WO2000036525A3 - Mechanisms for making and inspecting reticles - Google Patents

Mechanisms for making and inspecting reticles Download PDF

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Publication number
WO2000036525A3
WO2000036525A3 PCT/US1999/030240 US9930240W WO0036525A3 WO 2000036525 A3 WO2000036525 A3 WO 2000036525A3 US 9930240 W US9930240 W US 9930240W WO 0036525 A3 WO0036525 A3 WO 0036525A3
Authority
WO
WIPO (PCT)
Prior art keywords
reticle
inspection
circuit design
reusable
integrated circuit
Prior art date
Application number
PCT/US1999/030240
Other languages
French (fr)
Other versions
WO2000036525A2 (en
Inventor
Lance A Glasser
Jun Ye
Shauh-Teh Juang
David S Alles
James N Wiley
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Priority to JP2000588700A priority Critical patent/JP4739527B2/en
Priority to EP99966428A priority patent/EP1141868A2/en
Publication of WO2000036525A2 publication Critical patent/WO2000036525A2/en
Publication of WO2000036525A3 publication Critical patent/WO2000036525A3/en

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Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84Inspecting

Abstract

A reusable circuit design (250, 300) for use with electronic design automation EDA tools in designing integrated circuits is disclosed, as well as reticle inspection and fabrication methods that are based on such reusable circuit design. The reusable circuit design (250, 300) is stored on a computer readable medium and contains an electronic representation of a layout pattern (260, 258, 302) for at least one layer of the circuit design on an integrated circuit. The layout pattern includes a flagged critical region which corresponds to a critical region (256, 304) on a reticle or integrated circuit that is susceptible to special inspection or fabrication procedures. In one aspect of the reusable circuit design, the special analysis is performed during one from a group consisting of reticle inspection, reticle production, integrated circuit fabrication, and fabricated integrated circuit inspection.
PCT/US1999/030240 1998-12-17 1999-12-17 Mechanisms for making and inspecting reticles WO2000036525A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2000588700A JP4739527B2 (en) 1998-12-17 1999-12-17 Mechanisms for manufacturing and inspecting reticles
EP99966428A EP1141868A2 (en) 1998-12-17 1999-12-17 Mechanisms for making and inspecting reticles

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/213,744 1998-12-17
US09/213,744 US6529621B1 (en) 1998-12-17 1998-12-17 Mechanisms for making and inspecting reticles

Publications (2)

Publication Number Publication Date
WO2000036525A2 WO2000036525A2 (en) 2000-06-22
WO2000036525A3 true WO2000036525A3 (en) 2000-10-19

Family

ID=22796329

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/030240 WO2000036525A2 (en) 1998-12-17 1999-12-17 Mechanisms for making and inspecting reticles

Country Status (4)

Country Link
US (2) US6529621B1 (en)
EP (2) EP1752897A1 (en)
JP (2) JP4739527B2 (en)
WO (1) WO2000036525A2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6757645B2 (en) 1997-09-17 2004-06-29 Numerical Technologies, Inc. Visual inspection and verification system
US8923600B2 (en) 2005-11-18 2014-12-30 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US9134254B2 (en) 2013-01-07 2015-09-15 Kla-Tencor Corp. Determining a position of inspection system output in design data space
US9170211B2 (en) 2011-03-25 2015-10-27 Kla-Tencor Corp. Design-based inspection using repeating structures
US9189844B2 (en) 2012-10-15 2015-11-17 Kla-Tencor Corp. Detecting defects on a wafer using defect-specific information
US9311698B2 (en) 2013-01-09 2016-04-12 Kla-Tencor Corp. Detecting defects on a wafer using template image matching
US9310320B2 (en) 2013-04-15 2016-04-12 Kla-Tencor Corp. Based sampling and binning for yield critical defects

Families Citing this family (103)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6453452B1 (en) 1997-12-12 2002-09-17 Numerical Technologies, Inc. Method and apparatus for data hierarchy maintenance in a system for mask description
US6578188B1 (en) 1997-09-17 2003-06-10 Numerical Technologies, Inc. Method and apparatus for a network-based mask defect printability analysis system
US6470489B1 (en) 1997-09-17 2002-10-22 Numerical Technologies, Inc. Design rule checking system and method
US6370679B1 (en) 1997-09-17 2002-04-09 Numerical Technologies, Inc. Data hierarchy layout correction and verification method and apparatus
US7617474B2 (en) 1997-09-17 2009-11-10 Synopsys, Inc. System and method for providing defect printability analysis of photolithographic masks with job-based automation
US7107571B2 (en) 1997-09-17 2006-09-12 Synopsys, Inc. Visual analysis and verification system using advanced tools
US7093229B2 (en) 1997-09-17 2006-08-15 Synopsys, Inc. System and method for providing defect printability analysis of photolithographic masks with job-based automation
US6516085B1 (en) * 1999-05-03 2003-02-04 Kla-Tencor Apparatus and methods for collecting global data during a reticle inspection
US7106895B1 (en) * 1999-05-05 2006-09-12 Kla-Tencor Method and apparatus for inspecting reticles implementing parallel processing
US6778695B1 (en) * 1999-12-23 2004-08-17 Franklin M. Schellenberg Design-based reticle defect prioritization
US6622295B1 (en) * 2000-07-05 2003-09-16 Dupont Photomasks, Inc. Network-based photomask data entry interface and instruction generator for manufacturing photomasks
US6557162B1 (en) * 2000-09-29 2003-04-29 Numerical Technologies, Inc. Method for high yield reticle formation
JP3266602B1 (en) * 2000-10-30 2002-03-18 洋一 奥寺 Address inquiry system, computer program product and method thereof
US6873720B2 (en) 2001-03-20 2005-03-29 Synopsys, Inc. System and method of providing mask defect printability analysis
US6925202B2 (en) 2001-03-20 2005-08-02 Synopsys, Inc. System and method of providing mask quality control
US6617087B1 (en) * 2001-06-27 2003-09-09 Advanced Micro Devices, Inc. Use of scatterometry to measure pattern accuracy
US6721928B2 (en) 2001-07-26 2004-04-13 Numerical Technologies, Inc. Verification utilizing instance-based hierarchy management
US6560766B2 (en) 2001-07-26 2003-05-06 Numerical Technologies, Inc. Method and apparatus for analyzing a layout using an instance-based representation
US7035448B2 (en) * 2001-08-20 2006-04-25 Hoya Corporation Method of defect inspection of graytone mask and apparatus doing the same
US7014955B2 (en) 2001-08-28 2006-03-21 Synopsys, Inc. System and method for indentifying dummy features on a mask layer
US6670082B2 (en) 2001-10-09 2003-12-30 Numerical Technologies, Inc. System and method for correcting 3D effects in an alternating phase-shifting mask
US6976240B2 (en) 2001-11-14 2005-12-13 Synopsys Inc. Simulation using design geometry information
US7236847B2 (en) 2002-01-16 2007-06-26 Kla-Tencor Technologies Corp. Systems and methods for closed loop defect reduction
WO2003066282A2 (en) 2002-02-04 2003-08-14 Kla-Tencor Technologies Corp. Systems and methods for characterizing a polishing process
US7257247B2 (en) * 2002-02-21 2007-08-14 International Business Machines Corporation Mask defect analysis system
US6966047B1 (en) * 2002-04-09 2005-11-15 Kla-Tencor Technologies Corporation Capturing designer intent in reticle inspection
US6850050B2 (en) * 2002-05-24 2005-02-01 Intel Corporation Reticle inspection
WO2004008246A2 (en) * 2002-07-12 2004-01-22 Cadence Design Systems, Inc. Method and system for context-specific mask writing
US7302672B2 (en) * 2002-07-12 2007-11-27 Cadence Design Systems, Inc. Method and system for context-specific mask writing
WO2004008245A2 (en) 2002-07-12 2004-01-22 Cadence Design Systems, Inc. Method and system for context-specific mask inspection
US6902855B2 (en) 2002-07-15 2005-06-07 Kla-Tencor Technologies Qualifying patterns, patterning processes, or patterning apparatus in the fabrication of microlithographic patterns
AU2003247868A1 (en) 2002-07-15 2004-02-02 Kla-Tencor Technologies Corp. Defect inspection methods that include acquiring aerial images of a reticle for different lithographic process variables
US6792592B2 (en) 2002-08-30 2004-09-14 Numerical Technologies, Inc. Considering mask writer properties during the optical proximity correction process
US7043071B2 (en) 2002-09-13 2006-05-09 Synopsys, Inc. Soft defect printability simulation and analysis for masks
US7379175B1 (en) 2002-10-15 2008-05-27 Kla-Tencor Technologies Corp. Methods and systems for reticle inspection and defect review using aerial imaging
US7123356B1 (en) 2002-10-15 2006-10-17 Kla-Tencor Technologies Corp. Methods and systems for inspecting reticles using aerial imaging and die-to-database detection
US7027143B1 (en) 2002-10-15 2006-04-11 Kla-Tencor Technologies Corp. Methods and systems for inspecting reticles using aerial imaging at off-stepper wavelengths
US7126699B1 (en) 2002-10-18 2006-10-24 Kla-Tencor Technologies Corp. Systems and methods for multi-dimensional metrology and/or inspection of a specimen
US7457736B2 (en) 2002-11-21 2008-11-25 Synopsys, Inc. Automated creation of metrology recipes
US6990385B1 (en) * 2003-02-03 2006-01-24 Kla-Tencor Technologies Corporation Defect detection using multiple sensors and parallel processing
US7313456B2 (en) * 2003-04-11 2007-12-25 Applied Materials, Inc. Method and apparatus for capturing and using design intent in an integrated circuit fabrication process
US9002497B2 (en) * 2003-07-03 2015-04-07 Kla-Tencor Technologies Corp. Methods and systems for inspection of wafers and reticles using designer intent data
US7135344B2 (en) * 2003-07-11 2006-11-14 Applied Materials, Israel, Ltd. Design-based monitoring
JP4414690B2 (en) * 2003-07-14 2010-02-10 株式会社日立ハイテクノロジーズ Semiconductor manufacturing system
US7024638B2 (en) * 2003-07-14 2006-04-04 Cadence Design Systems, Inc. Method for creating patterns for producing integrated circuits
US7430898B1 (en) 2003-09-04 2008-10-07 Kla-Tencor Technologies Corp. Methods and systems for analyzing a specimen using atomic force microscopy profiling in combination with an optical technique
US8151220B2 (en) * 2003-12-04 2012-04-03 Kla-Tencor Technologies Corp. Methods for simulating reticle layout data, inspecting reticle layout data, and generating a process for inspecting reticle layout data
CN100416574C (en) * 2003-12-04 2008-09-03 克拉-坦科技术股份有限公司 Methods for simulating reticle layout data, inspecting reticle layout data, and generating a process for inspecting reticle layout data
JP4758358B2 (en) * 2004-01-29 2011-08-24 ケーエルエー−テンカー コーポレイション Computer-implemented method for detecting defects in reticle design data
US9188974B1 (en) 2004-02-13 2015-11-17 Kla-Tencor Technologies Corp. Methods for improved monitor and control of lithography processes
US7788629B2 (en) * 2004-07-21 2010-08-31 Kla-Tencor Technologies Corp. Systems configured to perform a non-contact method for determining a property of a specimen
JP4904034B2 (en) * 2004-09-14 2012-03-28 ケーエルエー−テンカー コーポレイション Method, system and carrier medium for evaluating reticle layout data
WO2006075687A1 (en) * 2005-01-14 2006-07-20 Fujitsu Limited Pattern defect inspection method and semiconductor device manufacturing method
JP4679243B2 (en) * 2005-05-25 2011-04-27 株式会社東芝 Mask making method and semiconductor device manufacturing method
US7769225B2 (en) * 2005-08-02 2010-08-03 Kla-Tencor Technologies Corp. Methods and systems for detecting defects in a reticle design pattern
JP4976681B2 (en) * 2005-10-31 2012-07-18 株式会社東芝 Pattern shape evaluation method and pattern shape evaluation program
US8041103B2 (en) * 2005-11-18 2011-10-18 Kla-Tencor Technologies Corp. Methods and systems for determining a position of inspection data in design data space
US7676077B2 (en) 2005-11-18 2010-03-09 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US20070174012A1 (en) * 2006-01-25 2007-07-26 Badger Karen D Method Of Determining Photomask Inspection Capabilities
JP4899652B2 (en) * 2006-06-12 2012-03-21 富士通セミコンダクター株式会社 Exposure mask inspection apparatus, inspection method, manufacturing method, and exposure mask
JP4791267B2 (en) * 2006-06-23 2011-10-12 株式会社日立ハイテクノロジーズ Defect inspection system
US7877722B2 (en) * 2006-12-19 2011-01-25 Kla-Tencor Corp. Systems and methods for creating inspection recipes
US8194968B2 (en) * 2007-01-05 2012-06-05 Kla-Tencor Corp. Methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions
US7962863B2 (en) * 2007-05-07 2011-06-14 Kla-Tencor Corp. Computer-implemented methods, systems, and computer-readable media for determining a model for predicting printability of reticle features on a wafer
US7738093B2 (en) 2007-05-07 2010-06-15 Kla-Tencor Corp. Methods for detecting and classifying defects on a reticle
US8213704B2 (en) * 2007-05-09 2012-07-03 Kla-Tencor Corp. Methods and systems for detecting defects in a reticle design pattern
JP2008299259A (en) * 2007-06-04 2008-12-11 Dainippon Printing Co Ltd Method for determining photomask defect
US7796804B2 (en) * 2007-07-20 2010-09-14 Kla-Tencor Corp. Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer
US7711514B2 (en) * 2007-08-10 2010-05-04 Kla-Tencor Technologies Corp. Computer-implemented methods, carrier media, and systems for generating a metrology sampling plan
JP5425779B2 (en) * 2007-08-20 2014-02-26 ケーエルエー−テンカー・コーポレーション A computer-implemented method for determining whether an actual defect is a potential systematic defect or a potentially random defect
JP5022951B2 (en) * 2008-03-10 2012-09-12 株式会社日立ハイテクノロジーズ Semiconductor manufacturing system
US8139844B2 (en) * 2008-04-14 2012-03-20 Kla-Tencor Corp. Methods and systems for determining a defect criticality index for defects on wafers
JP2009300426A (en) * 2008-05-16 2009-12-24 Nuflare Technology Inc Reticle defect inspection device and reticle defect inspection method
JP2009294027A (en) * 2008-06-04 2009-12-17 Toshiba Corp Pattern inspection device and method of inspecting pattern
KR101623747B1 (en) 2008-07-28 2016-05-26 케이엘에이-텐코어 코오포레이션 Computer-implemented methods, computer-readable media, and systems for classifying defects detected in a memory device area on a wafer
JP2012511168A (en) * 2008-12-05 2012-05-17 マイクロニック マイデータ アーベー Image resampling with gradients in microlithographic printing
US8775101B2 (en) 2009-02-13 2014-07-08 Kla-Tencor Corp. Detecting defects on a wafer
US8204297B1 (en) 2009-02-27 2012-06-19 Kla-Tencor Corp. Methods and systems for classifying defects detected on a reticle
US8112241B2 (en) * 2009-03-13 2012-02-07 Kla-Tencor Corp. Methods and systems for generating an inspection process for a wafer
US8321422B1 (en) 2009-04-23 2012-11-27 Google Inc. Fast covariance matrix generation
US8396325B1 (en) 2009-04-27 2013-03-12 Google Inc. Image enhancement through discrete patch optimization
US8611695B1 (en) 2009-04-27 2013-12-17 Google Inc. Large scale patch search
US8391634B1 (en) * 2009-04-28 2013-03-05 Google Inc. Illumination estimation for images
US8385662B1 (en) 2009-04-30 2013-02-26 Google Inc. Principal component analysis based seed generation for clustering analysis
JP2011247957A (en) * 2010-05-24 2011-12-08 Toshiba Corp Pattern inspection method and semiconductor device manufacturing method
US8781781B2 (en) 2010-07-30 2014-07-15 Kla-Tencor Corp. Dynamic care areas
US8890143B2 (en) 2010-09-22 2014-11-18 Qualcomm Incorporated Method to optimize and reduce integrated circuit, package design, and verification cycle time
US8798393B2 (en) 2010-12-01 2014-08-05 Google Inc. Removing illumination variation from images
US9087367B2 (en) 2011-09-13 2015-07-21 Kla-Tencor Corp. Determining design coordinates for wafer defects
US8831334B2 (en) 2012-01-20 2014-09-09 Kla-Tencor Corp. Segmentation for wafer inspection
US8938119B1 (en) 2012-05-01 2015-01-20 Google Inc. Facade illumination removal
US8826200B2 (en) 2012-05-25 2014-09-02 Kla-Tencor Corp. Alteration for wafer inspection
US9053527B2 (en) 2013-01-02 2015-06-09 Kla-Tencor Corp. Detecting defects on a wafer
WO2014149197A1 (en) 2013-02-01 2014-09-25 Kla-Tencor Corporation Detecting defects on a wafer using defect-specific and multi-channel information
US9448343B2 (en) 2013-03-15 2016-09-20 Kla-Tencor Corporation Segmented mirror apparatus for imaging and method of using the same
US9865512B2 (en) 2013-04-08 2018-01-09 Kla-Tencor Corp. Dynamic design attributes for wafer inspection
US10539612B2 (en) 2015-05-20 2020-01-21 Kla-Tencor Corporation Voltage contrast based fault and defect inference in logic chips
US10018571B2 (en) 2015-05-28 2018-07-10 Kla-Tencor Corporation System and method for dynamic care area generation on an inspection tool
US10416087B2 (en) 2016-01-01 2019-09-17 Kla-Tencor Corporation Systems and methods for defect detection using image reconstruction
US10276346B1 (en) 2016-03-09 2019-04-30 Kla-Tencor Corporation Particle beam inspector with independently-controllable beams
US11237872B2 (en) 2017-05-23 2022-02-01 Kla-Tencor Corporation Semiconductor inspection and metrology systems for distributing job among the CPUs or GPUs based on logical image processing boundaries
WO2020240708A1 (en) * 2019-05-28 2020-12-03 日本電信電話株式会社 Method for manufacturing optoelectronic device and optoelectronic device manufacture assistance system
KR102473011B1 (en) 2020-11-29 2022-12-02 스마트로봇연구소(주) A system equipped with a database for standardization of representation data of processing elements for passing processing data of work drawings between a shipyard and partner company during the production of shipbuilding's steel outfit

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4717644A (en) * 1982-12-20 1988-01-05 International Business Machines Corporation Hybrid electron beam and optical lithography method
JPH10242038A (en) * 1997-02-28 1998-09-11 Toshiba Corp Pattern formation method and lithography system

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57149905A (en) * 1981-03-11 1982-09-16 Fujitsu Ltd Pattern inspecting device
JPS57167649A (en) * 1981-03-31 1982-10-15 Fujitsu Ltd Inspecting device for pattern
JPS59206705A (en) * 1983-05-11 1984-11-22 Dainippon Screen Mfg Co Ltd Inspection of pattern
JPS6061604A (en) * 1983-09-16 1985-04-09 Hitachi Ltd Pattern inspecting apparatus
JPS6182425A (en) * 1984-09-29 1986-04-26 Toshiba Corp Charged beam exposure equipment
JPS61140804A (en) * 1984-12-14 1986-06-27 Hitachi Ltd Pattern inspection instrument
JPH0721458B2 (en) * 1985-05-29 1995-03-08 株式会社日立製作所 Surface pattern inspection method
JPH0621769B2 (en) * 1985-12-13 1994-03-23 大日本スクリ−ン製造株式会社 Pattern defect detection method and device
US5267175A (en) 1986-09-12 1993-11-30 Digital Equipment Corporation Data base access mechanism for rules utilized by a synthesis procedure for logic circuit design
US5150308A (en) 1986-09-12 1992-09-22 Digital Equipment Corporation Parameter and rule creation and modification mechanism for use by a procedure for synthesis of logic circuit designs
US5097422A (en) 1986-10-10 1992-03-17 Cascade Design Automation Corporation Method and apparatus for designing integrated circuits
JPH0737892B2 (en) * 1988-01-12 1995-04-26 大日本スクリーン製造株式会社 Pattern defect inspection method
JPH01238016A (en) * 1988-03-17 1989-09-22 Nec Corp Electron beam direct lithography
US4989255A (en) 1988-03-25 1991-01-29 Texas Instruments Incorporated Expansion of compact database for pattern inspector or writer
US5287290A (en) * 1989-03-10 1994-02-15 Fujitsu Limited Method and apparatus for checking a mask pattern
JPH0820231B2 (en) * 1989-03-10 1996-03-04 富士通株式会社 Mask pattern inspection method
US5113451A (en) 1989-10-16 1992-05-12 Vlsi Technology, Inc. Method for labelling polygons
JP3020973B2 (en) * 1989-12-29 2000-03-15 キヤノン株式会社 Image processing method
JPH03278057A (en) * 1990-02-14 1991-12-09 Toshiba Corp Pattern inspecting device
US5230075A (en) 1990-06-04 1993-07-20 General Electric Company Database shadowing system with data tags that select an operation of the save command
IL125217A (en) 1990-12-04 1999-10-28 Orbot Instr Ltd Apparatus and method for microscopic inspection of articles
JPH06289596A (en) * 1991-03-11 1994-10-18 Nippon Telegr & Teleph Corp <Ntt> Pattern defect inspecting device
JP3237928B2 (en) * 1992-12-04 2001-12-10 株式会社東芝 Pattern inspection method and apparatus
US5416722A (en) 1992-11-19 1995-05-16 Vlsi Technology, Inc. System and method for compacting integrated circuit layouts
JP3104462B2 (en) * 1993-04-01 2000-10-30 日本電気株式会社 Mask defect inspection equipment
US5483461A (en) * 1993-06-10 1996-01-09 Arcsys, Inc. Routing algorithm method for standard-cell and gate-array integrated circuit design
JPH0765040A (en) 1993-08-24 1995-03-10 Matsushita Electric Ind Co Ltd Function data interface method/device
JPH07159337A (en) * 1993-12-07 1995-06-23 Sony Corp Fault inspection method for semiconductor element
US5625568A (en) 1993-12-22 1997-04-29 Vlsi Technology, Inc. Method and apparatus for compacting integrated circuits with standard cell architectures
JPH07249748A (en) 1994-03-14 1995-09-26 Fujitsu Ltd Design system for master slice lsi
US6292582B1 (en) * 1996-05-31 2001-09-18 Lin Youling Method and system for identifying defects in a semiconductor
JPH1032161A (en) * 1996-07-17 1998-02-03 Toshiba Corp Specimen inspecting device
JP3646415B2 (en) * 1996-07-18 2005-05-11 ソニー株式会社 Mask defect detection method
JPH10104168A (en) * 1996-09-26 1998-04-24 Toshiba Corp Graphic data developing device based on design data
JPH10142771A (en) * 1996-11-06 1998-05-29 Nikon Corp Method for setting sensitivity of inspection apparatus for inspecting pattern and inspection apparatus which allows setting of sensitivity
US5804340A (en) 1996-12-23 1998-09-08 Lsi Logic Corporation Photomask inspection method and inspection tape therefor
JP3484042B2 (en) * 1997-05-21 2004-01-06 株式会社日立製作所 Pattern inspection method and apparatus
US6009251A (en) * 1997-09-30 1999-12-28 Synopsys, Inc. Method and system for layout verification of an integrated circuit design with reusable subdesigns
US6097884A (en) * 1997-12-08 2000-08-01 Lsi Logic Corporation Probe points and markers for critical paths and integrated circuits
US6282309B1 (en) * 1998-05-29 2001-08-28 Kla-Tencor Corporation Enhanced sensitivity automated photomask inspection system
JP2000146857A (en) * 1998-11-13 2000-05-26 Toshiba Corp Pattern defect inspection method, and device therefor
US6654488B1 (en) * 1999-07-01 2003-11-25 International Business Machines Corporation Fill pattern inspection
US6557162B1 (en) * 2000-09-29 2003-04-29 Numerical Technologies, Inc. Method for high yield reticle formation

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4717644A (en) * 1982-12-20 1988-01-05 International Business Machines Corporation Hybrid electron beam and optical lithography method
JPH10242038A (en) * 1997-02-28 1998-09-11 Toshiba Corp Pattern formation method and lithography system
US5994030A (en) * 1997-02-28 1999-11-30 Kabushiki Kaisha Toshiba Pattern-forming method and lithographic system

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
P. DEPESA ET AL.: "Automated Critical Dimension and Registration Communication", PROCEEDINGS OF SPIE, THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING, vol. 1604, 1991, pages 26 - 33, XP000905302 *

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6757645B2 (en) 1997-09-17 2004-06-29 Numerical Technologies, Inc. Visual inspection and verification system
US8923600B2 (en) 2005-11-18 2014-12-30 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US9170211B2 (en) 2011-03-25 2015-10-27 Kla-Tencor Corp. Design-based inspection using repeating structures
US9189844B2 (en) 2012-10-15 2015-11-17 Kla-Tencor Corp. Detecting defects on a wafer using defect-specific information
US9134254B2 (en) 2013-01-07 2015-09-15 Kla-Tencor Corp. Determining a position of inspection system output in design data space
US9311698B2 (en) 2013-01-09 2016-04-12 Kla-Tencor Corp. Detecting defects on a wafer using template image matching
US9310320B2 (en) 2013-04-15 2016-04-12 Kla-Tencor Corp. Based sampling and binning for yield critical defects

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JP2002532760A (en) 2002-10-02
JP5075904B2 (en) 2012-11-21
EP1141868A2 (en) 2001-10-10
JP4739527B2 (en) 2011-08-03
WO2000036525A2 (en) 2000-06-22
US6529621B1 (en) 2003-03-04
EP1752897A1 (en) 2007-02-14
US20030142860A1 (en) 2003-07-31
US6748103B2 (en) 2004-06-08
JP2010044414A (en) 2010-02-25

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