WO2000058188B1 - Wafer handling robot having x-y stage for wafer handling and positioning - Google Patents
Wafer handling robot having x-y stage for wafer handling and positioningInfo
- Publication number
- WO2000058188B1 WO2000058188B1 PCT/US2000/006661 US0006661W WO0058188B1 WO 2000058188 B1 WO2000058188 B1 WO 2000058188B1 US 0006661 W US0006661 W US 0006661W WO 0058188 B1 WO0058188 B1 WO 0058188B1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- effector
- stage
- chuck
- bed
- wafer handling
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
Abstract
An apparatus for handling and positioning wafers (34) or other flat objects. The apparatus has an XY stage (24) with an X-drive (26) and a Y-drive (28), and a bed (30) attached to the XY stage. A chuck (37) is disposed on the bed and an effector (38) is attached to the bed. The effector can rotate about an axis of rotation extending in the Z-direction. The effector can pick up objects and place the objects onto the chuck. The effector can also pick up objects from the chuck. Preferably, the chuck has a recessed region (50) for accommodating the effector so that the effector can be inserted under a flat object on the chuck. The X-drive or the Y-drive of the XY stage provides linear motion for the effector so that the effector can pull wafers from a cassette (32) such as used in the semiconductor industry.
Claims
AMENDED CLAIMS
[received by the International Bureau on 10 October 2000 (10.10.00); original claims 21-40 cancelled; remaining claims unchanged (1 page)]
disposed such that the effector may place the flat object onto the chuc .
12. The XY stage of claim 11 further comprising a second effector attached to the bed, wherein the second effector is capable of rotation about a second Z-axis with respect to the bed.
13. The XY stage of claim 12 wherein the second effector is capable of moving in a Z-direction with respect to the bed.
14. The XY stage of claim 13 further comprising a means for moving the second effector between two discrete Z- positions .
15. The XY stage of claim 11 wherein the chuck is a vacuum chuck for receiving flat objects.
16. The XY stage of claim 11 wherein the effector is capable of moving in the Z-direction with respect to the bed.
17. The XY stage of claim 16 further comprising a means for moving the effector between two discrete Z-positions.
18. The XY stage of claim 11 wherein the effector has holes for engaging the flat objects with a vacuum.
19. The XY stage of claim 11 wherein the chuck is capable of moving in the Z-direction.
20. The XY stage of claim 11 wherein the chuck has a recessed region for accommodating the effector .
18
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US27613899A | 1999-03-25 | 1999-03-25 | |
US09/276,138 | 1999-03-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2000058188A1 WO2000058188A1 (en) | 2000-10-05 |
WO2000058188B1 true WO2000058188B1 (en) | 2001-01-11 |
Family
ID=23055346
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2000/006661 WO2000058188A1 (en) | 1999-03-25 | 2000-03-14 | Wafer handling robot having x-y stage for wafer handling and positioning |
Country Status (2)
Country | Link |
---|---|
US (1) | US6811370B2 (en) |
WO (1) | WO2000058188A1 (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2380602B (en) * | 2001-05-19 | 2005-03-02 | Wentworth Lab Ltd | Wafer alignment device |
JPWO2003091741A1 (en) * | 2002-04-25 | 2005-09-02 | 株式会社アドバンテスト | Electronic component testing equipment |
US20060154388A1 (en) * | 2005-01-08 | 2006-07-13 | Richard Lewington | Integrated metrology chamber for transparent substrates |
US7601272B2 (en) * | 2005-01-08 | 2009-10-13 | Applied Materials, Inc. | Method and apparatus for integrating metrology with etch processing |
US20060213537A1 (en) * | 2005-03-23 | 2006-09-28 | Thu Anh To | Vertical wafer platform systems and methods for fast wafer cleaning and measurement |
US7717661B1 (en) * | 2006-05-25 | 2010-05-18 | N&K Technology, Inc. | Compact multiple diameters wafer handling system with on-chuck wafer calibration and integrated cassette-chuck transfer |
US7764366B2 (en) * | 2006-07-11 | 2010-07-27 | Besi North America, Inc. | Robotic die sorter with optical inspection system |
US7962242B1 (en) * | 2008-03-18 | 2011-06-14 | N&K Technology Inc. | Automated spatial flipping apparatus and system for photomasks and photomasks with pellicles |
DE102009018977A1 (en) * | 2009-04-25 | 2010-11-04 | Ev Group Gmbh | Device for aligning and prefixing a wafer |
US20110172952A1 (en) * | 2009-10-05 | 2011-07-14 | Upendra Ummethala | Apparatus and Method for Measuring Position and/or Motion Using Surface Micro-Structure |
CN101898683B (en) * | 2010-03-05 | 2012-07-04 | 东莞宏威数码机械有限公司 | Movable rotary loading mechanism |
JP2013165241A (en) * | 2012-02-13 | 2013-08-22 | Yaskawa Electric Corp | Transporting apparatus |
US11199562B2 (en) | 2019-08-08 | 2021-12-14 | Western Digital Technologies, Inc. | Wafer testing system including a wafer-flattening multi-zone vacuum chuck and method for operating the same |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3902615A (en) * | 1973-03-12 | 1975-09-02 | Computervision Corp | Automatic wafer loading and pre-alignment system |
US4402613A (en) * | 1979-03-29 | 1983-09-06 | Advanced Semiconductor Materials America | Surface inspection system |
DE3219502C2 (en) * | 1982-05-25 | 1990-04-19 | Ernst Leitz Wetzlar Gmbh, 6330 Wetzlar | Device for the automatic transport of disc-shaped objects |
US4818169A (en) * | 1985-05-17 | 1989-04-04 | Schram Richard R | Automated wafer inspection system |
US4886412A (en) * | 1986-10-28 | 1989-12-12 | Tetron, Inc. | Method and system for loading wafers |
US4907931A (en) * | 1988-05-18 | 1990-03-13 | Prometrix Corporation | Apparatus for handling semiconductor wafers |
IL86514A0 (en) * | 1988-05-26 | 1988-11-15 | ||
US4901011A (en) * | 1988-11-04 | 1990-02-13 | Tokyo Electron Limited | Carrier for transferring plate-like objects one by one, a handling apparatus for loading or unloading the carrier, and a wafer probing machine fitted with the handling apparatus for the wafer carrier |
US5479108A (en) * | 1992-11-25 | 1995-12-26 | David Cheng | Method and apparatus for handling wafers |
JPH09107013A (en) * | 1995-10-09 | 1997-04-22 | Dainippon Screen Mfg Co Ltd | Substrate transferer |
US6164894A (en) * | 1997-11-04 | 2000-12-26 | Cheng; David | Method and apparatus for integrated wafer handling and testing |
US6130490A (en) * | 1999-04-06 | 2000-10-10 | Nikon Corporation | X-Y stage with movable magnet plate |
-
2000
- 2000-03-14 WO PCT/US2000/006661 patent/WO2000058188A1/en active Application Filing
- 2000-12-21 US US09/747,201 patent/US6811370B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US6811370B2 (en) | 2004-11-02 |
US20010000721A1 (en) | 2001-05-03 |
WO2000058188A1 (en) | 2000-10-05 |
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