WO2000026609A3 - Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing - Google Patents

Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing Download PDF

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Publication number
WO2000026609A3
WO2000026609A3 PCT/US1999/025214 US9925214W WO0026609A3 WO 2000026609 A3 WO2000026609 A3 WO 2000026609A3 US 9925214 W US9925214 W US 9925214W WO 0026609 A3 WO0026609 A3 WO 0026609A3
Authority
WO
WIPO (PCT)
Prior art keywords
radial
chemical mechanical
substrate
layer thickness
mechanical polishing
Prior art date
Application number
PCT/US1999/025214
Other languages
French (fr)
Other versions
WO2000026609A2 (en
Inventor
Andreas Norbert Wiswesser
Walter Schoenleber
Boguslaw Swedek
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to JP2000579945A priority Critical patent/JP4335459B2/en
Publication of WO2000026609A2 publication Critical patent/WO2000026609A2/en
Publication of WO2000026609A3 publication Critical patent/WO2000026609A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/12—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with apertures for inspecting the surface to be abraded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02015—Interferometers characterised by the beam path configuration
    • G01B9/02017—Interferometers characterised by the beam path configuration with multiple interactions between the target object and light beams, e.g. beam reflections occurring from different locations
    • G01B9/02021—Interferometers characterised by the beam path configuration with multiple interactions between the target object and light beams, e.g. beam reflections occurring from different locations contacting different faces of object, e.g. opposite faces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02015—Interferometers characterised by the beam path configuration
    • G01B9/02027—Two or more interferometric channels or interferometers

Abstract

The thickness of a layer on a substrate is measured in-situ during chemical mechanical polishing. A light beam is divided through a window in a polishing pad, and the motion of the polishing pad relative to the substrate causes the light beam to move in a path across the substrate surface. An interference signal (104) produced by the light beam reflecting off the substrate is monitored, and a plurality of intensity measurements are extracted from the interference signal (104). Each intensity measurement corresponds to a sampling zone in the path across the substrate surface (106). A radial position is determined for each sampling zone (108), and the intensity measurements are divided into a plurality of radial ranges according to the radial positions (110). The layer thickness is computed for each radial range from the intensity measurements associated with that radial range (112-116).
PCT/US1999/025214 1998-11-02 1999-10-26 Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing WO2000026609A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000579945A JP4335459B2 (en) 1998-11-02 1999-10-26 Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/184,775 1998-11-02
US09/184,775 US6159073A (en) 1998-11-02 1998-11-02 Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing

Publications (2)

Publication Number Publication Date
WO2000026609A2 WO2000026609A2 (en) 2000-05-11
WO2000026609A3 true WO2000026609A3 (en) 2002-10-03

Family

ID=22678288

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/025214 WO2000026609A2 (en) 1998-11-02 1999-10-26 Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing

Country Status (4)

Country Link
US (5) US6159073A (en)
JP (2) JP4335459B2 (en)
TW (1) TW431948B (en)
WO (1) WO2000026609A2 (en)

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