WO2000068971A2 - Anlage zur bearbeitung von wafern - Google Patents
Anlage zur bearbeitung von wafern Download PDFInfo
- Publication number
- WO2000068971A2 WO2000068971A2 PCT/DE2000/001450 DE0001450W WO0068971A2 WO 2000068971 A2 WO2000068971 A2 WO 2000068971A2 DE 0001450 W DE0001450 W DE 0001450W WO 0068971 A2 WO0068971 A2 WO 0068971A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wafers
- transport
- measuring
- transport containers
- station
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP00940169A EP1177572B1 (de) | 1999-05-07 | 2000-05-05 | Anlage zur bearbeitung von wafern |
JP2000617474A JP2002544661A (ja) | 1999-05-07 | 2000-05-05 | ウェハの処理装置 |
DE50013163T DE50013163D1 (de) | 1999-05-07 | 2000-05-05 | Anlage zur bearbeitung von wafern |
US10/014,245 US6670568B2 (en) | 1999-05-07 | 2001-11-07 | Installation for processing wafers |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19921243A DE19921243C2 (de) | 1999-05-07 | 1999-05-07 | Anlage zur Bearbeitung von Wafern |
DE19921243.0 | 1999-05-07 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/014,245 Continuation US6670568B2 (en) | 1999-05-07 | 2001-11-07 | Installation for processing wafers |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2000068971A2 true WO2000068971A2 (de) | 2000-11-16 |
WO2000068971A3 WO2000068971A3 (de) | 2001-04-26 |
Family
ID=7907409
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2000/001450 WO2000068971A2 (de) | 1999-05-07 | 2000-05-05 | Anlage zur bearbeitung von wafern |
Country Status (7)
Country | Link |
---|---|
US (1) | US6670568B2 (de) |
EP (1) | EP1177572B1 (de) |
JP (1) | JP2002544661A (de) |
KR (1) | KR100444741B1 (de) |
DE (2) | DE19921243C2 (de) |
TW (1) | TW513371B (de) |
WO (1) | WO2000068971A2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1376661A1 (de) * | 2001-03-28 | 2004-01-02 | Kabushiki Kaisha Toshiba | Verarbeitungsvorrichtung und verarbeitungssystem für ein halbleiterbauelement |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10128665A1 (de) * | 2001-06-15 | 2003-01-02 | Infineon Technologies Ag | Verfahren und Vorrichtung zur Bearbeitung von Waferlosen in der Halbleiterfertigung |
KR20030017933A (ko) * | 2001-08-25 | 2003-03-04 | 엘지.필립스 엘시디 주식회사 | 액정디스플레이의 선 분류 장비 |
US20050139525A1 (en) * | 2003-11-28 | 2005-06-30 | Tung-Hung Tsai | Chip sorting apparatus and method for fabricating the same |
US7101138B2 (en) * | 2003-12-03 | 2006-09-05 | Brooks Automation, Inc. | Extractor/buffer |
WO2006013644A1 (ja) * | 2004-08-06 | 2006-02-09 | Hirata Corporation | 生産システム |
TWI275814B (en) * | 2005-07-22 | 2007-03-11 | King Yuan Electronics Co Ltd | Electronic component testing apparatus |
US7501809B2 (en) * | 2005-09-22 | 2009-03-10 | King Yuan Electronics Co., Ltd. | Electronic component handling and testing apparatus and method for electronic component handling and testing |
JP4765899B2 (ja) * | 2006-11-07 | 2011-09-07 | 凸版印刷株式会社 | ガラス基板の移載装置 |
JP4670808B2 (ja) * | 2006-12-22 | 2011-04-13 | ムラテックオートメーション株式会社 | コンテナの搬送システム及び測定用コンテナ |
KR100830838B1 (ko) * | 2006-12-27 | 2008-05-20 | 주식회사 케이씨텍 | 반도체 기판의 습식세정장치 |
JP4877075B2 (ja) * | 2007-05-29 | 2012-02-15 | 東京エレクトロン株式会社 | 塗布、現像装置及び塗布、現像装置の運転方法並びに記憶媒体 |
DE102007025339A1 (de) * | 2007-05-31 | 2008-12-04 | Advanced Micro Devices, Inc., Sunnyvale | Verfahren und System zum Entfernen leerer Trägerbehälter von Prozessanlagen durch Steuern einer Zuordnung zwischen Steuerungsaufgaben und Trägerbehälter |
KR100836070B1 (ko) * | 2007-07-27 | 2008-06-09 | 세메스 주식회사 | 반도체 제조에서의 공정 표시 방법 |
JP5115501B2 (ja) * | 2009-03-12 | 2013-01-09 | 株式会社Ihi | 基板仕分け装置及び基板仕分け方法 |
ITUD20090156A1 (it) * | 2009-09-03 | 2011-03-04 | Applied Materials Inc | Apparato di lavorazione substrati comprendente un dispositivo per la manipolazione di substrati danneggiati |
JP5748452B2 (ja) * | 2010-11-15 | 2015-07-15 | キヤノン株式会社 | 部品組立システム |
DE102016125278A1 (de) * | 2016-12-14 | 2018-06-14 | Schneider Gmbh & Co. Kg | Vorrichtung, Verfahren und Verwendung zur Beschichtung von Linsen |
CN114671232B (zh) * | 2022-04-08 | 2023-07-07 | 珠海格力电器股份有限公司 | 隧道式自动进出箱检漏系统及其工作方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2210996A (en) * | 1987-10-09 | 1989-06-21 | Plessey Co Plc | Contents verification apparatus |
GB2249868A (en) * | 1990-11-15 | 1992-05-20 | Sgs Thompson Microelectronics | A testing and finishing system for integrated circuit package units |
DE19652254C1 (de) * | 1996-12-16 | 1998-03-05 | Herbert Amrhein | Markierungsmittel zur Kennzeichnung der Anschlüsse integrierter elektronischer Bausteine |
US5772387A (en) * | 1994-06-30 | 1998-06-30 | Advantest Corp. | Device transfer apparatus and device reinspection method for IC handler |
US5972727A (en) * | 1998-06-30 | 1999-10-26 | Advanced Micro Devices | Reticle sorter |
WO2000022653A1 (en) * | 1998-10-14 | 2000-04-20 | Asm International N.V. | Sorting/storage device for wafers and method for handling thereof |
DE19962703A1 (de) * | 1998-12-23 | 2000-07-06 | Mirae Corp | Verfahren und Vorrichtung zum Steuern des Beladens/Entladens von Halbleiterbauelementen |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3735449A1 (de) * | 1987-10-20 | 1989-05-03 | Convac Gmbh | Fertigungssystem fuer halbleitersubstrate |
JP3189326B2 (ja) * | 1990-11-21 | 2001-07-16 | セイコーエプソン株式会社 | 生産管理装置および該装置を用いた生産管理方法 |
JP3185595B2 (ja) * | 1995-04-03 | 2001-07-11 | 株式会社ダイフク | 基板仕分け装置を備えた荷保管設備 |
DE19514037C2 (de) * | 1995-04-13 | 1997-09-04 | Leybold Ag | Transportvorrichtung |
US6137303A (en) * | 1998-12-14 | 2000-10-24 | Sony Corporation | Integrated testing method and apparatus for semiconductor test operations processing |
DE19900804C2 (de) * | 1999-01-12 | 2000-10-19 | Siemens Ag | Fördersystem |
US6403905B1 (en) * | 2000-02-02 | 2002-06-11 | Advanced Micro Devices, Inc. | Reticle stocking and sorting management system |
-
1999
- 1999-05-07 DE DE19921243A patent/DE19921243C2/de not_active Expired - Fee Related
-
2000
- 2000-05-05 KR KR10-2001-7014105A patent/KR100444741B1/ko not_active IP Right Cessation
- 2000-05-05 DE DE50013163T patent/DE50013163D1/de not_active Expired - Fee Related
- 2000-05-05 WO PCT/DE2000/001450 patent/WO2000068971A2/de active IP Right Grant
- 2000-05-05 JP JP2000617474A patent/JP2002544661A/ja active Pending
- 2000-05-05 EP EP00940169A patent/EP1177572B1/de not_active Expired - Lifetime
- 2000-07-29 TW TW089108701A patent/TW513371B/zh not_active IP Right Cessation
-
2001
- 2001-11-07 US US10/014,245 patent/US6670568B2/en not_active Expired - Lifetime
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2210996A (en) * | 1987-10-09 | 1989-06-21 | Plessey Co Plc | Contents verification apparatus |
GB2249868A (en) * | 1990-11-15 | 1992-05-20 | Sgs Thompson Microelectronics | A testing and finishing system for integrated circuit package units |
US5772387A (en) * | 1994-06-30 | 1998-06-30 | Advantest Corp. | Device transfer apparatus and device reinspection method for IC handler |
DE19652254C1 (de) * | 1996-12-16 | 1998-03-05 | Herbert Amrhein | Markierungsmittel zur Kennzeichnung der Anschlüsse integrierter elektronischer Bausteine |
US5972727A (en) * | 1998-06-30 | 1999-10-26 | Advanced Micro Devices | Reticle sorter |
WO2000022653A1 (en) * | 1998-10-14 | 2000-04-20 | Asm International N.V. | Sorting/storage device for wafers and method for handling thereof |
DE19962703A1 (de) * | 1998-12-23 | 2000-07-06 | Mirae Corp | Verfahren und Vorrichtung zum Steuern des Beladens/Entladens von Halbleiterbauelementen |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1376661A1 (de) * | 2001-03-28 | 2004-01-02 | Kabushiki Kaisha Toshiba | Verarbeitungsvorrichtung und verarbeitungssystem für ein halbleiterbauelement |
EP1376661A4 (de) * | 2001-03-28 | 2010-03-03 | Toshiba Kk | Verarbeitungsvorrichtung und verarbeitungssystem für ein halbleiterbauelement |
Also Published As
Publication number | Publication date |
---|---|
DE50013163D1 (de) | 2006-08-24 |
EP1177572A2 (de) | 2002-02-06 |
US20020060172A1 (en) | 2002-05-23 |
EP1177572B1 (de) | 2006-07-12 |
DE19921243A1 (de) | 2000-11-16 |
TW513371B (en) | 2002-12-11 |
KR20020010636A (ko) | 2002-02-04 |
JP2002544661A (ja) | 2002-12-24 |
US6670568B2 (en) | 2003-12-30 |
DE19921243C2 (de) | 2002-12-05 |
WO2000068971A3 (de) | 2001-04-26 |
KR100444741B1 (ko) | 2004-08-16 |
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