WO2000031777A1 - Fast heating and cooling apparatus for semiconductor wafers - Google Patents
Fast heating and cooling apparatus for semiconductor wafers Download PDFInfo
- Publication number
- WO2000031777A1 WO2000031777A1 PCT/IB1999/001832 IB9901832W WO0031777A1 WO 2000031777 A1 WO2000031777 A1 WO 2000031777A1 IB 9901832 W IB9901832 W IB 9901832W WO 0031777 A1 WO0031777 A1 WO 0031777A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cooling
- cooling device
- temperature
- substrate holder
- semiconductor wafers
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Chemical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP99952756A EP1142001B1 (en) | 1998-11-20 | 1999-11-12 | Fast heating and cooling apparatus for semiconductor wafers |
DE69937255T DE69937255T2 (en) | 1998-11-20 | 1999-11-12 | QUICK-HEATING AND COOLING DEVICE FOR SEMICONDUCTOR WAFER |
JP2000584512A JP4625183B2 (en) | 1998-11-20 | 1999-11-12 | Rapid heating and cooling equipment for semiconductor wafers |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US19728498A | 1998-11-20 | 1998-11-20 | |
US09/197,284 | 1998-11-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000031777A1 true WO2000031777A1 (en) | 2000-06-02 |
Family
ID=22728764
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB1999/001832 WO2000031777A1 (en) | 1998-11-20 | 1999-11-12 | Fast heating and cooling apparatus for semiconductor wafers |
Country Status (7)
Country | Link |
---|---|
US (2) | US6919271B2 (en) |
EP (1) | EP1142001B1 (en) |
JP (1) | JP4625183B2 (en) |
KR (1) | KR100634642B1 (en) |
DE (1) | DE69937255T2 (en) |
TW (1) | TW459270B (en) |
WO (1) | WO2000031777A1 (en) |
Cited By (6)
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JP2002176001A (en) * | 2000-12-05 | 2002-06-21 | Semiconductor Energy Lab Co Ltd | Heat treating system |
JP2002176000A (en) * | 2000-12-05 | 2002-06-21 | Semiconductor Energy Lab Co Ltd | Heat treatment apparatus and manufacturing method of semiconductor device |
WO2002099853A2 (en) * | 2001-05-31 | 2002-12-12 | Motorola, Inc., A Corporation Of The State Of Delaware | Temperature-controlled chuck and method for controlling the temperature of a substantially flat object |
JP2004503108A (en) * | 2000-07-06 | 2004-01-29 | アプライド マテリアルズ インコーポレイテッド | Heat treatment of semiconductor substrate |
US7045746B2 (en) | 2003-11-12 | 2006-05-16 | Mattson Technology, Inc. | Shadow-free shutter arrangement and method |
US8557720B2 (en) | 2010-10-28 | 2013-10-15 | Hitachi Kokusai Electric, Inc. | Substrate processing apparatus and method of manufacturing a semiconductor device |
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US7015422B2 (en) * | 2000-12-21 | 2006-03-21 | Mattson Technology, Inc. | System and process for heating semiconductor wafers by optimizing absorption of electromagnetic energy |
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US7867403B2 (en) * | 2006-06-05 | 2011-01-11 | Jason Plumhoff | Temperature control method for photolithographic substrate |
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US7901509B2 (en) | 2006-09-19 | 2011-03-08 | Momentive Performance Materials Inc. | Heating apparatus with enhanced thermal uniformity and method for making thereof |
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US8222574B2 (en) * | 2007-01-15 | 2012-07-17 | Applied Materials, Inc. | Temperature measurement and control of wafer support in thermal processing chamber |
US7946759B2 (en) * | 2007-02-16 | 2011-05-24 | Applied Materials, Inc. | Substrate temperature measurement by infrared transmission |
US7977258B2 (en) * | 2007-04-06 | 2011-07-12 | Mattson Technology, Inc. | Method and system for thermally processing a plurality of wafer-shaped objects |
KR20090001091A (en) * | 2007-06-29 | 2009-01-08 | (주)티티에스 | Semiconductor manufacturing apparatus having outside heater |
US7985945B2 (en) * | 2008-05-09 | 2011-07-26 | Applied Materials, Inc. | Method for reducing stray light in a rapid thermal processing chamber by polarization |
US8452166B2 (en) * | 2008-07-01 | 2013-05-28 | Applied Materials, Inc. | Apparatus and method for measuring radiation energy during thermal processing |
US8111978B2 (en) * | 2008-07-11 | 2012-02-07 | Applied Materials, Inc. | Rapid thermal processing chamber with shower head |
US20100193154A1 (en) * | 2009-01-28 | 2010-08-05 | Applied Materials, Inc. | Rapid cooling of a substrate by motion |
WO2010150590A1 (en) * | 2009-06-24 | 2010-12-29 | キヤノンアネルバ株式会社 | Vacuum heating/cooling apparatus and method of producing magnetoresistive element |
US9640412B2 (en) | 2009-11-20 | 2017-05-02 | Applied Materials, Inc. | Apparatus and method for enhancing the cool down of radiatively heated substrates |
EP2360291A1 (en) * | 2010-02-24 | 2011-08-24 | Singulus Technologies AG | Method and device for quick heating and cooling of a substrate and immediately coating same in a vacuum |
JP2012089591A (en) * | 2010-10-18 | 2012-05-10 | Hitachi High-Technologies Corp | Vacuum processing apparatus and vacuum processing method |
US8860424B1 (en) * | 2011-03-10 | 2014-10-14 | Solar Junction Corporation | Apparatus and method for highly accelerated life testing of solar cells |
WO2013076922A1 (en) * | 2011-11-22 | 2013-05-30 | パナソニック株式会社 | Substrate conveying roller, thin film manufacturing device, and thin film manufacturing method |
KR101673016B1 (en) * | 2013-08-27 | 2016-11-07 | 삼성디스플레이 주식회사 | Thin film encapsulation manufacturing device and manufacturing method of display apparatus using the same |
KR101846509B1 (en) * | 2017-03-29 | 2018-04-09 | (주)앤피에스 | Heater and substrate processing apparatus having the same |
CN107841727A (en) * | 2017-12-15 | 2018-03-27 | 北京创昱科技有限公司 | A kind of cooling component and vacuum coating equipment |
CN110828311B (en) * | 2018-08-08 | 2024-04-16 | 北京北方华创微电子装备有限公司 | Wafer processing method, auxiliary controller and wafer processing system |
CN110854010B (en) * | 2018-08-20 | 2022-07-22 | 北京北方华创微电子装备有限公司 | Method and device for cooling wafer and semiconductor processing equipment |
US20210337650A1 (en) * | 2018-08-24 | 2021-10-28 | Radialis Medical, Inc. | Liquid cooling system for precise temperature control of radiation detector for positron emission mammography |
GB201815815D0 (en) * | 2018-09-28 | 2018-11-14 | Metryx Ltd | Method and apparatus for controlling the temperature of a semiconductor wafer |
CN111834247B (en) * | 2019-04-23 | 2023-09-08 | 北京北方华创微电子装备有限公司 | Cooling device and semiconductor processing equipment |
KR102623544B1 (en) * | 2019-06-10 | 2024-01-10 | 삼성전자주식회사 | Wafer cleaning apparatus based on light irradiation and wafer cleaning system comprising the same |
CN111621758B (en) * | 2020-05-28 | 2022-03-29 | 中国电子科技集团公司第四十八研究所 | Wafer cooling device |
US11754510B2 (en) * | 2021-10-14 | 2023-09-12 | Samsung Electronics Co., Ltd. | Inspection system of semiconductor wafer and method of driving the same |
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WO2002099853A2 (en) * | 2001-05-31 | 2002-12-12 | Motorola, Inc., A Corporation Of The State Of Delaware | Temperature-controlled chuck and method for controlling the temperature of a substantially flat object |
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US8557720B2 (en) | 2010-10-28 | 2013-10-15 | Hitachi Kokusai Electric, Inc. | Substrate processing apparatus and method of manufacturing a semiconductor device |
Also Published As
Publication number | Publication date |
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US6919271B2 (en) | 2005-07-19 |
US7226488B2 (en) | 2007-06-05 |
EP1142001A1 (en) | 2001-10-10 |
US20040035847A1 (en) | 2004-02-26 |
JP2002530883A (en) | 2002-09-17 |
KR20010075716A (en) | 2001-08-09 |
US20050183854A1 (en) | 2005-08-25 |
KR100634642B1 (en) | 2006-10-16 |
DE69937255T2 (en) | 2008-07-03 |
DE69937255D1 (en) | 2007-11-15 |
JP4625183B2 (en) | 2011-02-02 |
TW459270B (en) | 2001-10-11 |
EP1142001B1 (en) | 2007-10-03 |
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