WO2000041518A3 - Electrodeposition chemistry for filling of apertures with reflective metal - Google Patents
Electrodeposition chemistry for filling of apertures with reflective metal Download PDFInfo
- Publication number
- WO2000041518A3 WO2000041518A3 PCT/US2000/000155 US0000155W WO0041518A3 WO 2000041518 A3 WO2000041518 A3 WO 2000041518A3 US 0000155 W US0000155 W US 0000155W WO 0041518 A3 WO0041518 A3 WO 0041518A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- ppm
- plating solution
- concentration
- filling
- plating
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000593140A JP2002534610A (en) | 1999-01-11 | 2000-01-05 | Electrodeposition chemistry for filling openings with reflective metals |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/227,957 | 1999-01-11 | ||
US09/227,957 US6379522B1 (en) | 1999-01-11 | 1999-01-11 | Electrodeposition chemistry for filling of apertures with reflective metal |
US09/263,653 | 1999-03-05 | ||
US09/263,653 US6544399B1 (en) | 1999-01-11 | 1999-03-05 | Electrodeposition chemistry for filling apertures with reflective metal |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2000041518A2 WO2000041518A2 (en) | 2000-07-20 |
WO2000041518A3 true WO2000041518A3 (en) | 2000-11-30 |
Family
ID=26921909
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2000/000155 WO2000041518A2 (en) | 1999-01-11 | 2000-01-05 | Electrodeposition chemistry for filling of apertures with reflective metal |
Country Status (4)
Country | Link |
---|---|
US (2) | US6544399B1 (en) |
JP (1) | JP2002534610A (en) |
TW (1) | TW524894B (en) |
WO (1) | WO2000041518A2 (en) |
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US20060283716A1 (en) * | 2003-07-08 | 2006-12-21 | Hooman Hafezi | Method of direct plating of copper on a ruthenium alloy |
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US7205233B2 (en) * | 2003-11-07 | 2007-04-17 | Applied Materials, Inc. | Method for forming CoWRe alloys by electroless deposition |
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US20050170650A1 (en) * | 2004-01-26 | 2005-08-04 | Hongbin Fang | Electroless palladium nitrate activation prior to cobalt-alloy deposition |
TW200632147A (en) * | 2004-11-12 | 2006-09-16 | ||
US20060240187A1 (en) * | 2005-01-27 | 2006-10-26 | Applied Materials, Inc. | Deposition of an intermediate catalytic layer on a barrier layer for copper metallization |
TW200707640A (en) * | 2005-03-18 | 2007-02-16 | Applied Materials Inc | Contact metallization scheme using a barrier layer over a silicide layer |
US20060246699A1 (en) * | 2005-03-18 | 2006-11-02 | Weidman Timothy W | Process for electroless copper deposition on a ruthenium seed |
TW200734482A (en) * | 2005-03-18 | 2007-09-16 | Applied Materials Inc | Electroless deposition process on a contact containing silicon or silicide |
US7651934B2 (en) | 2005-03-18 | 2010-01-26 | Applied Materials, Inc. | Process for electroless copper deposition |
JP2006336031A (en) * | 2005-05-31 | 2006-12-14 | Toray Eng Co Ltd | Copper sulfate plating bath and plating method using the plating bath |
WO2007035880A2 (en) * | 2005-09-21 | 2007-03-29 | Applied Materials, Inc. | Method and apparatus for forming device features in an integrated electroless deposition system |
US20070099806A1 (en) * | 2005-10-28 | 2007-05-03 | Stewart Michael P | Composition and method for selectively removing native oxide from silicon-containing surfaces |
US20070178697A1 (en) * | 2006-02-02 | 2007-08-02 | Enthone Inc. | Copper electrodeposition in microelectronics |
TWI341554B (en) * | 2007-08-02 | 2011-05-01 | Enthone | Copper metallization of through silicon via |
US7905994B2 (en) * | 2007-10-03 | 2011-03-15 | Moses Lake Industries, Inc. | Substrate holder and electroplating system |
US20090188553A1 (en) * | 2008-01-25 | 2009-07-30 | Emat Technology, Llc | Methods of fabricating solar-cell structures and resulting solar-cell structures |
US8088246B2 (en) * | 2009-01-08 | 2012-01-03 | Cordani Jr John L | Process for improving the adhesion of polymeric materials to metal surfaces |
US8262894B2 (en) | 2009-04-30 | 2012-09-11 | Moses Lake Industries, Inc. | High speed copper plating bath |
CN108701647A (en) | 2016-02-26 | 2018-10-23 | 应用材料公司 | Enhancing plating bath and additive chemical for cobalt plating |
EP3636803A4 (en) * | 2017-06-01 | 2021-02-24 | Mitsubishi Materials Corporation | Method for producing high-purity electrolytic copper |
CN110284162B (en) * | 2019-07-22 | 2020-06-30 | 广州三孚新材料科技股份有限公司 | Cyanide-free alkaline copper plating solution for photovoltaic confluence welding strip and preparation method thereof |
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EP0952242A1 (en) * | 1998-04-21 | 1999-10-27 | Applied Materials, Inc. | Electro deposition chemistry |
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-
1999
- 1999-03-05 US US09/263,653 patent/US6544399B1/en not_active Expired - Lifetime
-
2000
- 2000-01-03 TW TW089100025A patent/TW524894B/en not_active IP Right Cessation
- 2000-01-05 WO PCT/US2000/000155 patent/WO2000041518A2/en active Application Filing
- 2000-01-05 JP JP2000593140A patent/JP2002534610A/en active Pending
-
2001
- 2001-08-20 US US09/935,530 patent/US6596151B2/en not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3161575A (en) * | 1960-07-23 | 1964-12-15 | Albright & Wilson Mfg Ltd | Copper pyrophosphate electroplating solutions |
JPS6056086A (en) * | 1983-09-06 | 1985-04-01 | Hodogaya Chem Co Ltd | Copper plating bath |
EP0163131A2 (en) * | 1984-04-27 | 1985-12-04 | LeaRonal, Inc. | An acid copper electroplating solution as well as a method of electroplating |
US5328589A (en) * | 1992-12-23 | 1994-07-12 | Enthone-Omi, Inc. | Functional fluid additives for acid copper electroplating baths |
EP0952242A1 (en) * | 1998-04-21 | 1999-10-27 | Applied Materials, Inc. | Electro deposition chemistry |
Non-Patent Citations (2)
Title |
---|
JAMES J. KELLY CS: "Copper Deposition in the Presence of Polyethylene Glycol. I. Quartz Crystal", J. ELECTROCHEM. SOC., vol. 145, no. 10, 30 October 1998 (1998-10-30), pages 3472 - 3476, XP002148319 * |
PATENT ABSTRACTS OF JAPAN vol. 009, no. 188 (C - 295) 3 August 1985 (1985-08-03) * |
Also Published As
Publication number | Publication date |
---|---|
US6544399B1 (en) | 2003-04-08 |
US20020011416A1 (en) | 2002-01-31 |
JP2002534610A (en) | 2002-10-15 |
TW524894B (en) | 2003-03-21 |
WO2000041518A2 (en) | 2000-07-20 |
US6596151B2 (en) | 2003-07-22 |
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