WO2000046419A2 - Metallizable moulded part - Google Patents

Abstract

The invention relates to metallizeable moulded parts, to methods for producing them and to their use as a component with integrated electroconductive sections for electrical applications.

Description

Metallizable molded part

The invention relates to metallizable molded parts, processes for their production and their use as a component with integrated electrically conductive sections for electrical applications.

Molded parts, processes and uses of components made of thermoplastic materials with integrated electrically conductive sections are known in principle.

These components are known in the literature as MID (molded interconnection device). Some patents also deal with a similar technique.

In the manufacture of three-dimensional components (3-D MID technology), the focus in recent years has mainly been on combinations of metallizable (electrolessly wet chemical, electro-galvanic) and non-metallizable polyamides. PA 12 in particular was used here as a non-metallizable component and polyamides based on ε-caprolactam and / or hexamethylenediamine and adipic acid as a metallizable component, both components being used in most cases in the form of glass-fiber reinforced compounds.

For example, DE 44 16 986 describes a method for producing a special component from a plastic Kl from the group that is difficult or impossible to metallize

PA6, PA66, PAH, PA 12, PPA and a metallizable plastic K2 from the group PA6, PA66, PA66 / 6, PMMA, ABS, PVC, PUR, UP.

This technical solution has several disadvantages. Among other things, the water absorption of the polyamide may lead to blistering during IR soldering and a lack of dimensional stability and heat resistance, particularly Temperatures around 50 ° C. A further disadvantage is that PA12 in molded parts, for example produced in two-component injection molding, often has insufficient adhesion at the interface with the second polyamide component. Furthermore, higher costs of PA12 compared to PA6 are disadvantages of the material combination mentioned for 3-D MID. Components of the material combination made of PA12 / PA6 can also lead to undesired water or moisture absorption, which may adversely affect the anchoring at the interface of the two materials. For these reasons, alternatives for the non-galvanizable component, in particular PA 12, are sought. Constant electrical and mechanical properties (eg rigidity) and stability, eg against chemicals, play an outstanding role.

The following cannot be metallized under the conditions typical for PA6, e.g. partially aromatic polyamides. The reinforcement of such polyamides with glass fibers, which is necessary to achieve sufficient rigidity and similar shrinkage conditions, e.g. is required for glass fiber reinforced PA6, however, leads to a slight galvanizability of corresponding molded part surfaces. The Durethan T40 (commercial product from Bayer AG, partially aromatic polyamide, molding compound set according to ISO 1874: PA6I, MT, 12-030), which cannot be metallized under the conditions customary for PA6, is partially galvanized by melt compounding with 30% glass fibers, so that the material is not considered as Alternative for PA 12 comes into question.

It is also known that partially aromatic polyesters, such as, for example, polybutylene terephthalate (PBT) and polyamides (PA), are insoluble in one another in the melt and therefore do not show any miscibility. Due to this incompatibility, no blends of polyester (including PBT) and PA (including PA6) of commercial importance are known to date (Z. Xiaochuan et al, Polymers and Polymer Composites, Vol. 5, No. 7, 1997, S 501 - 505). Probably for this reason, PBT / PA blends are not mentioned in the plastic manual polyamide (plastic manual polyamide 3/4, Carl Hanser Verlag, 1998, ISBN 3-446-16486-3, p. 131 - 165). Therefore, it has previously been assumed that combinations of PBT and PA in two-component injection molding are unsuitable for 3-D MID applications.

Surprisingly, it was found that a combination of PBT as a non-metallizable component and PA6 as a metallizable component for 3-D MID components in the 2-component injection molding process does not have the disadvantages mentioned above. The preferred metallization method is the Baygamid® method (Bayer AG method).

The application accordingly relates to a molded part containing at least two thermoplastics K (I) and K (II), at least one plastic K (I) being a partially aromatic polyester and at least one plastic K (II) being a polyamide.

It is particularly important that the two plastics do not mix with one another under the usual processing conditions of plastics processing and form blurred interfaces. This would significantly affect the precision of the metallization. It is therefore preferred if the plastic (s) K (I) and the plastic (s) K (II) are present in a macroscopically phase-separated manner in relation to the respective type of plastic to more than 90% by weight.

The partially aromatic polyester according to the invention is selected from the group of derivatives of polyalkyliderephthalates, preferably selected from the group of polyethylene terephthalates, polytrimethylene terephthalates and polybutylene terephthalates, particularly preferably polybutylene terephthalates, very particularly preferably polybutylene terephthalate.

Partially aromatic polyester is understood to mean materials which, in addition to aromatic molecular parts, also contain aliphatic molecular parts.

For the purposes of the invention, polyalkylene terephthalates are reaction products made from aromatic dicarboxylic acid or its reactive derivatives (for example dimethyl esters or anhydrides) and aliphatic, cycloaliphatic or araliphatic diols and mixtures of these reaction products.

Preferred polyalkylene terephthalates can be prepared from terephthalic acid (or its reactive derivatives) and aliphatic or cycloaliphatic diols with 2 to 10 carbon atoms by known methods (Kunststoff-Handbuch, Vol. VIII, p. 695 FF, Karl-Hanser-Verlag, Munich 1973 ).

Preferred polyalkylene terephthalates contain at least 80, preferably 90 mol%, based on the dicarboxylic acid, terephthalic acid residues and at least 80, preferably at least 90 mol%, based on the diol component, 1,3-ethylene glycol and / or propanediol and / or butanediol-1,4-residues.

In addition to terephthalic acid residues, the preferred polyalkylene terephthalates can contain up to 20 mol% residues of other aromatic dicarboxylic acids with 8 to 14 C atoms or aliphatic dicarboxylic acids with 4 to 12 C atoms, such as residues of phthalic acid, isophthalic acid, naphthalene-2,6-dicarboxylic acid, 4,4'-diphenyldicarboxylic acid, succinic acid, adipic acid, sebacic acid, azelaic acid, cyclohexanediacetic acid.

In addition to ethylene or propanediol-1,3- or butanediol-1,4-glycol residues, the preferred polyalkylene terephthalates can contain up to 20 mol% of other aliphatic diols with 3 to 12 carbon atoms or cycloaliphatic diols with 6 to 21 Contain carbon atoms, e.g. residues of 1,3-propanediol, 2-ethylpropanediol, 1,3, neopentylglycol, 1,5-pentanediol, 1,6-hexanediol, 1,4-cyclohexane-dimethanol, 3-methylpentanediol 2,4, 2-methylpentanediol-2,4, 2,2,4-trimethylpentanediol-1,3 and -1,6,2-ethylhexanediol-1,3 2,2-diethyl propanediol-1,3, hexanediol- 2,5, 1, 4-di- (β-hydroxyethoxy) benzene, 2,2-bis (4-hydroxycyclohexyl) propane, 2,4-dihydroxy-1, 1, 3, 3-tetramethyl-cyclobutane , 2,2-bis (3-ß-hydroxyethoxyphenyl) propane and 2,2-bis (4-hydroxypropoxyphenyl) propane (DE-OS 24 07 674, 24 07 776, 27 15 932). The polyalkylene terephthalates can be branched by incorporating relatively small amounts of trihydric or tetravalent alcohols or 3- or 4-basic carboxylic acid, as described, for example, in DE-OS 19 00 270 and US Pat. No. 3,692,744. Examples of preferred branching agents are trimesic acid, trimellitic acid, trimethyl ether and propane and pentaerythritol.

It is advisable not to use more than 1 mol% of the branching agent, based on the acid component.

Particularly preferred are polyalkylene terephthalates which have been produced solely from terephthalic acid and its reactive derivatives (eg its dialkyl esters) and ethylene glycol and / or 1,3-propanediol and / or 1,4-butanediol (polyethylene and polybutylene terephthalate), and mixtures of these polyalkylene terephthalates.

Preferred polyalkylene terephthalates are also copolyesters which are prepared from at least two of the abovementioned acid components and / or from at least two of the abovementioned alcohol components; particularly preferred copolyesters are poly (ethylene glycol / butanediol-1,4) terephthalates.

The polyalkylene terephthalates generally have an intrinsic viscosity of approximately 0.4 to 1.5, preferably 0.5 to 1.3, each measured in phenol / o-dichlorobenzene (1: 1 parts by weight) at 25 ° C.

Furthermore, the partially aromatic polyester additives such as Fillers and reinforcing materials such as Contain glass fibers or mineral fillers, flame retardants, processing aids, stabilizers, flow aids, antistatic agents, dyes, pigments and other common additives.

As fiber or particulate fillers and reinforcing materials for the molding compositions according to the invention, glass fibers, glass balls, glass fabric, glass mats,

Carbon fibers, aramid fibers, potassium titanate fibers, natural fibers, amorphous Silicic acid, magnesium carbonate, barium sulfate, feldspar, mica, silicates, quartz, talc, kaolin, titanium dioxide, wollastonite, etc. can be added, which can also be surface-treated. Preferred reinforcing materials are commercially available glass fibers. The glass fibers, which generally have a fiber diameter between 8 and 18 μm, can be in the form of continuous fibers or cut or ground

Glass fibers are added, the fibers with a suitable sizing system and an adhesion promoter or adhesion promoter system e.g. can be equipped on a silane basis.

Acicular mineral fillers are also suitable. For the purposes of the invention, acicular mineral fillers are understood to be mineral fillers with a pronounced acicular character. Needle-shaped wollastonite is an example. The mineral preferably has an L / D (length diameter) ratio of 8: 1 to 35: 1, preferably 8: 1 to 1 1: 1. The mineral filler can optionally be surface-treated.

The polyester molding composition preferably contains 0 to 50 parts by weight, preferably 0-40, in particular 10-30 parts by weight of fillers and / or reinforcing materials. Polyester molding compositions without fillers and / or reinforcing materials can also be used.

Commercially available organic compounds or halogen compounds with synergists or commercially available organic nitrogen compounds or organic / inorganic phosphorus compounds are suitable as flame retardants. Mineral flame retardant additives such as magnesium hydroxide or Ca-Mg carbonate

Hydrates (eg DE-OS 4 236 122) can be used. Examples of halogen-containing, in particular brominated and chlorinated, compounds are: ethylene-1,2-bistetrabromophthalimide, epoxidized tetrabromobisphenol A resin, tetrabromobisphenol A oligocarbonate, tetrachlorobisphenol A oligocarbonate, pentabromopolyacrylate, brominated polystyrene. As organic phosphorus compounds, the phosphorus compounds according to WO98 / 17720 (PCT EP / 05705) are suitable, for example Triphenyl phosphate (TPP), resorcinol bis (diphenyl phosphate) including oligomers (RDP) and bisphenol A bis bis diphenyl phosphate including oligomers (BDP), melamine phosphate, melamine pyrophosphate, melamine polyphosphate and mixtures thereof. Melamine and melamine cyanurate are particularly suitable as nitrogen compounds. Examples of suitable synergists are antimony compounds, in particular antimony trioxide and antimony pentoxide, zinc compounds, tin compounds such as zinc stannate and borates. Carbon formers and tetrafluoroethylene polymers can be added.

The partially aromatic polyesters according to the invention can contain conventional additives such as

Agents against heat decomposition, agents against heat crosslinking, agents against damage by ultraviolet light, plasticizers, lubricants and mold release agents, nucleating agents, antistatic agents, stabilizers and dyes and pigments.

Examples of oxidation retarders and heat stabilizers are sterically hindered phenols and / or phosphites, hydroquinones, aromatic secondary amines such as diphenylamines, various substituted representatives of these groups and their mixtures in concentrations of up to 1% by weight, based on the weight of the thermoplastic molding compositions.

Various substituted resorcinols, salicylates, benzotriazoles and benzophenones may be mentioned as UV stabilizers, which are generally used in amounts of up to 2% by weight, based on the molding composition.

Inorganic pigments such as titanium dioxide, ultramarine blue, iron oxide and carbon black, organic pigments such as phthalocyanines, quinacridones, perylenes and dyes such as nigrosine and anthraquinones can also be added as colorants and other colorants. For example, sodium phenylphosphinate, aluminum oxide, silicon dioxide and preferably talc can be used as nucleating agents.

Lubricants and mold release agents, which are usually used in amounts of up to 1% by weight, are preferably ester waxes, penterithryt stearate (PETS), long-chain fatty acids (for example stearic acid or behenic acid), their salts (for example Ca or Zn stearate) and amide derivatives (eg ethylene-bis-stearylamide) or montan waxes (mixtures of straight-chain, saturated carboxylic acids with chain lengths of 28 to 32 carbon atoms) as well as low molecular weight polyethylene or polypropylene waxes.

Examples of plasticizers are phthalic acid dioctyl esters, phthalic acid dibenzyl esters, phthalic acid butyl benzyl esters, hydrocarbon oils, N- (n-butyl) benzenesulfonamide.

The additional use of rubber-elastic polymers (often also referred to as impact modifier, elastomer or rubber) is particularly preferred.

In general, these are copolymers which are preferably composed of at least two of the following monomers: ethylene, propylene, butadiene,

Isobutene, isoprene, chloroprene, vinyl acetate, styrene, acrylonitrile and acrylic or methacrylic acid esters with 1 to 18 carbon atoms in the alcohol component.

Such polymers are e.g. in Houben-Weyl, Methods of Organic Chemistry, Vol. 14/1 (Georg-Thieme-Verlag, Stuttgart, 1961), pages 392 to 406 and in the

Monograph by C.B. Bucknall, "Toughened Plastics" (Applied Science Publishers, London, 1977).

Some preferred types of such elastomers are presented below. Preferred types of such elastomers are the so-called ethylene-propylene (EPM) or ethylene-propylene-diene (EPDM) rubbers.

EPM rubbers generally have practically no more double bonds, while EPDM rubbers can have 1 to 20 double bonds per 100 carbon atoms.

Examples of diene monomers for EPDM rubbers are conjugated dienes such as isoprene and butadiene, non-conjugated dienes having 5 to 25 carbon atoms such as penta-l, 4-diene, hexa- 1, 4-diene, hexa-l, 5 -diene, 2,5-dimethylhexa-l, 5-diene and octa-

1, 4-dienes, cyclic dienes such as cyclopentadiene, cyclohexadienes, cyclooctadienes and dicyclopentadiene and alkenylnorbornenes such as 5-ethylidene-2-norbornene, 5-butylidene-2-norbornene, 2-methallyl-5-norbornene, 2-isopropenyl-5 -norbornene and tricyclodienes such as 3-methyl-tricyclo- (5.2.1.0.2.6) -3,8-decadiene or their mixtures. Hexa-l, 5-diene, 5-ethylidene norbornene and dicyclopentadiene are preferred. The diene content of the EPDM rubbers is preferably 0.5 to 50, in particular 1 to 8,% by weight, based on the total weight of the rubber.

EPM or EPDM rubbers can preferably also be grafted with reactive carboxylic acids or their derivatives. Here are e.g. Acrylic acid. Methacrylic acid and its derivatives, e.g. Glycidyl (mefh) acrylate, as well as maleic anhydride.

Another group of preferred rubbers are copolymers of ethylene with acrylic acid and / or methacrylic acid and / or the esters of these acids. In addition, the rubbers can also contain dicarboxylic acids such as maleic acid and fumaric acid

Derivatives of these acids, for example esters and anhydrides, and / or monomers containing epoxy groups. These dicarboxylic acid derivatives or monomers containing epoxy groups are preferably incorporated into the rubber by adding monomers of the general formulas (I) or (II) or (III) or (IV) containing dicarboxylic acid or epoxy groups to the monomer mixture, R ¹ C (COOR ² ) = C (COOR ³ ) R ⁴ (I)

CH; CR-COO - (-CH,) p-CH CHR ⁸

(IV),

where R ¹ to R ^{9 represent} hydrogen or alkyl groups having 1 to 6 carbon atoms and m is an integer from 0 to 20, g is an integer from 0 to 10 and p is an integer from 0 to 5.

The radicals R ¹ to R ^{9 are} preferably hydrogen, where m is 0 or 1 and g is 1. The corresponding compounds are maleic acid, fumaric acid, maleic anhydride, allyl glycidyl ether and vinyl glycidyl ether.

Preferred compounds of the formulas (I), (II) and (IV) are maleic acid, maleic anhydride and epoxy group-containing esters of acrylic acid and / or methacrylic acid, such as glycidyl acrylate, glycidyl methacrylate and the esters with tertiary alcohols, such as t-butyl acrylate. Although the latter have no free carboxyl groups, their behavior comes close to that of the free acids and is therefore referred to as monomers with latent carboxyl groups. The copolymers advantageously consist of 50 to 98% by weight of ethylene, 0.1 to 20% by weight of monomers containing epoxy groups and / or monomers containing methacrylic acid and / or monomers containing acid anhydride groups and the remaining amount of (meth) acrylic acid esters.

Copolymers of are particularly preferred

50 to 98, in particular 55 to 95% by weight of ethylene,

0.1 to 40, in particular 0.3 to 20% by weight of glycidyl acrylate and / or the glycidyl methacrylate, (meth) acrylic acid and / or maleic anhydride, and

I to 45, in particular 10 to 40% by weight of n-butyl acrylate and / or 2-ethylhexyl acrylate.

Further preferred esters of acrylic and / or methacrylic acid are the methyl, ethyl, propyl and i- or t-butyl esters.

In addition, vinyl esters and vinyl ethers can also be used as comonomers.

The ethylene copolymers described above can be prepared by processes known per se, preferably by random copolymerization under high pressure and elevated temperature. Appropriate methods are generally known.

Preferred elastomers are also emulsion polymers, the preparation of which is described, for example, by Blackley in the monograph "Emulsion Polymerization". The emulsifiers and catalysts which can be used are known per se. In principle, homogeneous elastomers or those with a shell structure can be used. The shell-like structure is determined by the order of addition of the individual monomers; The morphology of the polymers is also influenced by this order of addition.

Representative here are as monomers for the production of the rubber part of the elastomers acrylates such as n-Butyl acrylate and 2-ethylhexyl acrylate, corresponding methacrylates, butadiene and isoprene and mixtures thereof. These monomers can be combined with other monomers such as e.g. Styrene, acrylonitrile, vinyl ethers and other acrylates or methacrylates such as methyl methacrylate, methyl acrylate, ethyl acrylate and propyl acrylate are copolymerized.

The soft or rubber phase (with a glass transition temperature of below 0 ° C) of the elastomers can be the core, the outer shell or a middle shell (in the case of elastomers with more than two shells); with multi-layer

Elastomers can also consist of several shells from a rubber phase.

If, in addition to the rubber phase, one or more hard components (with glass transition temperatures of more than 20 ° C.) are involved in the construction of the elastomer, these are generally made by polymerizing styrene, acrylonitrile,

Methacrylonitrile, α-methylstyrene, p-methylstyrene, acrylic acid esters and methacrylic acid esters such as methyl acrylate, ethyl acrylate and methyl methacrylate as main monomers. In addition, smaller proportions of other comonomers can also be used here.

In some cases it has proven to be advantageous to use emulsion polymers which have reactive groups on the surface. Such groups are, for example, epoxy, carboxyl, latent carboxyl, amino or amide groups as well as functional groups which are obtained by using monomers of the general formula

can be introduced

where the substituents can have the following meanings:

R ^{10 is} hydrogen or a C _j to C ₄ alkyl group,

R ^{1 1 is} hydrogen, a C to Cg alkyl group or an aryl group, in particular phenyl,

R ^{12 is} hydrogen, a Ci to Cj _Q alkyl, a C ₆ to C ₂ aryl group or -OR13,

R ^{13 is} a C _j to Cg alkyl or Cg to C aryl group, optionally with

O- or N-containing groups can be substituted,

X is a chemical bond, a Ci to C ₁₀ alkylene, a C ₆ to C _j2 arylene group or

Y O-Z or NH-Z and

Z is a C _j to C _j o-alkylene or a C _Ö to C ^ arylene group.

The graft monomers described in EP-A 208 187 are also suitable for introducing reactive groups on the surface. Further examples are acrylamide, methacrylamide and substituted esters of acrylic acid or methacrylic acid such as (Nt-butylamino) ethyl methacrylate, (N, N-dimethylamino) ethyl acrylate, (N, N-dimethylamino) methyl acrylate and (N, N-diethylamino) called ethyl acrylate.

The particles of the rubber phase can also be crosslinked. Monomers acting as crosslinking agents are, for example, buta-1,3-diene, divinylbenzene, diallyl phthalate and dihydrodicyclopentadienyl acrylate, and the compounds described in EP-A 50 265.

So-called graft-linking monomers can also be used, i.e. Monomers with two or more polymerizable double bonds, which react at different rates during the polymerization. Those compounds are preferably used in which at least one reactive group has approximately the same rate as the others

Monomers polymerize while the other reactive group (or reactive groups) e.g. polymerizes much slower (polymerize). The different polymerization rates result in a certain proportion of unsaturated double bonds in the rubber. If a further phase is subsequently grafted onto such a rubber, the double bonds present in the rubber react at least partially with the graft monomers to form chemical bonds, i.e. the grafted phase is at least partially linked to the graft base via chemical bonds.

Examples of such graft-crosslinking monomers are those containing allyl groups

Monomers, especially allyl esters of ethylenically unsaturated carboxylic acids such as allyl acrylate, allyl methacrylate, diallyl maleate, diallyl fumarate, diallyl itaconate or the corresponding monoallyl compounds of these dicarboxylic acids. There are also a large number of other suitable graft-crosslinking monomers; for further details, reference is made here, for example, to US Pat. No. 4,148,846. In general, the proportion of these crosslinking monomers in the impact-modified polymer is up to 5% by weight, preferably not more than 3% by weight, based on the impact-modifying polymer.

Some preferred emulsion polymers are listed below. First of all, graft polymers with a core and at least one outer shell are to be mentioned, which have the following structure:

These graft polymers, in particular ABS and / or ASA polymers, are preferably used for impact modification of PBT, if appropriate in a mixture.

Instead of graft polymers with a multi-layer structure, homogeneous, ie single-layer elastomers composed of buta- 1,3-diene, isoprene and n-butyl acrylate or their copolymers can also be used. These products can also be prepared by using crosslinking monomers or monomers with reactive groups. Examples of preferred emulsion polymers are n-butyl acrylate / (meth) acrylic acid copolymers, n-butyl acrylate / glycidyl acrylate or n-butyl acrylate / glycidyl methacrylate copolymers, graft polymers with an inner core made of n-butyl acrylate or based on butadiene and an outer shell of the above

Copolymers and copolymers of ethylene with comonomers that provide reactive groups.

The elastomers described can also be made by other conventional methods, e.g. by suspension polymerization.

Silicone rubbers as described in DE-A 37 25 576, EP-A 235 690, DE-A 38 00 603 and EP-A 319 290 are also preferred.

Of course, mixtures of the rubber types listed above can also be used.

The polyester molding composition preferably contains between 0 and 40% by weight, preferably between 0 and 30% by weight and particularly preferably between 0 and 20% by weight of rubber-elastic polymers.

The partially aromatic polyester molding compositions according to the invention are produced by mixing the respective constituents in a known manner and converting them into conventional units such as, for example, at temperatures from 200 ° C. to 330 ° C. Internal kneading, extruders, twin-shaft screws melt-compounded or melt-extruded. In which

Melt compounding or melt extruding step can be added to other additives such as reinforcing materials, rubber-elastic polymers, stabilizers, dyes, pigments, lubricants and mold release agents, nucleating agents, compatibalizers and other additives. The polyamide according to the invention is preferably selected from the group of derivatives of polyamides in which 3 to 8 methylene groups are contained in the polymer chain per polyamide group, particularly preferably selected from the group formed from PA6 and PA66, very particularly preferably from the group of PA6 and its copolymers .

The polyamides according to the invention can be produced by various processes and synthesized from very different building blocks and, in special applications, alone or in combination with processing aids, stabilizers, polymeric alloy partners (e.g. elastomers) or also reinforcing materials (such as mineral fillers or glass fibers) to form materials be equipped with specially set combinations of properties. Blends are also suitable, e.g. with parts of polyethylene, polypropylene, ABS. The properties of the polyamides can be improved by adding elastomers, e.g. B. with regard to the impact strength of z. B. reinforced polyamides. The variety of possible combinations enables a very large number of products with different properties.

A large number of processes have become known for the production of polyamides, different monomer building blocks, different chain regulators for setting a desired molecular weight or else monomers with reactive groups being used for post-treatments intended later, depending on the desired end product.

The technically relevant processes for the production of polyamides run without exception via the polycondensation in the melt. In this context, the hydrolytic polymerization of lactams is also understood as polycondensation.

Preferred polyamides for the combinations K (I) / K (II) according to the invention are partially crystalline polyamides which start from diamines and dicarboxylic acids and or Lactams with at least 5 ring members or corresponding amino acids can be produced.

The starting products are preferably aliphatic dicarboxylic acids such as adipic acid, 2,2,4- and 2,4,4-trimethyladipic acid, azelaic acid, sebacic acid, aliphatic diamines such as hexamethylenediamine, 2,2,4- and 2,4,4-trimethylhexamethylene diamine, the isomeric diamino-dicyclohexylmethane, diamino-dicyclohexylpropane, bis-aminomethyl-cyclohexane, aminocarboxylic acids such as aminocaproic acid, or the corresponding lactams. Copolyamides from several of the monomers mentioned are included.

Caprolactams are particularly preferably used, very particularly preferably ε-caprolactam.

Most of the compounds based on PA6, PA66 and other aliphatic polyamides or copolyamides, in which there are 3 to 8 methylene groups per polyamide group in the polymer chain, are also particularly suitable.

Polyamide 6 or polyamide 6.6 or polyamide 4.6 or polyamide 6.10 or a copolyamide from the units of the homopolyamides mentioned or a copolyamide of caprolactam units and units derived from hexamethylene diamine and adipic acid are particularly preferably used. Polyamide 6 or copolyamides with polyamide 6 are very particularly preferably used.

The polyamides produced according to the invention can also be mixed with others

Polyamides and / or other polymers are used.

The polyamide molding compositions according to the invention can contain additives, for example rubber-elastic polymers, as already described above for the polyester molding compositions. In addition, the polyamide molding compounds can still fire retardants such. As phosphorus compounds, organic halogen compounds, nitrogen compounds and / or magnesium hydroxide, stabilizers, colorants, dyes or pigments, processing aids such. B. lubricants, nucleating agents, stabilizers, impact modifiers such. B. contain rubbers or polyolefins and the like.

In addition to glass fibers, carbon fibers, aramid fibers, mineral fibers and whiskers can be considered as fibrous reinforcing materials. Examples of suitable mineral fillers are calcium carbonate, dolomite, calcium sulfate, mica, fluorine mica, wollastonite, talc and kaolin. However, other oxides or hydrated oxides of an element selected from the group consisting of boron, aluminum, gallium, indium, silicon, tin, titanium, zirconium, zinc, ytrium or iron can also be used. To improve the mechanical properties, the fibrous reinforcing materials and the mineral fillers can be surface-treated.

In order to obtain conductive polyamides, conductive carbon blacks, carbon fibrils, conductive polymers, metal fibers and conventional additives to increase the conductivity can be added.

The polyamide molding composition according to the invention preferably contains fillers and / or reinforcing materials, preferably in amounts of 1-50% by weight, particularly preferably between 2-40% by weight, particularly preferably between 5-35% by weight, based on the Total mass of the polyamide molding compound. PA molding compounds without fillers and / or reinforcing materials can also be used.

The fillers can be added before, during or after the polymerization of the monomers to give the polyamide. If the fillers according to the invention are added after the polymerization, they are preferably added to the polyamide melt in an extruder. The fillers according to the invention are added before or during the polymerization, the polymerization can comprise phases in which work is carried out in the presence of 1 to 50 percent by weight of water.

When added, the fillers can already be present as particles with the particle size ultimately occurring in the molding composition. Alternatively, the fillers in

Form of precursors are added, from which the particles ultimately appearing in the molding compound only arise in the course of the addition or incorporation.

Red phosphorus (DE-A-3 713 746 A 1 (= US-A-4 877 823) and EP-A-299444 (= US-A-5 081 222), brominated, for example, come as fire or flame retardants

Diphenyls or diphenyl ethers in combination with antimony trioxide and chlorinated cycloaliphatic hydrocarbons (Dechlorane ^® plus from Occidental Chemical

Co.), brominated styrene oligomers (e.g. in DE-A-2 703 419) and core brominated

Polystyrenes (eg Pyro-Chek 68 ^® from FERRO Chemicals) in question.

Zinc compounds or iron oxides are also used as synergists with the halogen compounds mentioned.

As a further alternative, melamine salts in particular have proven themselves as flame retardants, especially for unstable, poor polyamides.

In addition, magnesium hydroxide has long proven itself as a flame retardant for polyamide.

Preference is given to polyamide molding compositions which, in addition to glass fibers, additionally contain rubber-elastic polymers (often also as an impact modifier, elastomer or

Rubber)). Rubber-elastic polymers are understood here as already described above for the polyester molding compositions.

The polyamide molding composition preferably contains 0-40, preferably 0-30, particularly preferably 3-20 parts by weight of impact modifier, elastomer or rubber.

Graft polymers with a core based on acrylates and a shell based on styrene and acrylates are particularly suitable. Polyamide molding compositions which are both glass-fiber reinforced and elastomer-modified are particularly preferred.

MID is generally understood to mean the following:

"Molded Interconnect Devices", abbreviated as MID, has been an internationally introduced term since the early 1990s to refer to spatially injection-molded circuit boards. The idea behind this is to produce electrical connecting elements based on thermoplastic materials in a three-dimensional, spatial arrangement. MIDs carry electricity, form shielding or transmitting surfaces, carry electronic components and integrate mechanical elements.The MID technology extends the conventional circuit board technology, which is limited to one room level, and is partly in competition with it.

There are now a whole range of MID manufacturing processes. These include the hot stamping of electrically conductive foils, the laser structuring of conductor tracks in combination with wet chemical metallization processes or the encapsulation of preformed metal structures with thermoplastic.

One of the most frequently used manufacturing processes for MIDs is the two-component injection molding technique followed by wet chemical metallization of a plastic component. This process enables the greatest geometrical design freedom in the manufacture of MIDs. A composite body is produced from two thermoplastics, one component of which can be metallized, while the other component remains completely unaffected by the chemical action of the metallization electrolytes.

In this way, plastic components can be produced, which can be given partial metallic properties by a suitable coating. The metallizable plastic can be structured in the form of electrical conductor tracks. However, it can also be structured over a large area and thus, after metallization, contribute to the shielding of electromagnetic interference fields, specifically dissipate frictional heat or become more wear-resistant. The structural fineness, for example the width of electronic conductor tracks, can be reduced to about 500 μm. Such fine conductor track structures are achieved if the metallizable plastic is injected in the first shot and the non-metallizable plastic is extrusion-coated in the second shot. But the reverse order is also possible. The location and number of sprues, the material costs and the adhesion between the two plastic components depend on the type of sequence.

Most of the MIDs that have been mass-produced to date are based on high-performance plastics such as polyethersulfone (PES), polyetherimide (PEI) or liquid crystal polymers (LCP). They were selected to be the one that arises during soldering processes

Withstand temperatures that can reach up to 260 ° C for a short time. In recent times, polyamides have increasingly come to the fore as MID materials, which are much cheaper than high-performance plastics. There are several types of polyamide available that are suitable for the soldering methods used for MIDs.

The adherent metallizability of plastics is a crucial point in the manufacture of MIDs. AHC, Kerpen, a provider of functional surface technology, uses a process (Baygamid® process etc.) for adhesive metallization especially for polyamides. The coating is carried out by wet chemical means by immersing the workpieces in suitable electrolytes. First, an approximately 2 μm thick metallic stop layer is applied. It can be further reinforced chemically (for example with chemical nickel) or glavanically (for example with copper). Chemical and galvanic layers can also be combined with one another.

Polyamides of types PA 6, PA 66, PA 66/6 and PA 46 and copolyamides with a glass fiber or mineral fiber filling up to 40% can be metallized. The adhesive strength of the applied metal layers is more than 1 N / mm. Individual chemically nickel-plated polyamide types pass temperature cycling tests, for example a three cycle from + 140 ° C to -40 ° C. There is no shifting of the layer.

The manufacture of MIDs based on polyamide using two-component injection molding technology and subsequent wet-chemical metallization is therefore an interesting alternative to the other MID manufacturing processes due to the great geometric design freedom, the low material costs and the small number of manufacturing steps. Two applications from the automotive industry support this statement.

The manufacturing costs of a car door lock carrier using this MID technology could be reduced to almost half the costs for conventional manufacturing. The door lock carrier is located in the car door behind the door handle. Depending on the equipment of the vehicle, it is equipped with a lock heater, the control for the central locking and the activation of the automatic interior lighting. Current-carrying strands, microswitches and resistance wire have to be mounted in a conventional manner on an aluminum die-cast body.

When manufacturing as a MID based on polyamide, the support structure generated in the first shot already contains all the storage and storage facilities relevant for the later function

Fasteners. The metallizable component is overmolded in the second shot and, after the metallization, replaces the current-carrying strands of conventional production.

Another application is the production of a car sunroof control as a MID based on polyamide. First, fine conductor track structures are created, but also later plug contacts in the first shot. The second shot creates the non-metallizable body from another type of polyamide. It contains all mechanical components. After the metallization of the two-component polyamide, assembly is limited to assembling the electrical components and soldering them. Compared to the conventional PCB solution the number of mechanical components is reduced and the assembly effort is minimized. However, the conventional assembly technology, especially in the area of assembly and soldering, can be retained. Special advantages are:

1. The freedom in design

The use of thermoplastic materials for the production of circuit carriers offers the almost unlimited freedom of design for the construction of electronic assemblies, as is made possible by injection molding technology. The miniaturized and lighter MID assemblies allow new functions and the design of any shape.

2. The strong rationalization effect

The rationalization effect of this innovative technology and thus the high cost-effectiveness is convincing.

- The reduction in the number of parts eliminates the cost of material,

Production, procurement and logistics of the substituted mechanical and electronic components.

The miniaturized MID assemblies reduce the otherwise necessary use of materials.

By eliminating subsequent processing steps, in particular the previous introduction of the through holes, process chains for production are shortened and thus significant savings are achieved. Compared to conventional construction, cost advantages of over 30% can result. 3. The environmental impact

The MID technology is characterized by a number of improvements in terms of its environmental compatibility. During the pretreatment of the most important MID-suitable plastics, strongly oxidizing acids are avoided. In addition to environmentally friendly production, reducing the variety of materials also plays a decisive role. This favors the recycling of basic materials and the uncritical disposal of residual materials. By using thermoplastics, many can

Applications to do without the use of thermosets.

Method:

The molded parts can be produced by a process in which (A) is first

Plastic K (I) or K (II) is brought into a mold so that a partial molding T (I) or T (II) is formed and then (B) at least one point on the surface of the partial molding, the other plastic K (II) or K (I) is attached. In a preferred process, the molded parts are produced by two-component injection molding.

In an additional step, a part of the surface is preferably of the molding metallized by the known to those skilled in conventional wet chemical, electrolytic processes, particularly preferably by the Baygamid ^® - method (Bayer AG), wherein this additional step between steps (A) and ( B) or is preferably carried out after the two steps.

In a particular embodiment, the metallization step of the metallizable plastic K (II) can preferably contain the following steps: Chemical roughening of the surface e.g. with a calcium chloride solution. Deposit of a

Activator eg palladium ions. Sensitization eg by reducing the palla dium cations to palladium. Chemical deposition of a conductive material such as nickel or copper through, for example, palladium-catalyzed reduction of soluble nickel or copper ion complexes. Electrochemical conversion (electroplating, possibly with a multi-layer structure). All of this, as described for example in DE 43 28 883 or EP 146 723 or EP 146 724, which are hereby incorporated by reference into this document. Further descriptions of this or a similar process can be found in the literature (GD Wolf, F. Funenger, Metallized Polyamide Injection Moldings, Bayer SN 19038, May 1989; U. Tyszka, The standard, large-scale galvanic metallization of injection molded parts made of polyamide, Galvanotechnik 80, 1989, pp. 2 ff; and literature cited there).

The metallization of plastic surfaces can be achieved by physical metallization (preferably metal vapor deposition, vacuum metallization) or chemical metallization, preferably wet-chemical electroless or wet-chemical electro-galvanic metallization (galvanization), chemical metallization in particular, in particular wet-chemical (electroless or electro-galvanic) for this invention. Metallization is preferred.

A special process has been developed for molded parts made of polyamides, which takes the chemical character of the polyamide into account in the digestion / roughening step and carries out the activation step with complex compounds of palladium and platinum and complexing agents which guarantee a high affinity for the polyamide surface. An embodiment is described below.

The essence of the process is a relatively simple pretreatment process with organometallic activators that have been developed for use in novel metallization processes. These are complex compounds of noble metals, preferably palladium or platinum, with different organic ligands. The organic ligands were chosen so that there is a special affinity for the polyamide surface, which makes a significant contribution to the adhesive strength of the metal layer to be applied. Because of this novel activation principle, it was possible to achieve that only a very slight roughening of the polyamide surface has to be carried out as an additional measure for very good metal adhesion.

The entire pretreatment before chemical nickel plating consists of the following stages:

Roughening the polyamide surface in a pretreatment bath, activating in an activating bath containing the palladium complex, sensitizing the activated substrate surface.

The dwell time in the baths is 5 to 10 minutes at approx. 40 ° C. To

Activation and sensitization are flushed well. The first metal layer can then be immediately deposited in any chemical nickel bath. After a first adherent conductive metal layer has been applied, the usual electroplating process, e.g. connect the galvanic layer structure of nickel / copper / nickel / chrome without any problems.

The process enables the adherent metallization of different commercially available polyamides. For example, the application of the method is not restricted to polyamide 6 types. Injection molded parts made of polyamide 66 can also be metallized without any problems while observing the optimized process parameters.

In the meantime, tailor-made metallizable polyamide types are available, which are reinforced with glass fibers for the requirements for high rigidity and heat resistance or for setting a reduced tendency to warp with mineral fillers. Flame retardant products are also available in this way. In order to achieve a particularly good electroplating ability, polyamide types with special elastomer modification have been developed. The class of elastomer-modified, glass fiber-reinforced polyamides is particularly suitable for components that have to meet at most requirements with regard to dimensional stability, dynamic fatigue strength and heat resistance, for example when used in the motor vehicle engine compartment. The glass fiber reinforcement significantly reduces the thermal expansion coefficient of the injection molded parts, so that the adhesive bond between the metal surface and the plastic substrate remains guaranteed even with extreme temperature changes.

In a particular embodiment, the electroplating step preferably of the metalizable plastic K (II) comprises the following steps: G (I) disintegrating the surface by dissolving baths, preferably containing calcium salts, G (II) chemical deposition of metals, preferably palladium, to produce a conductive one

Surface, particularly preferably by activators and G (III) electroplating, possibly with a multi-layer structure, as it is for. B. is described in DE 43 28 883 or EP 146 723 or EP 146 724, which are hereby incorporated by reference into this document. For example, a partial molded body or a molded body is treated analogously to the following method:

A 90 x 150 x 3 mm thick glass fiber reinforced (30% glass fibers) plate made of polyamide-6 was placed in a pretreatment bath with a flash point> 110 ° C of the following composition:

64 parts by weight of CaCl ₂ (anhydrous in

100 parts by volume of water dissolved, plus 100 parts by volume of HC1 (37%), and

800 parts by volume of ethylene glycol (glycol)

Treated at 40 ° C for 10 minutes. This is followed by rinsing in glycol at room temperature (RT) and then activation in a bath consisting of

0.7 parts by weight of PdCl ₂ ,

7 parts by weight of CaCl ₂ (anhydrous) and 100 parts by volume of glycol.

Residence time in this bath 5 minutes at RT. The flash point of the activation solution is> 100 ° C.

After rinsing again in glycol at RT, the sensitization was carried out at RT in a bath of the following composition:

1.5 parts by weight of dimethylamine borane crystal. (DMAB),

1.5 parts by weight of NaOH biscuits and 100 parts by volume of glycol.

Subsequently, it was rinsed very thoroughly in water at RT and then in a commercially available hypophosphite-containing nickel plating bath from Blasberg AG,

Solingen, nickel-plated at 30 ° C for 15 minutes. It was noticed that the nickel plating was very even. The adhesive strength of the metal pad, determined by the peel force according to DIN 53 494, is> 60 N / 25 mm. The galvanic amplification from the above Polyamide plate for determining the pull-off force was carried out as follows:

a) half a minute of pickling in 10% H ₂ SO, b) rinsing, c) 5 minutes in semi-gloss nickel bath, voltage 9 volts, bath temperature 60 ° C, d) rinsing, e) half a minute of pickling, f) 90 minutes in a copper bath; Voltage 1.9 volts, bath temperature 28 ° C, g) rinsing.

A metal coating with excellent adhesion was obtained. The adhesive strength is according to DIN 53 494 60N / 25 mm.

Alternatively:

A molded part made of a polyamide-6 reinforced with 30% by weight glass fiber was pretreated according to Example 1, activated, sensitized, chemically nickel-plated and then galvanically reinforced. The galvanic layer structure Ni / Cu / Ni / Cr was obtained as follows:

a) Half a minute of pickling in 10% H ₂ SO, b) rinsing, c) 5 minutes in a semi-gloss nickel bath, voltage 4 volts, bath temperature 60 ° C, separated semi-gloss nickel layer: approx. 4 to 5 μ, d) rinsing, e) half a minute of pickling, f) 30 minutes in a copper bath; Voltage 1.9 volts, bath temperature 28 ° C, applied copper layer 15 to 16 μ, g) rinsing. h) half a minute of pickling, i) 8 minutes of bright nickel bath, voltage 5.5 volts, bath temperature 52 ° C, deposited nickel layer: approx. 20 μ, j) rinsing, k) immersion in oxalic acid (0.5% aqueous solution)

1) 3 minutes shiny chrome bath, voltage 4.5 volts, bath temperature 40 ° C, deposited chrome layer: approx. 0.3 μ, m) rinsing, n) detoxification in a 40% bisulfite solution, o) rinsing in distilled water. The shaped body metallized in this way was subjected to the temperature change test in accordance with DIN 53 496, the heat storage taking place at + 110 ° C. and the cold storage at -40 ° C. The metal pad adheres so firmly to the surface of the molded body that it shows no change.

The cheapest process for producing the molded parts is carried out using a two-component injection molding process and subsequent galvanization.

In the past, two-component injection molding was only used to describe the process in which two materials are injected into one another. In the present case, however, it is about two plastics being sprayed onto one another. This process was previously called two-color injection molding. Typewriter keys, switch buttons and the like were preferably produced with it by first injection-molding a cap with a recess in the form of the character to be represented. This was then back-injected with a different colored material, whereby the recess for the sign was filled.

The procedure to be described here is carried out in a similar manner. For the first "shot", a metallizable, non-electrically conductive one is generally used

Plastic used. The MID's trace geometry is shown in relief. In the second shot, the areas between the conductor tracks are filled with a plastic that cannot be metallized.

Alternatively, the conductor track structure can be injected as a depression from the non-metallizable component in the first shot and filled with the metallizable component in the second shot. After the second shot, the MID base part has its final geometric shape, and the metallizable component is metallized in the subsequent steps. Two-component injection molding offers the greatest geometric freedom of all MID manufacturing processes. Difficult conductor track geometries and plated-through holes can be realized in this process. The structuring of the conductor track geometry takes place during the injection molding. The smallest trace width is 0.25 mm. It depends on the flow properties of the plastic and the

Flow lengths in the tool. Because of the short process chains, there are low unit costs for large series. Different cavities are necessary for the injection of the first and second shot. The plastics used here must have good so-called melt compatibility so that good adhesion results when sprayed on one another.

The two-component injection molding is characterized by the following points:

Greatest geometric freedom of all MID manufacturing processes - Geometric freedom limited only by injection molding

Structuring is carried out using two tool cavities, high currents can be realized, short process chain, low unit costs for large series through-plating without problems

Fine pitch possible

Decorative surfaces possible to a limited extent

use

The components with integrated electrically conductive sections can preferably be used for electrical applications, particularly preferably in vehicle technology, mechanical engineering, computer technology, household electronics, electrical household appliances, lighting technology and installation technology. In principle, however, it is possible to realize all possible design options and thus also all uses that exist for plastic parts with the molded parts according to the invention and the methods according to the invention, including metal surfaces and conductor tracks, for example also snap and locking elements, for example snap hooks for fastening microswitches etc.

Examples

Carrying out the tests (injection molding, metallization) on customary moldings produced in 2-component injection molding for 3-D MID applications such as, for example, connector board (Plastics in Practice 1/98, Bayer AG Leverkusen, edition April 30, 1998, KU 1 1501-9804 d , e / 4822818, p. 17), circuit board for sunroof control (anticipation of the future: Bayer thermoplastics for 3-D MID technology, Bayer AG Leverkusen, KU 46052d / 4260437, edition 03.97, p. 7) or lamp holder - slabs.

The two components were processed under the conditions customary for the respective molding compositions (PA: ISO 1874; PBT: ISO 7792).

General for PA6: melt temperature 260 - 280 ° C, mold temperature approx. 70 - 90 ° C.

General for PBT: melt temperature 240 - 280 ° C, mold temperature approx. 70 - 90 ° C. General for PET: melt temperature 270 - 310 ° C, mold temperature 80 - 140 ° C.

Polyester grades that were tested for the ability to be galvanized using the Baygamid method using the injection-molded test specimens (60 * 40 * 4 mm ³ ) under the conditions customary for PA and show good results:

Pocan B3235: 30% glass fiber (PBT, MHMR, 10 - 100, GF 30) Pocan B4235: 30% glass fiber, flame retardant (PBT, MFHR, 10 - 110, GF 30)

Pocan KU2-7033: 30% glass fiber, elastomer modified (PBT, MHPR, - 080, GF 30) None of the three types can be galvanized. AFM images do not indicate serious changes in the surface.

Reinforced polyester grades that also show good results: Pocan B3215: 10% glass fiber (PBT, MHMR, 10 - 070, GF 10) Pocan KL 1-7265: 15% glass fiber (PBT, MHMR, 10 -0 60, GF 15) Pocan B3225: 20% glass fiber (PBT, MHMR , 10 - 070, GF 20) Pocan B4225: 20% glass fiber, flame retardant (PBT, MFHR, 10 - 070, GF 20)

Unreinforced polyester types that can also be used in principle:

Pocan B1305: Medium viscosity (PBT, MHMR, 10 - 030, N) Pocan B1505: Medium to high viscosity (PBT, MHMR, 14 - 030, N) Pocan B 1800: High viscosity (PBT, EN, 16 - 030)

Metallizability or galvanizability of polyamide types or Durethan types according to the Baygamid® process:

Excellent galvanizability (particularly good adhesive strength between metal and polyamide) shows e.g. following polyamide types or Durethan types on:

Durethan BKV 130: 30% glass fiber, elastomer modified; Molding compound set according to ISO 1874: PA6, MPR, 14-090, GF30

Durethan BKV 115: 15% glass fiber, elastomer modified, molding compound set according to ISO 1874: PA6, MPR, 14-060, GF15

Very good galvanizability e.g. following polyamide types or Durethan types on:

Durethan BKV 230: PA 6 injection molding grade with 30% glass fibers, elastomer modified, molding compound set according to ISO 1874: PA6, MPR, 14-080, GF30 Durethan BKV 215: PA 6 injection molding grade with 15% glass fibers, elastomer modified, molding compound set according to ISO 1874: PA6, MPR, 14-040, GF15

Durethan BKV 30 H1.0: PA 6 injection molding grade with 30% glass fibers, heat stabilized, molding compound set according to ISO 1874: PA6, MHR, 14-100, GF30

Durethan AKV 30: PA 66 injection molding grade with 30% glass fibers; Molding compound set according to ISO 1874: PA66, MR, 14-090, GF30

Durethan B 30 S: PA 6 standard injection molding type, good flow, easy release, quick setting; ; Molding compound set according to ISO 1874: PA6, MR, 14-030, N

Durethan A 30 S: PA 66 standard injection molding type, unreinforced, very good release properties; Molding compound set according to ISO 1874: PA66, MR, 14-040N

The molded parts according to the invention show advantages in three established tests for MID.

Adhesive strength

Adhesion of a layer consisting of 2 μm chemical nickel (stop layer) and

40 μm galvanic copper according to DIN 53 494. The adhesive strength of metal layers on plastics is tested according to this standard. In the present case, the test directly indicates the adhesive strength of chemical nickel on the polyamide component. The adhesion was more than 40 N / 25 mm.

Temperature change tests

The layer system 2 μm chemical nickel (stop layer) and 10 μm chemical nickel (top layer) were examined under different conditions. Scoring test

With a carbide pencil, two parallel lines are scratched into the surface at a distance of two millimeters, two further lines are scratched at the same distance perpendicular to it. The squares enclosed by the lines must not flake off in this test.

The layer system 2 μm chemical nickel (stop layer) and 10 μm chemical nickel (top layer) passed the test.

There were particular advantages in the tests on moldings produced in 2K injection molding of the following material combinations.

The examples showed particular advantages of the process

100% non-galvanizability of Pocan by the Baygamid process, both for unreinforced, reinforced, elastomer-modified and / or flame-retardant types.

In comparison to PA 12 only very low water absorption of polyesters (PBT).

- When using PBT and PA6 compounds with similar shrinkage values (adjustable by adjusting the amount of filler), the combination PBT / PA6 shows no demolding problems in 2K injection molding and no crunching noises when the moldings are twisted, which indicates an extremely good material combination . This also prevents undesired penetration of components of the metallizing baths in the

Contact zone between K (I) and K (II) come. Combination 5 of the table is particularly preferred since Pocan KL 1-7265 and BKV115 have very similar shrinkage values due to the same glass fiber contents.

Claims

claims

1. molding containing at least two thermoplastics K (I) and K (II), characterized in that at least one plastic K (I) is a partially aromatic polyester and at least one plastic K (II) is a polyamide.

2. Molding according to claim 1, characterized in that the plastic or plastics K (I) and the plastics or plastics K (II) are present in a macroscopically phase-separated manner to more than 90% by weight, based on the respective type of plastic.

3. Molding according to at least one of the preceding claims, characterized in that the partially aromatic polyester is selected from the group of the derivatives of polyalkyliderephthalates, preferably selected from the group of polyethylene terephthalates, polytrimethylene terephthalates and polybutylene terephthalates, particularly preferably polybutylene terephthalates, very particularly preferably of polybutylene terephthalate.

4. Molding according to at least one of the preceding claims, characterized in that the polyamide is selected from the group of derivatives of polyamides in which 3 to 8 per polyamide group in the polymer chain

Methylene groups are contained, preferably selected from the group formed from PA6 and PA66, particularly preferably from the group of PA6 and its copolymers.

5. Shaped part according to at least one of the preceding claims, characterized in that part of the surface is metallized and / or galvanized, preferably electrolessly wet-chemical metallized, particularly preferably electrolessly wet-chemical and then electro-electroplated, preferably less than 98%, particularly preferably less than 70%, very particularly preferably less than 40%.

6. Molding according to at least one of the preceding claims, characterized in that only one of the two plastics K (I) and K (II) is metallized, preferably electrolessly wet-chemical metallized, particularly preferably electrolessly wet-chemical and then electrogalvanically metallized, preferably plastic K (II ), particularly preferably the polyamide part of the plastic K (II).

7. Molding according to at least one of the preceding claims, characterized in that the weight ratio between plastic K (I) and K (II) is greater than 10:90, preferably greater than 50:50, particularly preferably greater than 70:30, entirely particularly preferably between 80:20 and 99: 1.

8. Molding according to at least one of the preceding claims, characterized in that one of the two or both plastics or plastic mixtures K (I) or K (II) one or more reinforcing materials V (I) in plastic K (I), or contain one or more reinforcing materials V (II) in plastic K (II), preferably in amounts of between 1 and 50

% By weight, preferably between 2 and 40% by weight, particularly preferably between 5 and 35% by weight, in each case based on the total mass of the respective plastic molding compositions.

9. Molding according to at least one of the preceding claims, characterized in that both plastics contain reinforcing materials, preferably in the weight ratio V (I) to V (II) between 90:10 and 10:90, particularly preferably between 70:30 and 30:70 , very particularly preferably between 60:40 and 40:60 and very preferably between 55:45 and 45:55.

10. Shaped part according to at least one of the preceding claims, characterized in that both plastics contain glass fibers, preferably in the weight ratio V (I) to V (II) between 90:10 and 10:90, particularly preferably between 70:30 and 30:70, very particularly preferably between 60:40 and 40:60 and very preferably between 55:45 and 45:55.

11. Molding according to at least one of the preceding claims, characterized in that one of the two or both plastics or plastics mixtures K (I) or K (II) one or more elastomer modifiers E (I) in plastics K (I) , or one or more elastomer modifiers

E (II) in plastic contain KK (II), preferably in amounts of between 0 and 40% by weight, preferably between 0 and 30% by weight, particularly preferably between 3 and 20% by weight, in each case based on the Total mass of the respective plastic molding compound.

12. Shaped part according to at least one of the preceding claims, characterized in that plastic K (I) is a glass fiber reinforced PBT and plastic K (II) is a glass fiber reinforced, elastomer-modified PA, plastic K (I) and K ( II) each preferably contain 10 to 30% by weight of glass fiber and plastic K (II) preferably 3 to 10% by weight elastomer modifier based on the total mass of the respective plastic molding compositions.

13. Molding according to at least one of the preceding claims, characterized in that in addition further conventional additives either in

Plastic K (I) and or in plastic K (II) are contained in amounts of up to 5% by weight, based on the respective plastic.

14. A method for producing a molded part according to at least one of claims 1 to 13, characterized in that (A) is first a plastic

K (I) or K (II) is brought into a shape so that a partial molded body T (I) or T (II) is formed and then (B) the other plastic K (II) or K (I) is attached to at least one point on the surface of the molded part, the method preferably being a two-component injection molding.

15. The method according to claim 14, characterized in that in an additional step part of the surface of the molded body is metallized, preferably electrolessly, wet-chemically metallized, particularly preferably electrolessly wet-chemically and then electrogalvanically metallized, this additional step between steps (A) and (B) or is preferably carried out after the two steps.

16. The method according to at least one of the preceding claims 14 and / or 15, characterized in that the metallization step preferably of the metallizable plastic K (II) contains the following steps: chemical roughening of the surface preferably with a calcium chloride solution, deposition of an activator preferably palladium ions, sensitization preferred by reducing the palladium cations to palladium, chemically depositing a conductive material, preferably nickel or copper, electrochemically converting (galvanizing) and possibly building up further layers.

17. The method according to at least one of the preceding claims 14 to 16, characterized in that it is carried out after at least one two-component injection molding process and subsequent metallization.

18. Use of one of the molded parts according to at least one of claims 1 to 13 and / or at least one process product according to at least one of claims 14 to 17 as a component with integrated electrically conductive sections, preferably in vehicle technology, mechanical engineering, computer technology, household electronics, of electrical household appliances, lighting technology and installation technology.