Devices, Inc. Promoting transactions hitting critical beat of cache line load requests
US9449032B2 (en) * 2013-04-22 2016-09-20 Sap Se Multi-buffering system supporting read/write access to different data source type
US10402324B2 (en) * 2013-10-31 2019-09-03 Hewlett Packard Enterprise Development Lp Memory access for busy memory by receiving data from cache during said busy period and verifying said data utilizing cache hit bit or cache miss bit
US10020045B2 (en) * 2013-11-26 2018-07-10 Micron Technology, Inc. Partial access mode for dynamic random access memory
US9916261B2 (en) * 2014-05-19 2018-03-13 Infineon Technologies Ag Randomized memory access
KR102161311B1 (en) * 2014-12-03 2020-10-05 에스케이하이닉스 주식회사 Memory controller
FR3032814B1 (en) * 2015-02-18 2018-02-02 Upmem DRAM CIRCUIT WITH INTEGRATED PROCESSOR
US10229047B2 (en) * 2016-08-06 2019-03-12 Wolley Inc. Apparatus and method of wear leveling for storage class memory using cache filtering
US11237758B2 (en) * 2016-08-06 2022-02-01 Wolley Inc. Apparatus and method of wear leveling for storage class memory using address cache

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4330852A (en) 1979-11-23 1982-05-18 Texas Instruments Incorporated Semiconductor read/write memory array having serial access
JPS58155596A (en) 1982-03-10 1983-09-16 Hitachi Ltd Dynamic type mos ram
US4625301A (en) 1983-11-30 1986-11-25 Tandy Corporation Dynamic memory refresh circuit
US4810643A (en) 1985-08-23 1989-03-07 Kirin- Amgen Inc. Production of pluripotent granulocyte colony-stimulating factor
JPH0612616B2 (en) 1986-08-13 1994-02-16 日本テキサス・インスツルメンツ株式会社 Semiconductor memory device
US5033027A (en) 1990-01-19 1991-07-16 Dallas Semiconductor Corporation Serial DRAM controller with multi generation interface
EP0492776B1 (en) * 1990-12-25 1998-05-13 Mitsubishi Denki Kabushiki Kaisha A semiconductor memory device with a large storage capacity memory and a fast speed memory
US5652723A (en) * 1991-04-18 1997-07-29 Mitsubishi Denki Kabushiki Kaisha Semiconductor memory device
JPH04372790A (en) * 1991-06-21 1992-12-25 Sharp Corp Semiconductor memory
EP0895162A3 (en) 1992-01-22 1999-11-10 Enhanced Memory Systems, Inc. Enhanced dram with embedded registers
GB2265035B (en) 1992-03-12 1995-11-22 Apple Computer Method and apparatus for improved dram refresh operations
US5471601A (en) * 1992-06-17 1995-11-28 Intel Corporation Memory device and method for avoiding live lock of a DRAM with cache
US5617551A (en) 1992-09-18 1997-04-01 New Media Corporation Controller for refreshing a PSRAM using individual automatic refresh cycles
JP3026474B2 (en) 1993-04-07 2000-03-27 株式会社東芝 Semiconductor integrated circuit
KR950014089B1 (en) 1993-11-08 1995-11-21 현대전자산업주식회사 Hidden self refresh method and device of synchronous dram
US5450364A (en) 1994-01-31 1995-09-12 Texas Instruments Incorporated Method and apparatus for production testing of self-refresh operations and a particular application to synchronous memory devices
JP3165585B2 (en) 1994-05-13 2001-05-14 シャープ株式会社 Information processing device
KR0135699B1 (en) * 1994-07-11 1998-04-24 김주용 Dual port dynamic cam cell and refresh circuit
JPH08129882A (en) * 1994-10-31 1996-05-21 Mitsubishi Electric Corp Semiconductor storage
TW358907B (en) 1994-11-22 1999-05-21 Monolithic System Tech Inc A computer system and a method of using a DRAM array as a next level cache memory
US5737748A (en) 1995-03-15 1998-04-07 Texas Instruments Incorporated Microprocessor unit having a first level write-through cache memory and a smaller second-level write-back cache memory
US5873114A (en) 1995-08-18 1999-02-16 Advanced Micro Devices, Inc. Integrated processor and memory control unit including refresh queue logic for refreshing DRAM during idle cycles
JP3352577B2 (en) 1995-12-21 2002-12-03 インターナショナル・ビジネス・マシーンズ・コーポレーション Storage device
EP0794497A3 (en) 1996-03-08 2000-10-11 Matsushita Electric Industrial Co., Ltd. Memory refresh control method and apparatus
US5748547A (en) 1996-05-24 1998-05-05 Shau; Jeng-Jye High performance semiconductor memory devices having multiple dimension bit lines
US5784705A (en) 1996-07-15 1998-07-21 Mosys, Incorporated Method and structure for performing pipeline burst accesses in a semiconductor memory
JP3706212B2 (en) * 1996-10-30 2005-10-12 沖電気工業株式会社 Memory device
US5940851A (en) 1996-11-27 1999-08-17 Monolithic Systems, Inc. Method and apparatus for DRAM refresh using master, slave and self-refresh modes
KR100243335B1 (en) * 1996-12-31 2000-02-01 김영환 Daisy chain type memory device having refresh circuit
US5822265A (en) 1997-07-29 1998-10-13 Rockwell Semiconductor Systems, Inc. DRAM controller with background refresh
US5999474A (en) 1998-10-01 1999-12-07 Monolithic System Tech Inc Method and apparatus for complete hiding of the refresh of a semiconductor memory

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