WO2000063928A1 - Ultra-small resistor-capacitor thin film network for inverted mounting to a surface - Google Patents
Ultra-small resistor-capacitor thin film network for inverted mounting to a surface Download PDFInfo
- Publication number
- WO2000063928A1 WO2000063928A1 PCT/US2000/009580 US0009580W WO0063928A1 WO 2000063928 A1 WO2000063928 A1 WO 2000063928A1 US 0009580 W US0009580 W US 0009580W WO 0063928 A1 WO0063928 A1 WO 0063928A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- capacitor
- layer
- set forth
- circuits
- resistor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
- H01L27/0641—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region without components of the field effect type
- H01L27/0676—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region without components of the field effect type comprising combinations of diodes, or capacitors or resistors
- H01L27/0682—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region without components of the field effect type comprising combinations of diodes, or capacitors or resistors comprising combinations of capacitors and resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
Definitions
- the present invention relates generally to small electronic components adapted to be mounted on a larger circuit board. More particularly, the invention relates to an ultra-small device having multiple circuits of passive components for use in a variety of applications.
- Figures 6A through 6E illustrate successive steps in the manufacture of an array device as in Figure 1 ;
- PZT lead-based dielectrics
- the PZT may be doped with Nb or other suitable dopant, thereby yielding a PNZT material.
- Nb or other suitable dopant
- non-lead materials may also be used as the dielectric in certain embodiments.
- examples of such materials include strontium barium titanate (Sr,Ba)Ti0 3 and bismuth strontium tantalate, Bi 2 SrTa 2 0 9 .
- a pattern 40 comprising a combination of two contiguous materials is formed for each of the RC circuits to be made.
- the above embodiments illustrate substrates which are insulating, or are made insulating before the circuit elements are built up.
- substrates which are insulating, or are made insulating before the circuit elements are built up.
- a conductive substrate it will generally be necessary to isolate some of the circuit elements, such as the resistors, with discrete insulation.
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU42265/00A AU4226500A (en) | 1999-04-16 | 2000-04-10 | Ultra-small resistor-capacitor thin film network for inverted mounting to a surface |
DE10084476T DE10084476T1 (en) | 1999-04-16 | 2000-04-10 | Ultra small resistor-capacitor thin film network for reverse mounting on a surface |
JP2000612968A JP2002542619A (en) | 1999-04-16 | 2000-04-10 | Ultra-small resistor-capacitor thin-film network for inverted surface mounting |
GB0124694A GB2367190B (en) | 1999-04-16 | 2000-04-10 | Ultra-small resistor-capacitor thin film network for inverted mounting to a surface |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/293,817 | 1999-04-16 | ||
US09/293,817 US6285542B1 (en) | 1999-04-16 | 1999-04-16 | Ultra-small resistor-capacitor thin film network for inverted mounting to a surface |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000063928A1 true WO2000063928A1 (en) | 2000-10-26 |
Family
ID=23130711
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2000/009580 WO2000063928A1 (en) | 1999-04-16 | 2000-04-10 | Ultra-small resistor-capacitor thin film network for inverted mounting to a surface |
Country Status (7)
Country | Link |
---|---|
US (1) | US6285542B1 (en) |
JP (1) | JP2002542619A (en) |
CN (1) | CN1350690A (en) |
AU (1) | AU4226500A (en) |
DE (1) | DE10084476T1 (en) |
GB (1) | GB2367190B (en) |
WO (1) | WO2000063928A1 (en) |
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US7301748B2 (en) | 1997-04-08 | 2007-11-27 | Anthony Anthony A | Universal energy conditioning interposer with circuit architecture |
US6018448A (en) * | 1997-04-08 | 2000-01-25 | X2Y Attenuators, L.L.C. | Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
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US6262877B1 (en) * | 1999-11-23 | 2001-07-17 | Intel Corporation | Low inductance high capacitance capacitor and method of making same |
US6489850B2 (en) * | 2001-03-16 | 2002-12-03 | International Business Machines Corporation | Crosstalk suppression in differential AC coupled multichannel IC amplifiers |
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US6897761B2 (en) * | 2002-12-04 | 2005-05-24 | Cts Corporation | Ball grid array resistor network |
US6819569B1 (en) * | 2002-12-06 | 2004-11-16 | Thin Film Technology Corp. | Impedance equalization module |
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US5093774A (en) * | 1991-03-22 | 1992-03-03 | Thomas & Betts Corporation | Two-terminal series-connected network |
US5731747A (en) * | 1995-02-27 | 1998-03-24 | U.S. Philips Corporation | Electronic component having a thin-film structure with passive elements |
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-
1999
- 1999-04-16 US US09/293,817 patent/US6285542B1/en not_active Expired - Fee Related
-
2000
- 2000-04-10 DE DE10084476T patent/DE10084476T1/en not_active Withdrawn
- 2000-04-10 WO PCT/US2000/009580 patent/WO2000063928A1/en active Application Filing
- 2000-04-10 JP JP2000612968A patent/JP2002542619A/en not_active Ceased
- 2000-04-10 AU AU42265/00A patent/AU4226500A/en not_active Abandoned
- 2000-04-10 CN CN00807349.XA patent/CN1350690A/en active Pending
- 2000-04-10 GB GB0124694A patent/GB2367190B/en not_active Expired - Fee Related
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US4251326A (en) * | 1978-12-28 | 1981-02-17 | Western Electric Company, Inc. | Fabricating an RC network utilizing alpha tantalum |
US4410867A (en) * | 1978-12-28 | 1983-10-18 | Western Electric Company, Inc. | Alpha tantalum thin film circuit device |
US4801469A (en) * | 1986-08-07 | 1989-01-31 | The United States Of America As Represented By The Department Of Energy | Process for obtaining multiple sheet resistances for thin film hybrid microcircuit resistors |
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Also Published As
Publication number | Publication date |
---|---|
JP2002542619A (en) | 2002-12-10 |
GB2367190B (en) | 2003-08-27 |
AU4226500A (en) | 2000-11-02 |
GB0124694D0 (en) | 2001-12-05 |
CN1350690A (en) | 2002-05-22 |
DE10084476T1 (en) | 2002-03-14 |
US6285542B1 (en) | 2001-09-04 |
GB2367190A (en) | 2002-03-27 |
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