WO2000050232A1 - Element structure presentant d'excellentes proprietes hydrofuges et son procede de fabrication - Google Patents
Element structure presentant d'excellentes proprietes hydrofuges et son procede de fabrication Download PDFInfo
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- WO2000050232A1 WO2000050232A1 PCT/JP1999/000869 JP9900869W WO0050232A1 WO 2000050232 A1 WO2000050232 A1 WO 2000050232A1 JP 9900869 W JP9900869 W JP 9900869W WO 0050232 A1 WO0050232 A1 WO 0050232A1
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- water
- structural member
- member according
- repellent
- manufacturing
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
- F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/554—Wear resistance
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/726—Permeability to liquids, absorption
- B32B2307/7265—Non-permeable
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2245/00—Coatings; Surface treatments
- F28F2245/04—Coatings; Surface treatments hydrophobic
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/913—Material designed to be responsive to temperature, light, moisture
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
- Y10T428/24364—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.] with transparent or protective coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/268—Monolayer with structurally defined element
Definitions
- the present invention relates to a structural member excellent in water repellency, such as an electric wire, a building material, a ship, an antenna, and an aircraft, and a method for producing the same.
- Conventional technology Conventionally, water repellent treatment has been performed to prevent droplet adhesion and contamination prevention.
- Various water repellents and water repellent treatments have been developed and used for various products including electronic devices.
- Japanese Unexamined Patent Publication No. Hei 3-232040 discloses that a carbon-containing thin film is formed on the surface of an aluminum wire or the like in order to obtain a snow-repellent wire that is difficult to reach, and then the fluorine compound is passed through a fluorine compound ionization space.
- 6-93121 discloses that in order to obtain a member having excellent water-repellent, oil-repellent and antifouling properties, the surface of a base material having an uneven surface using a filler such as FRP or the like is chlorinated. It has been proposed to perform a water / oil repellent treatment by adsorbing a run-based surfactant.
- Japanese Patent Application Laid-Open No. Hei 4-2888349 discloses that fine particles and the like are used to obtain a water- and oil-repellent coating.
- a technique has been proposed in which the surface is roughened by being included in a surface layer or by chemically etching the surface, and a water-repellent polymer layer is chemically bonded to the surface to form a film.
- Japanese Patent Application Laid-Open No. H10-1566282 discloses a water-repellent resin comprising a hydrophobic resin containing fine particle powder on a surface of a metal material having a fine uneven structure of 0.1 to 50. It has been proposed to form a coating. However, this also has a problem that the strength is weak and the water repellency becomes uneven.
- An object of the present invention is to provide a structural member capable of obtaining a super water-repellent function, high durability and abrasion resistance, and a method of manufacturing the same.
- structural member according to one embodiment of the present invention is composed of any irregularity is and what repellent overall height of the convex portion are uniform is formed on the outer surface
- the depth of the concave portion is equal to or more than a predetermined depth.
- the structural member according to another aspect of the present invention is the structural member according to the above (1) or (2), wherein the unevenness is such that the droplet does not fall into the concave portion and the droplet is an air layer having the concave portion. Is in contact with
- a structural member according to another aspect of the present invention is the structural member according to any one of the above (1) to (3), wherein a water-repellent film that is reactively bonded is formed on the uneven portion of the water-repellent structure. so is there.
- the structural member according to another aspect of the present invention is the structural member according to any one of (1) to (3) above, wherein the water-repellent structure is formed by forming irregularities on a substrate having a water-repellent function. It is composed.
- the structural member according to another aspect of the present invention is the structural member according to any one of (1) to (5) above, wherein the unevenness is such that the projections are distributed and arranged, and the projections are linear. Or a grid.
- An electric wire according to another aspect of the present invention has an outer cover made of the structural member of (1) to (6).
- a building material according to another aspect of the present invention has a surface made of the structural member of (1) to (6) above.
- a marine member according to another aspect of the present invention has a surface formed of the structural member of (1) to (6) above.
- An antenna according to another aspect of the present invention has a surface made of the structural member according to any one of (1) to (6).
- An aircraft member according to another aspect of the present invention has a surface composed of the structural member according to any one of the above (1) to (6).
- a method for manufacturing a structural member according to another aspect of the present invention is the method for manufacturing a structural member according to any one of (1) to (6) above, wherein the unevenness of the water-repellent structure is provided with a shape corresponding to the unevenness. It is formed by a mold.
- the method for manufacturing a structural member according to another aspect of the present invention is the manufacturing method according to the above (12), wherein the roller having a shape corresponding to the unevenness of the water-repellent structure is formed on an outer peripheral portion. Press
- the method for producing a structural member according to another aspect of the present invention is the method for producing a structural member according to (12), wherein a shape corresponding to the unevenness of the water-repellent structure is formed on a die formed on an inner peripheral portion before curing. Through the substrate.
- the water-repellent structure is manufactured using one photolithography method and an etching method.
- This etching method is, for example, a trench dry etching method, an anodic electrolytic method, an anisotropic wet etching method, an isotropic wet etching method, or an isotropic dry etching method.
- the height of the projections can be made uniform with high precision by using the photolithography method and the etching method.
- the details including the operation principle of the present invention will be described as a first embodiment described later.
- the concept of super water repellency includes super oil repellency.
- FIG. 1 is an explanatory diagram of a water-repellent structure according to Embodiment 1 of the present invention.
- FIG. 2 is an explanatory diagram of the contact angle of water when the water repellent function is exhibited.
- FIG. 3 is a diagram illustrating dimensions of the concave portion and the convex portion in FIG.
- FIG. 4 is a plan view of the water-repellent structure 100 of FIG.
- FIG. 5 is a cross-sectional view showing a manufacturing process for forming a water-repellent structure on the surface of a plate in the manufacturing method according to Embodiment 2 of the present invention.
- FIG. 6 is a top view of a plate having a water-repellent structure formed on its surface.
- FIG. 7 is a cross-sectional view illustrating a manufacturing process of the plate of Comparative Example 1.
- FIG. 8 is a cross-sectional view illustrating a manufacturing process of the plate of Comparative Example 2.
- FIG. 9 is a cross-sectional view showing a manufacturing process for forming a water-repellent structure on the surface of a plate in the manufacturing method according to Embodiment 3 of the present invention.
- FIG. 10 shows the manufacturing method according to Embodiment 4 of the present invention, in which the surface of the plate is repelled.
- FIG. 11 is a cross-sectional view showing a manufacturing process for forming a water-repellent structure on the surface of a plate in the manufacturing method according to Embodiment 5 of the present invention.
- FIG. 12 is a cross-sectional view showing a manufacturing process for forming a water-repellent structure on the surface of a plate in the manufacturing method according to Embodiment 6 of the present invention.
- FIG. 13 is a cross-sectional view of a power line according to Embodiment 7 of the present invention.
- FIGS. 14 and 15 are a perspective view and a front view of a mechanism for forming a water-repellent structure on a power line by embossing the periphery after drawing.
- FIG. 16 and FIG. 17 are a sectional view showing a mechanism for forming a water-repellent structure on a power line at the time of drawing, and a sectional view of a die thereof.
- FIG. 18 is an explanatory diagram of a building material according to Embodiment 8 of the present invention.
- FIG. 19 is an explanatory diagram when a water-repellent structure is formed by embossing.
- FIG. 20 is a sectional view of a marine vessel according to Embodiment 9 of the present invention.
- FIG. 21 is a perspective view of the antenna according to the tenth embodiment of the present invention.
- FIG. 1 is an explanatory diagram of a water-repellent structure according to Embodiment 1 of the present invention.
- the water-repellent structure 100 has a concave portion 17 and a convex portion 18 formed on the surface of a silicon substrate 11, and a water-repellent film 19 is formed on this surface.
- the silicon substrate 1 1 An air layer 20 is generated in the recess 17 formed on the surface of the substrate.
- an example in which the water-repellent film 19 is formed is shown.
- a substrate having a water-repellent function for example, Teflon resin or the like may be used.
- FIG. 2 is an explanatory diagram of the contact angle of water when the water repellent function is exhibited.
- the water contact angle S in order for the water-repellent function to be exhibited, the water contact angle S must be 120 degrees or more (90 degrees or more in the case of ink droplets). is there.
- the water-repellent structure 100 in FIG. 1 has a water contact angle 0 of 120 degrees or more and exhibits a water-repellent function. It is preferable that the size be such that it can be in contact with the air layer 20 without any problem.
- FIG. 3 is an explanatory diagram of dimensions of the concave portion 17 and the convex portion 18 in FIG.
- A is the protrusion width (depending on the mask design)
- B is the groove width (depending on the mask design)
- C is the processing amount (depending on the depth and etching time)
- D is the sidewall angle (depending on the etching conditions).
- FIG. 4 is a plan view of the water-repellent structure 100 of FIG.
- FIG. (A) shows an example in which the protrusions 18 are regularly distributed
- FIG. (B) shows an example in which the protrusions 18 are arranged in a line
- FIG. This is an example in which the convex portions 18 are arranged in a lattice shape.
- the protruding portion 18 is an example of a quadrangular prism.
- Various pillars such as a cylinder may be used.
- FIG. 5 is a cross-sectional view showing a manufacturing process for forming a water-repellent structure on the surface of the plate
- FIG. 6 is a top view of the plate 1 having a water-repellent structure formed on the surface.
- the manufacturing process will be described with reference to FIGS.
- a case in which the surface of a silicon substrate is processed by a photolithography method and a trench dry etching method to form a water-repellent structure will be described.
- a 4-inch single-crystal silicon wafer with a crystal orientation (100) is prepared as a base material for plate 1, and as shown in Fig. 5 (a), a single-crystal silicon wafer is formed by thermal oxidation.
- a silicon oxide film 12 of about 1000 angstroms is formed on at least one surface of the silicon substrate 11.
- a photosensitive resin 0 FPR-800 (viscosity 30 cps) manufactured by Tokyo Ohka Co., Ltd. is applied on the silicon oxide film 12 of the single crystal silicon substrate 11. About 2 ml, and spin-coat at a speed of 500 rotations per minute for 30 seconds to form a photosensitive resin film 13. Under these spin coating conditions, the photosensitive resin can be applied with an average film thickness of about 1 m and a wafer surface variation of 10%. The coating film thickness is appropriately changed depending on the size of the groove to be processed. The maximum value of the photosensitive material fat coating film thickness is 2 / m when the dimension of one side of the groove is 2 ⁇ m.
- the substrate is dried in an oven at 90 degrees Celsius for 30 minutes, and the substrate 11 is cooled to room temperature.
- a rectangular projected area 13 having a side of 0.2 m to 200 m on the substrate 11 is subjected to photolithography.
- the photosensitive resin is cured in an oven at 120 degrees Celsius to improve the etching resistance.
- the silicon oxide film in the groove planned area is etched with hydrofluoric acid, and the photosensitive resin is removed with a stripper.
- a plasma synthesis film 14 using a gas containing C and F is formed using a trench dry etching apparatus, and then the inside of the dry etching apparatus is evacuated.
- the silicon in the region 15 on the bottom surface of the silicon substrate is etched by plasma of chemical formula SF 6 or CF 4 gas.
- a fluoroalkylsilane or polyfluoroethylene water-repellent material is deposited on the single crystal silicon substrate 11 by a vacuum evaporation method to form a water-repellent film 19 (FIG. 5).
- Example 1 of the present invention an example as shown in Table 1 was tried in Embodiment 2 described above.
- a substrate 11 of a plate a substrate material of samples 1 to 7 is prepared.
- the projected area 13 (see FIG. 5C) is formed by patterning a square of 0.2 m to 100 m.
- the water-repellent film 19 formed on the plate 1 is formed by vapor-depositing a fluoroalkylsilane or a polyfluoroethylene water-repellent material. This water-repellent treatment shall not be performed for Samples 2, 4, and 6. ⁇ table 1 ⁇
- FIG. 7 is a cross-sectional view illustrating a manufacturing process of Comparative Example 1 in which a water-repellent material is applied to a stainless steel plate.
- the substrate 31 is ultrasonically cleaned using an alkaline solvent.
- FIG. 7 (b) Immerse the substrate 31 in a nickel electrolytic plating solution containing polyfluoroethylene fine particles with increased fluorine atom density. Then, as shown in FIG. 7 (b), an eutectoid plating film 33 in which polyfluoroethylene fine particles 34 having an increased fluorine atom density are dispersed is generated on the surface of the substrate 31 by electric plating.
- the plating film 33 contains polyfluoroethylene particles 34 having an increased fluorine element density.
- FIG. 8 is a cross-sectional view showing a manufacturing process in Comparative Example 2 in which a water-repellent material is applied to a polysulfone plate.
- the substrate 41 is Wash.
- Kansai Paint Co., Ltd. product name “Campenirex” fluorine-containing resin
- the coating film 43 is applied as shown in Fig. 8 (b).
- Table 2 shows the results of measuring the contact angles of the surfaces of the plates of Example 1 and Comparative Examples 1 and 2 with water.
- Example 1 As shown in Table 2 above, the contact angles of the plates of Example 1 (Samples 1 to 7) with water all exceeded 120 degrees, which is higher than that of Comparative Example 1. Has been confirmed. Furthermore, according to the durability and scratch resistance tests, it was confirmed that Example 1 (samples 1 to 7) had higher durability and scratch resistance than Comparative Example 2.
- Example 2 of the present invention square pillars having a water-repellent structure, line-shaped and grid-shaped
- the contact angle of water for each projection shape was examined. Table 3 shows the results.
- the contact angle of water according to the present invention (No. 110) was 120 ° or more, and the water repellent function was obtained.
- the comparative example of No. 11 in Table 4 has a water-repellent film formed on a mirror-polished surface (corresponding to the conventional technology), and does not satisfy the requirements for obtaining a water-repellent function.
- FIG. 9 is a cross-sectional view showing another example of a manufacturing process for forming a water-repellent structure on the surface of a plate.
- the surface of a silicon substrate is processed by a photolithography method and an anodic electrolytic method.
- a case where a water-repellent structure is formed will be described.
- a 0.3 m thick silicon nitride film 23, 24 is formed on the silicon substrate 11 as an etching resistant film by a CVD apparatus.
- the silicon nitride film 23 is photo-etched to correspond to the water-repellent recess 17 as shown in FIG. 9 (b).
- the silicon nitride film 24 of the portion 22 to be etched is etched.
- V-groove-shaped etching pyramids 25 were formed on the silicon substrate 11 by anisotropic etching using an aqueous potassium hydroxide solution. As shown in (1), a hedium-tin oxide film (IT0 film) 26 is formed on the back side of the surface on which the silicon nitride film 23 is formed.
- an electrolytic cell was assembled so that the surface on which the silicon nitride film 23 was formed was in contact with the electrolyte, and light was irradiated from the back side of the surface on which the silicon nitride film 23 was formed.
- a groove 27 of about 5 ⁇ m is etched to form a concave portion 17 and a convex portion 18 (FIG. 9 (e)).
- a fluoroalkylsilane or polyfluoroethylene water-repellent material is deposited on a plate by a vacuum deposition method to form a water-repellent film 19 (FIG. 9 (f)).
- FIG. 10 is a cross-sectional view showing another example of the manufacturing process for forming the water-repellent structure on the surface of the plate.
- a case where the surface of a silicon substrate is processed by photolithography and anisotropic wet etching to form a water-repellent structure will be described.
- a 4-inch single crystal silicon wafer having a crystal orientation (100) is prepared as a base material of a plate 1 and, as shown in FIG.
- a silicon oxide film 112 having a thickness of about 1,000 ⁇ is formed on at least one surface of the silicon substrate 111.
- a photosensitive resin 0 FPR-800 (viscosity 30 cps) manufactured by Tokyo Ohka Co., Ltd. Approximately 2 ml of the solution is dropped on the top and spin-coated at 5000 rpm for 30 seconds to form a photosensitive resin layer 113. Under these spin coating conditions, the photosensitive resin can be applied with an average film thickness of about 1 ⁇ m and a wafer surface variation of 10%. The thickness of the applied film is appropriately changed depending on the size of the groove to be processed. The maximum value of the applied thickness of the photosensitive material is 2 m when the dimension of one side of the groove is 2 m.
- the substrate is dried in an oven at 90 degrees Celsius for 30 minutes, and the substrate is cooled to room temperature.
- a rectangular projected area 113 having a side of 0.2 m to 200 m is left on the substrate 111 by photolithographic patterning.
- the photosensitive resin is cured in an oven at 120 degrees Celsius to improve the etching resistance.
- the silicon oxide film in the groove planned area is etched with hydrofluoric acid, and the photosensitive resin is removed with a stripping solution.
- a water-repellent material such as fluoroalkylsilane or polyfluoroethylene is deposited by vacuum evaporation to form a water-repellent film 19 (FIG. 10 (g)).
- a water-repellent material such as fluoroalkylsilane or polyfluoroethylene is deposited by vacuum evaporation to form a water-repellent film 19 (FIG. 10 (g)).
- Embodiment 5 a water-repellent material such as fluoroalkylsilane or polyfluoroethylene is deposited by vacuum evaporation to form a water-repellent film 19 (FIG. 10 (g)).
- FIG. 11 is a cross-sectional view showing another example of the manufacturing process for forming the water-repellent structure on the surface of the plate.
- a case where the surface of a silicon substrate is processed by a photolithography method and an isotropic wet etching method to form a water-repellent structure will be described.
- a glass substrate 211 having a thickness of 200 / m is prepared.
- a 0.3 m thick silicon nitride film 212 is formed on the glass substrate 211 as an etching resistant film by a sputtering apparatus.
- FIG. 12 is a cross-sectional view showing another example of a manufacturing process for forming a water-repellent structure on the surface of a plate.
- photolithography is performed on the surface of the silicon substrate.
- a water-repellent structure is formed by processing by an isotropic dry etching method will be described.
- a glass substrate 311 having a thickness of 200 m is prepared.
- a photosensitive resin film 312 having a thickness of about 5 mm is formed on the glass substrate 311 as an etching resistant film by a spin coater.
- the photosensitive resin film 312 corresponding to the concave portion 17 of the water-repellent structure is etched by photolitho etching.
- etching recesses 3 15 are formed in the glass substrate 3 11 by isotropic plasma etching using CF 4 gas as shown in Fig. 11 (c). I do.
- a fluoroalkylsilane film as a water-repellent film 19 is deposited on the glass substrate 311 by a vacuum deposition method (FIG. 11E). Also in the water-repellent structure produced by the above-described Embodiments 4 to 6, since the height of the convex portion is uniform, the same water-repellent function, durability and scratch resistance as those in Embodiment 2 above are used. Has been confirmed to be obtained. In each of Embodiments 2 to 6, the water-repellent structure is generated by using the photolithography method and the etching method, and the surface of the base material can be replaced with the top surface of the projection. Therefore, the heights of the projections are inevitably aligned with high precision. Embodiment 7.
- FIG. 13 is a sectional view of a power line according to Embodiment 4 of the present invention.
- the power line 50 has a water-repellent structure 5 on the outer surface of the sheath (vinyl) 51 that forms the outer skin. Forming two.
- the outer periphery of the case 51 is embossed after drawing or a groove is formed at the time of drawing.
- FIGS. 14 and 15 are a perspective view and a front view of a mechanism for forming a water-repellent structure 52 on the outer surface by embossing the outer periphery of the sheath 51 after drawing.
- rollers 53a to 53d and mouth rollers 54a to 54d are shifted around the power line 50 in the length direction and the circumferential direction of the power line 50.
- the outer surfaces of the rollers 53a to 53d and the rollers 54a to 54d have irregularities (not shown) for forming the water-repellent structure 52 on the outer surface of the sheath (vinyl) 51. ) Is provided.
- FIG. 16 is an explanatory view showing a mechanism for forming a groove in the sheath 51 at the time of drawing
- FIG. 17 is a cross-sectional view of the die.
- the sheath 55 is formed by coating the vinyl 55 with the die 56, and the unevenness 57 is formed on the inner wall of the die 56 as shown in Fig. 14.
- a water-repellent structure 52 is formed on the outer surface of the sheath 51. It is also possible to draw while rotating the power line 50.
- FIG. 18 is an explanatory drawing of a building material according to Embodiment 8 of the present invention.
- a water-repellent structure 61 is formed on the outer surface of the building material 60.
- a method of performing photolithography and an etching method as described in the above-described Embodiments 2 to 6, a method of embossing the surface of the building material 60, and the like there is ⁇
- FIG. 19 is an explanatory diagram when the water-repellent structure 61 is formed by embossing.
- the building material 60 is composed of, for example, a panel 62 and a thick coating 63 formed on the surface thereof, and before the coating 63 is cured, it is repelled by pressing a mold 64 having irregularities.
- An aqueous structure 61 is formed.
- This mold can also be manufactured by, for example, the manufacturing methods of Embodiments 2 to 6 described above.
- FIG. 20 is a sectional view of a marine vessel according to Embodiment 9 of the present invention.
- Locations that may come in contact with the seawater of this ship 70 such as hatch boats 71, hatchcoming 72, wooden decks 73, handrails 74, bulwark pillars 75, vootawe 76, Bulwork board 77, side rims 78, sideboard slab 79, hull outer skin 80, outer waist 81, hull outer skin 82, car bird 83, sticking keel 84, etc.
- a water-repellent structure similar to that of the above-described embodiment is formed. This water-repellent structure is formed by pressing the mold 64 of FIG.
- Embodiment 10 is a film-like material formed according to the above-described Embodiments 2 to 6.
- the film-like material for example, PTFE (polytetrafluoroethylene) or silicone resin is used.
- FIG. 21 is a perspective view of an antenna (parabona) according to Embodiment 10 of the present invention (a water-repellent structure similar to that of the above-described embodiment is formed on the surface of the antenna 90.
- the structure can be formed by pressing a mold corresponding to the antenna and having the same irregularities as in FIG. 19, or affixing the film-like thing formed by the above-mentioned Embodiments 2 to 6.
- the water-repellent structure may be further subjected to a water-repellent treatment to form a water-repellent film.
- all the structural members of the present invention are applicable as long as they do not like the adhesion of water or oil.
- the structural member of the present invention can be used for an outer wall portion of an aircraft. In that case, icing and snowfall are prevented, and the safety and fuel efficiency of the aircraft are improved.
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU26400/99A AU2640099A (en) | 1999-02-25 | 1999-02-25 | Structure member excellent in water-repellency and manufacturing method thereof |
PCT/JP1999/000869 WO2000050232A1 (fr) | 1999-02-25 | 1999-02-25 | Element structure presentant d'excellentes proprietes hydrofuges et son procede de fabrication |
US09/647,469 US6764745B1 (en) | 1999-02-25 | 1999-02-25 | Structural member superior in water repellency and method for manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP1999/000869 WO2000050232A1 (fr) | 1999-02-25 | 1999-02-25 | Element structure presentant d'excellentes proprietes hydrofuges et son procede de fabrication |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/647,469 A-371-Of-International US6764745B1 (en) | 1999-02-25 | 1999-02-25 | Structural member superior in water repellency and method for manufacturing the same |
US10/814,481 Division US20040191480A1 (en) | 2000-09-27 | 2004-03-31 | Structural member superior in water repellency and method for manufacturing the same |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000050232A1 true WO2000050232A1 (fr) | 2000-08-31 |
Family
ID=14235012
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1999/000869 WO2000050232A1 (fr) | 1999-02-25 | 1999-02-25 | Element structure presentant d'excellentes proprietes hydrofuges et son procede de fabrication |
Country Status (3)
Country | Link |
---|---|
US (1) | US6764745B1 (ja) |
AU (1) | AU2640099A (ja) |
WO (1) | WO2000050232A1 (ja) |
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DE10064520A1 (de) * | 2000-12-22 | 2002-07-04 | Daimler Chrysler Ag | Verfahren zur Herstellung von selbstreinigenden Oberflächenstrukturen |
WO2003037702A1 (en) | 2001-11-02 | 2003-05-08 | Cnt Spolka Z O.O. | Superhydrophobic coating |
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DE10223234A1 (de) * | 2002-05-24 | 2003-12-11 | Max Planck Gesellschaft | Mikrostrukturierung adhäsiver Oberflächen |
WO2004048064A1 (ja) * | 2002-11-27 | 2004-06-10 | Japan Science And Technology Agency | 微細突起構造体及びその製造方法 |
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JP2012013688A (ja) * | 2003-03-31 | 2012-01-19 | Alcatel-Lucent Usa Inc | ナノストラクチャまたはマイクロストラクチャ表面の液体の移動を制御するための方法および装置 |
JP2005000863A (ja) * | 2003-06-13 | 2005-01-06 | Tlv Co Ltd | 気液分離器 |
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JP2005349558A (ja) * | 2004-04-30 | 2005-12-22 | Lucent Technol Inc | 可変な透過率を有するナノ構造化表面 |
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JP7286253B2 (ja) | 2019-10-25 | 2023-06-05 | 株式会社吉野工業所 | 撥液構造及び容器 |
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