WO2000058803A1 - Temperature control system - Google Patents
Temperature control system Download PDFInfo
- Publication number
- WO2000058803A1 WO2000058803A1 PCT/EP2000/002891 EP0002891W WO0058803A1 WO 2000058803 A1 WO2000058803 A1 WO 2000058803A1 EP 0002891 W EP0002891 W EP 0002891W WO 0058803 A1 WO0058803 A1 WO 0058803A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- temperature
- magnetic sensitive
- sensing
- sensitive elements
- circuitry
- Prior art date
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 32
- 229910052710 silicon Inorganic materials 0.000 claims description 32
- 239000010703 silicon Substances 0.000 claims description 32
- 239000000758 substrate Substances 0.000 claims description 14
- 230000007246 mechanism Effects 0.000 claims description 13
- 230000005855 radiation Effects 0.000 claims description 13
- 238000012545 processing Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 6
- 230000005355 Hall effect Effects 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 230000004044 response Effects 0.000 claims description 3
- 230000010354 integration Effects 0.000 abstract 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 10
- 238000010586 diagram Methods 0.000 description 7
- 230000006870 function Effects 0.000 description 7
- 229910052742 iron Inorganic materials 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011358 absorbing material Substances 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- ORQBXQOJMQIAOY-UHFFFAOYSA-N nobelium Chemical compound [No] ORQBXQOJMQIAOY-UHFFFAOYSA-N 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06F—LAUNDERING, DRYING, IRONING, PRESSING OR FOLDING TEXTILE ARTICLES
- D06F75/00—Hand irons
- D06F75/08—Hand irons internally heated by electricity
- D06F75/26—Temperature control or indicating arrangements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/0215—Compact construction
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/1902—Control of temperature characterised by the use of electric means characterised by the use of a variable reference value
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/27—Control of temperature characterised by the use of electric means with sensing element responsive to radiation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
- G01J5/0846—Optical arrangements having multiple detectors for performing different types of detection, e.g. using radiometry and reflectometry channels
Definitions
- the present invention relates in general to temperature control systems, and in particular to a temperature control system that integrates magnetic sensitive elements and infrared sensor on a single chip for a reliable and cost effective implementation.
- a control knob typically adjusts the target temperature within a given range as determined by the application.
- the temperature of the sole plate is controlled and adjusted to a setting determined by the characteristics of the material to be ironed.
- the electric iron must therefore have the capability to detect the user's requested temperature, measure and control the temperature produced by the iron.
- a temperature control knob To detect the position of a temperature control knob, existing devices typically use a potentiometer whose resistance value changes as the knob is rotated. Thus, by measuring the resistance value of the potentiometer, the device detects the setting of the control knob. While this implementation is relatively cost effective, it has the disadvantage of relying on a physical contact between the fixed resistance element and the wiping element. In an environment where the temperature is very high by the nature of the application, good reliability and accuracy is difficult to achieve at an acceptable cost.
- Another method for temperature control uses a bimetallic strip element in close proximity to the heated parts of the structure. Cost and reliability, however, remain difficult requirement to meet with this type of implementation as well. In the consumer market, the selling price of such products is of paramount importance, and therefore the cost of manufacturing becomes a significant factor.
- the present invention provides an integrated and cost- effective temperature sensor that can both detect the position of a control knob and measure the temperature of the controlled part.
- a control knob there is integrated onto a single piece of silicon a plurality of magnetic sensitive elements and an infrared sensor.
- the magnetic sensitive elements determine the angular position of a magnetic field created by a magnet attached to the control knob. The magnet and its field rotate around the integrated circuit affecting the magnetic sensitive elements variously such that the position of the control knob can be determined.
- the infrared sensor in turn measures the radiation from the temperature controlled part such as to determine its temperature.
- Embodiments of the invention may provide a low cost and robust temperature sensing and control system that is suitable for the consumer market.
- the present invention provides an integrated circuit fabricated on a silicon substrate including a plurality of magnetic sensitive elements; and configured to detect a relative position of an external magnet with respect to the plurality of magnetic sensitive elements, and configured to detect a relative position to an external magnet with respect to the plurality of magnetic sensitive elements; an infrared sensor; and a radiation sensing circuit coupled to the infrared sensor, and configured to detect an amount of radiation from an external heat source.
- the present invention provides a temperature control system including a temperature setting mechanism having a magnet attached thereto; and a silicon die disposed near the magnet, wherein integrated onto a first surface of the silicon die are a plurality of magnetic sensitive elements and an infrared sensor, and wherein the first surface of the silicon die faces toward a source of heat to be controlled and faces away from the magnet.
- Figure 1 shows a general arrangement of a temperature control knob, a magnet and the silicon integrated circuit according to an exemplary embodiment of the present invention
- Figure 2 shows one embodiment of the integrated circuit of the present invention having two linear analog magnetic sensitive elements
- Figure 3 shows magnetic fields created around the magnet for the embodiment of the present invention with two linear magnetic sensitive elements as shown in Figure 2;
- Figure 4 shows another embodiment of the integrated circuit of the present invention having multiple magnetic sensitive elements that are evenly spaced around the center of the silicon die;
- Figure 5 depicts a side view of a temperature sensing system showing the source of heat and the infrared radiation path to the integrated circuit of the present invention
- Figure 6 is a block diagram of a temperature control circuit that interfaces with the analog magnetic sensitive elements of the type shown in Figure 2;
- FIG. 7 is a block diagram of a temperature control circuit that interfaces with the switching magnetic sensitive elements of the type shown in Figure 4;
- Figure 8 shows an exemplary decoding scheme for a temperature control system using four magnetic sensitive elements according to one embodiment of the present invention.
- Figure 9 is a block diagram of a temperature control circuit that interfaces with an infrared sensor according to an exemplary embodiment of the present invention.
- the present invention provides in one embodiment a temperature control system that uses magnetic sensitive elements to detect the location of a heat control knob and an infrared sensor to measure the temperature,
- the magnetic sensitive elements as well as the infrared sensor are integrated onto a single silicon chip, along with interface and control circuitry to yield an efficient and reliable temperature control circuit.
- FIG 1 there is shown a general arrangement of a temperature control knob 100, a magnet 102 and a silicon integrated circuit 106 according to an exemplary embodiment of the present invention.
- temperature control knob 100 is provided to allow the user to adjust the temperature of the device (e.g., an electric iron) to a desired setting
- the device e.g., an electric iron
- Magnetic element 102 is mounted on a shaft 104 integrated with control knob 100 such that it traverses an arc as a function of the setting of control knob 100.
- Silicon chip 106 which includes magnetic sensitive elements as well as the temperature control circuitry, is positioned under the vertical axis of shaft 104 as shown. Accordingly, the arc traverses a course around integrated circuit 106.
- control knob 100 turns, the amplitude of magnetic fields surrounding integrated circuit 106 varies.
- Magnetic sensitive elements integrated onto integrated circuit 106 generate electrical signals in response to the amplitude of the surrounding magnetic fields.
- the signals generated by the magnetic sensitive elements are detected and processed by circuitry on integrated circuit 106 to determine the direction of the magnetic field and therefore the orientation of the control knob.
- the temperature setting is thus detected by determining the orientation of control knob 100.
- the magnetic sensitive elements may be laid out in different arrangements on the substrate of integrated circuit 100. Two exemplary arrangements will be described herein for illustrative purposes.
- two magnetic sensitive elements (MSEs) 200-1 and 200-2 are arranged to lie on preferably orthogonal axes from the center of the traversed arc 202 of magnet 102.
- MSEs 200- 1 and 200-2 output an analog signal whose amplitude varies with the value of the magnetic field 204.
- the magnetic field strength around magnet 102 decreases as the distance between an MSE 200 and magnet 102 increases,
- the variation in field strength 300 as a function of distance from magnet 102 is shown diagrammatically in Figure 3.
- the analog output signal provides an accurate indication of an angle 206 (in Figure 2) between the position of magnet 102 and the axis of MSEs 200-1 and 200-2. Where the angle of rotation of the magnet is desired to cover more than one quadrant then additional MSEs 200 can be used to determine the exact position ' of the control knob.
- MSEs 400 are arranged circularly around the center of silicon die 106.
- MSEs 400 can be simple magnetic sensitive switches of the type that are ON' (i.e., conductive) when the applied magnetic field exceeds a defined threshold, and OFF' in all other circumstances.
- the position and thresholds for MSEs 400 are adjusted such that as magnet 102 traverses arc 202, magnetic field 402 causes MSEs 400 to switch into the ON' state and then the 'OFF' state in sequence ,
- MSEs 400 are designed such that for any position of magnet 102 at least one MSE 400 is in the ON' state. This allows the system to establish the presence or lack of presence of a magnet.
- the position of magnet 102 is given by the one MSE 400 that is in the 'ON' state, while others are in the OFF' state.
- control knob 100 may be constrained to predetermined positions or its movement limited by mechanical end stops operating on the knob or shaft mechanism. Information on such movement restrictions for the temperature control knob may be taken into account electronically within the circuitry to further enhance the accuracy of the device.
- a second function performed by the temperature control system of the present invention is to measure the actual temperature of the device.
- an element 208 that senses infrared (IR) radiation see Figures 2 and 4.
- IR infrared
- FIG 5 there is shown a side view of the system depicting a source of heat 500 (e.g., sole plate of an electric iron), and infrared radiation path 502 to integrated circuit silicon die 106.
- silicon die 106 is mounted with its topside, the side on which the various sensing elements are integrated, facing heat source 500.
- This mechanical arrangement exposes IR sensor 208 directly to heat source 500, allowing an accurate measurement of the temperature by sensing the degree of IR radiation from heat source 500.
- the operation of the magnetic sensitive elements is unaffected by the mechanical inversion of integrated circuit silicon die 106.
- FIG. 6 is a block diagram of the circuitry for the embodiment using two (or more) analog MSEs 200 as shown in Figure 2.
- MSEs 200-1 and 200-2 each have a pair of outputs connecting to a pair of inputs of amplifiers 600-1 and 600-2, respectively.
- each MSE 200 comprises a bridge circuit implemented with Hall effect devices that produces a small differential voltage (e.g., in the millivolts range).
- the output signal from each MSE 200 is amplified to a desired level by amplifiers 600.
- other embodiments for MSEs 200 such as implementations using magnetic sensitive transistors, are also possible. In such alternate embodiments, the use of an amplifier may not be necessary, or the MSE may incorporate the amplification function.
- Processing unit 602 includes circuitry that compares the magnitude of the signals at the outputs of amplifiers 600-1 and 600-2 to one or more predefined threshold or reference signals, or compares them to each other, to determine the position of the knob. Thus, processing unit 602 extracts a value representing the requested temperature based on the amplifiers output signals.
- Processing unit 602 may include analog means wherein the signals are compared by analog circuitry to predetermined levels, or alternatively, it may perform the function digitally by converting the signals into digital form using analog to digital converters and using microprocessor means to determine the arget temperature. In those applications where the system limits the requested temperature to a number of predetermined values by mechanical or electrical means, the complexity of processing unit 602 can be reduced to differentiate between these preset values.
- the circuit further includes a calibration or tuning circuit 604 connected to each amplifier 600-1 and 600-2.
- Calibration circuit 604 presets the parameters of each amplifier to accommodate manufacturing and assembly tolerances, and to compensate for variations in the magnetic field strength of the magnet.
- Amplifier parameters that can be adjusted for the purpose of error correction include amplifier (and sensor) offset, amplifier gain and temperature non-linearities. These parameters can be fine tuned by, for example, programmably inserting well-controlled currents into the amplifier at the relevant nodes of the amplifiers.
- calibration circuit 604 includes user programmable storage elements, such as non-volatile memory cells, for storing the control information for the preset parameters.
- the output of processing unit 602 can be fed into an analog to digital converter ADC 606.
- outputs of amplifiers 600-1 and 600-2 may be digitized by one or more analog to digital converters before being processed by digital processing unit 602.
- FIG. 7 is a block diagram of the circuitry for use with the embodiment having multiple MSEs in switching mode as shown in Figure 4.
- MSEs 400 are each connected via an amplifier 700 to a decoder 702. Based on the 'ON' or 'OFF' state of one (or more) of MSEs 400, decoder 702 determines a value representative of the requested temperature.
- Calibration circuitry 704 and data converter 706 may be combined with the circuit for similar purposes as discussed above in connection with the block diagram of Figure 6.
- FIG 8 shows an example for a decoding technique for a system with four MSEs 400
- a table 800 defines the conditions for selecting any of seven possible temperature settings 802. Assigning binary values "1" and "0" respectively to the ON' and 'OFF' state of each MSE 400 allows for a straightforward decoding of the state of the four MSEs. Note that a binary value is assigned to each of the seven temperature settings Tl through T7 such that a maximum of two adjacent MSEs would be 'ON' at any given time.
- An amplifier 900 receives the signal generated from IR sensor 208, Typical IR sensors have an isolated area covered by heat absorbing material and with embedded thermopiles. The thermopiles respond to the increase in temperature by generating a small voltage. Connecting many in series will generate a signal of few millivolts that represents the temperature of the object. Amplifier 900 conditions the IR sensor output signal and generates an output signal suitable for further processing by the rest of the circuit. Similar to the circuitry for the magnetometers, an optional data converter 902 may be used to generate the signal in the form desired (analog or digital).
- an optional calibration circuit 904 can be connected to amplifier 900 to programmably vary the parameters of the amplifiers to compensate for variations in the radiation parameters of heat source and the sensitivity of the infrared detector.
- the circuit of the present invention provides accurate information on the desired temperature as set by the user and the actual temperature of the device, These two pieces of information are then processed to arrive at the appropriate control signal to adjust the heat source or heating element),
- the control circuitry that controls the heating element based on the detected requested temperature and the measured temperature is well known and therefore not described herein.
- Such control circuitry can be implemented on the same integrated circuit silicon die (106).
- well known protection mechanisms can also be added to assess the state of the signals from the sensors and determine if faults have occurred. Such assessment can be used in the event of faulty signals to override the control circuitry in order to limit the temperature of the heat source and reduce the risk of damage and danger.
- the present invention provides a temperature control system wherein both the sensing of the position of temperature control knob and the sensing of the temperature of the heated part are implemented on a single silicon die. It provides a cost-effective solution to the temperature control requirements of a variety of consumer goods. While the above is a complete description of the preferred embodiment of the present invention, it is possible to use various alternatives, modifications and equivalents. For example, the number and positions of magnetic sensitive elements can vary depending on the application without departing from the spirit of this invention. Therefore, the scope of the present invention should be determined not with reference to the above description but should, instead, be determined with reference to the appended claims, along with their full scope of equivalents.
- non-contact position sensors may be used, for example optical; however magnetic sensors are found particularly robust, particularly in a device subject to elevated temperatures. Provision of a non-contact temperature sensor, particularly an infrared sensor, enables the substrate to be kept at a lower temperature than the temperature being sensed.
- Analog position sensing elements may be used, for example based on one or more Hall sensor, or a plurality of discrete elements may be employed.
- the position sensors may be arranged to sense linear movement, or movement in an arc, of a portion of a control element, preferably a magnet disposed on the control element.
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU49123/00A AU4912300A (en) | 1999-03-31 | 2000-03-31 | Temperature control system |
DE60040654T DE60040654D1 (en) | 1999-03-31 | 2000-03-31 | TEMPERATURE CONTROL SYSTEM |
EP00931052A EP1166191B1 (en) | 1999-03-31 | 2000-03-31 | Temperature control system |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/291,658 US6279832B1 (en) | 1999-03-31 | 1999-03-31 | Temperature control system |
US09/291,658 | 1999-03-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2000058803A1 true WO2000058803A1 (en) | 2000-10-05 |
WO2000058803A9 WO2000058803A9 (en) | 2001-10-25 |
Family
ID=23121249
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2000/002891 WO2000058803A1 (en) | 1999-03-31 | 2000-03-31 | Temperature control system |
Country Status (5)
Country | Link |
---|---|
US (2) | US6279832B1 (en) |
EP (1) | EP1166191B1 (en) |
AU (1) | AU4912300A (en) |
DE (1) | DE60040654D1 (en) |
WO (1) | WO2000058803A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6279832B1 (en) * | 1999-03-31 | 2001-08-28 | Melexis Nv | Temperature control system |
DE10007868B4 (en) * | 2000-02-21 | 2010-02-18 | Robert Bosch Gmbh | Electronic control circuit |
US6552561B2 (en) * | 2000-07-10 | 2003-04-22 | Temptronic Corporation | Apparatus and method for controlling temperature in a device under test using integrated temperature sensitive diode |
US6545494B1 (en) * | 2000-07-10 | 2003-04-08 | Temptronic Corporation | Apparatus and method for controlling temperature in a wafer using integrated temperature sensitive diode |
DE10050074A1 (en) * | 2000-10-10 | 2002-04-18 | Bsh Bosch Siemens Hausgeraete | Refrigeration device with temperature sensor has infrared sensor for detecting operating temperature of refrigeration device, namely operating temperature of inner volume of device |
US6741158B2 (en) * | 2002-07-18 | 2004-05-25 | Honeywell International Inc. | Magnetically sensed thermostat control |
EP3282051A1 (en) * | 2016-08-12 | 2018-02-14 | Laurastar S.A. | Ironing coach |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3325148A1 (en) * | 1982-09-13 | 1984-03-15 | LGZ Landis & Gyr Zug AG, 6301 Zug | Magnetic field sensor |
EP0120260A2 (en) * | 1983-02-18 | 1984-10-03 | Alcatel N.V. | Magnetic field sensor and position sensor incorporating a magnetic field sensor |
US4584552A (en) * | 1982-03-26 | 1986-04-22 | Pioneer Electronic Corporation | Hall element with improved composite substrate |
JPH02155282A (en) * | 1988-12-07 | 1990-06-14 | Sharp Corp | Power semiconductor device |
DE4135086A1 (en) * | 1991-10-16 | 1993-04-22 | Inter Control Koehler Hermann | Room temperature thermostat with manual temp. regulator - has front dial to set desired temp. and infrared sensor scanning emissions from measurement surface inside front panel |
DE29716166U1 (en) * | 1997-09-09 | 1997-10-30 | Karlstroem Gabriele | Temperature control for a temperature-controlled floor covering |
Family Cites Families (27)
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US3979671A (en) | 1975-03-06 | 1976-09-07 | International Business Machines Corporation | Test fixture for use in a high speed electronic semiconductor chip test system |
US3986337A (en) | 1975-06-30 | 1976-10-19 | Signet Optical Company | Thermoelectric heating and cooling apparatus |
US4089184A (en) | 1976-07-26 | 1978-05-16 | Bipol Ltd. | Hand case |
US4134344A (en) | 1977-04-11 | 1979-01-16 | Pullman Incorporated | Railway hopper car door lock |
US4172993A (en) | 1978-09-13 | 1979-10-30 | The Singer Company | Environmental hood for testing printed circuit cards |
US4253515A (en) | 1978-09-29 | 1981-03-03 | United States Of America As Represented By The Secretary Of The Navy | Integrated circuit temperature gradient and moisture regulator |
US4324285A (en) | 1979-03-12 | 1982-04-13 | Martin Marietta Corporation | Apparatus for heating and cooling devices under test |
US4293837A (en) * | 1980-07-23 | 1981-10-06 | The Singer Company | Hall effect potentiometer |
US4426619A (en) | 1981-06-03 | 1984-01-17 | Temptronic Corporation | Electrical testing system including plastic window test chamber and method of using same |
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US6279832B1 (en) * | 1999-03-31 | 2001-08-28 | Melexis Nv | Temperature control system |
-
1999
- 1999-03-31 US US09/291,658 patent/US6279832B1/en not_active Expired - Fee Related
-
2000
- 2000-03-31 DE DE60040654T patent/DE60040654D1/en not_active Expired - Fee Related
- 2000-03-31 AU AU49123/00A patent/AU4912300A/en not_active Abandoned
- 2000-03-31 EP EP00931052A patent/EP1166191B1/en not_active Expired - Lifetime
- 2000-03-31 WO PCT/EP2000/002891 patent/WO2000058803A1/en active Application Filing
-
2001
- 2001-08-06 US US09/923,579 patent/US6467697B2/en not_active Expired - Fee Related
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4584552A (en) * | 1982-03-26 | 1986-04-22 | Pioneer Electronic Corporation | Hall element with improved composite substrate |
DE3325148A1 (en) * | 1982-09-13 | 1984-03-15 | LGZ Landis & Gyr Zug AG, 6301 Zug | Magnetic field sensor |
EP0120260A2 (en) * | 1983-02-18 | 1984-10-03 | Alcatel N.V. | Magnetic field sensor and position sensor incorporating a magnetic field sensor |
JPH02155282A (en) * | 1988-12-07 | 1990-06-14 | Sharp Corp | Power semiconductor device |
DE4135086A1 (en) * | 1991-10-16 | 1993-04-22 | Inter Control Koehler Hermann | Room temperature thermostat with manual temp. regulator - has front dial to set desired temp. and infrared sensor scanning emissions from measurement surface inside front panel |
DE29716166U1 (en) * | 1997-09-09 | 1997-10-30 | Karlstroem Gabriele | Temperature control for a temperature-controlled floor covering |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 014, no. 411 (E - 0973) 5 September 1990 (1990-09-05) * |
Also Published As
Publication number | Publication date |
---|---|
AU4912300A (en) | 2000-10-16 |
EP1166191A1 (en) | 2002-01-02 |
EP1166191B1 (en) | 2008-10-29 |
WO2000058803A9 (en) | 2001-10-25 |
US6467697B2 (en) | 2002-10-22 |
US6279832B1 (en) | 2001-08-28 |
DE60040654D1 (en) | 2008-12-11 |
US20020027166A1 (en) | 2002-03-07 |
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