WO2000072223A1

WO2000072223A1 - A pulse-position system for miniature structures

Info

Publication number: WO2000072223A1
Application number: PCT/US2000/009818
Authority: WO
Inventors: Michael T. Duignan
Original assignee: Potomac Photonics, Inc.
Priority date: 1999-05-24
Filing date: 2000-05-24
Publication date: 2000-11-30
Also published as: AU4974000A

Abstract

Pulse-position synchronization is provided in miniature structure manufacturing processes which is carried out in a fabrication tool (10) having a target (23), a source (11) of energy generating pulses of energy, and a control unit (15) operatively coupled to the source (11) of energy and the target (23). The technique includes the steps of exposing a target (23) to a first pulse of energy, pausing the exposure of the target (23) while providing relative motion between the target (23) and the energy source (11) at a predetermined maximum speed, and slowing (or stopping) relative motion between the target (23) and the energy source (11), while exposing the target (23) to a second pulse of energy. The fabrication tool (10) employing the pulse-position synchronization can be operated by the control unit (15) in either patterned 'additive' or patterned 'subtractive' modes of operation.

Description

A PULSE-POSITION SYSTEM FOR MINIATURE STRUCTURES

REFERENCE TO RELATED PATENT APPLICATIONS

This Utility Patent Application is based on the U.S.

Provisional Application for Patent Serial #60/135,824 filed on May 24, 1999.

FIELD OF THE INVENTION The present invention relates to a method and apparatus for the manufacture of miniature structures. In particular, this invention directs itself to pulse-position synchronization techniques used in Direct Write processes and laser micromachining.

Still further, the present invention relates to a method for pulse-position synchronization in which a target is initially exposed to a first pulse of energy. There is then a pause in the target exposure while the relative position between the target and the energy source is adjusted which permits a pause time to position the next area of the target which is to be exposed. Once positioning of the target has been achieved, the target is exposed to a second pulse of energy. Additionally, the present invention relates to a technique for pulse-position synchronization in a fabrication tool which includes a target, a source of energy, and control unit operatively coupled to the source of energy and to the target. The fabrication tool is operated in patterned "additive" and patterned "subtractive" modes of operation.

With respect to the "additive" mode of operation, the target is a material carrier element which has a deposition layer where predetermined areas are ablated in a patterned manner by pulses of energy generated by the source of energy under the control of a control unit.

The depositable material from the deposition layer of the material carrier element is then deposited on a substrate at certain deposition regions corresponding to the ablated areas of the deposition layer. Thus, miniature structures such as semiconductor chips, electrical and mechanical-electrical elements may be manufactured.

With respect to the "subtractive" mode of operation, the target is a substrate which is exposed to pulses of energy ablating the surface of the substrate in the patterned manner, for cleaning or trimming of the substrate, as well as for creating vias, channels, guides, through holes, etc. BACKGROUND OF THE INVENTION Miniature structures are becoming more widely used as technology advances and more electrical systems are used in miniaturization of common appliances. Such structures may be found in TV sets, radios, cars, kitchen appliances, computers, etc. Due to the advantage of the use of miniature structures in such electrical systems, a great emphasis has been placed on the development of a wide variety of different manufacturing technologies for fabrication of these miniaturized components.

Among others, a Direct Write technology has been developed and successfully applied which uses a laser beam for ablating a source of depositable material. The ablated depositable material from the source is then transferred and deposited at predetermined areas of a workpiece to create miniature structures thereon.

Additionally, a laser micromachining process has been developed which uses a laser beam to ablate predetermined areas of a workpiece to a predetermined depth in order to form vias, through holes, or miniature recesses. This type of process is also applicable to etching, trimming, or cleaning of the workpiece.

In both the Direct Write processes and the laser micromachining processes a careful coordination of motion between all elements of the system, whether substrate motion, laser beam scanning, or combinatorial relative motion thereof is of a vital importance. Specifically, if laser power is maintained in a constant "on" mode during acceleration or deceleration of the relative motion of the substrate and the laser beam a non-constant dose of a depositable material will be delivered to the substrate.

This would interfere with deposition processes resulting in locally varying thickness of the fabricated miniature structures .

Still further, the relative motion between the laser and the substrate must be conducted at a speed of relative motion, since excessive laser dwell may overheat and damage sensitive components already existing on the substrate. In the case of laser micromachining processes, variation of the depth of ablation may result which is unsatisfactory for applications where smooth structures with constant thickness or depth are required for optimum performance.

Commercial systems exist, as, for example, the Aerotech PC-PSO Personal Computer Add-On board, that monitor multi-axis motion and produce position synchronized electrical pulses capable of firing a laser at precise increments of travel. The interval can be software selectable for dynamic control of the deposition process or micromachining process.

As an example, the system can provide generation of laser pulses each 0.25 micrometer of travel in any direction. Such commercially available systems also allow bit mapping laser pulses by clocking out trigger pulses in accordance with a predetermined pattern while scanning the laser or changing a substrate position where an analogous technique is used in laser printer technology. In conventional systems, there has not been found any precise coordination of the relative motion of the target and the laser beam with activation-deactivation of the laser radiation. The failure to provide such coordination may cause the ablation of unintended areas of a target, or deposition of a depositable material on unaimed or unwanted regions. In these cases, the laser pulse may impinge not only onto an area of interest but also onto neighboring regions, thus deteriorating the quality and performance of manufactured miniature structures. Still further in such conventional systems during the

Direct Write processes, successive laser pulses impinge at the source of the depositable material at areas which may be not close enough to each other which results in inefficient use of the depositable material. If the laser pulses impinge onto already ablated area of the source of the depositable material, the depositable material is not delivered to a required area on the substrate which reduces the yield of high quality miniature structures.

Another disadvantage results from impingement of the laser beam on previously ablated areas of the source of a depositable material which causes unwanted direct access of the laser beam to the surface of the substrate. This may have the effect of destroying structures located on the surfaces of the substrate.

From the aforementioned reasons, it is clear that a need exists in miniature structures manufacturing industry for pulse-position synchronization techniques which are free of disadvantages of the devices and systems of the prior art.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a method and apparatus for pulse-position synchronization in miniature structures manufacturing processes in which precise coordination between the relative motion of the elements of the fabrication tool and activation or deactivation of the source of energy is achieved.

It is a further object of the present invention to provide a method of pulse-position synchronization in direct write technology which permits the material carrier element to be advanced between laser pulses to an unexposed spot adjacent to an already ablated area to permit ablation by a next laser pulse, which provides efficient utilization of the depositable material of the deposition layer mounted or located on the material carrier element.

It is another object of the present invention to provide a method for pulse-position synchronization which includes exposing a target to a first pulse of energy. A pause in the exposure is provided while relative motion at a maximum speed between the target and the energy source is introduced. The relative motion speed between the target and the energy source is reduced or terminated while exposing the target to a second pulse of energy. It is still a further object of the present invention to provide a method for pulse-position synchronization in a fabrication tool capable of operating in both patterned "additive" and "subtractive" modes of operation. With respect to the "additive" mode of operation, pulses of energy impinge onto a material carrier element to ablate a deposition layer for transferring a depositable material of the deposition layer onto a substrate. In a "subtractive" mode of operation pulses of energy impinge onto a substrate for micromachining the surface of the substrate according to a desired pattern. In accordance with the present invention a method for pulse position synchronization in miniature structures manufacturing processes is carried out in a fabrication tool capable of operating in a patterned "additive" and "subtractive" modes. The fabrication tool includes a target, a source of energy capable of generating pulses of energy and a control unit operatively coupled to the source of energy and the target.

In the "additive" mode of operation, the target includes a material carrier element having a deposition layer formed thereon which is ablated within predetermined areas upon exposure to pulses of energy in order that the ablated depositable material advances or is transferred from the deposition layer to a substrate for deposition. Alternatively in the "subtractive", i.e., micromachining, mode of operation, the target is a substrate which is ablated at predetermined areas upon exposure to pulses of energy for creating various vias, waveguides, channels, or other patterned recesses.

In both modes of operation pulse-position synchronization is carried out by and within the fabrication tool by: generating a first pulse of energy from a source of energy, exposing the target (at a predetermined area) to the first pulse of energy, terminating the first pulse of energy, initiating relative motion between the target and the source of energy, slowing or terminating relative motion speed between the target and the source of energy, generating a second pulse of energy, and exposing the target (in an area discrete from the first area) to the second pulse of energy.

In the time period defined by the sequential pulses of energy, the relative motion between the target and the source of energy is driven at a high speed. While being exposed to pulses of energy, the relative motion between the target and the source of energy is slowed to less than 10% of the predetermined maximum speed or alternatively the relative motion is terminated. In the "additive" mode of operation, it is important that the second pulse impinges onto a non-ablated area of the deposition layer adjacent to that already ablated by the first pulse of energy. In this manner, efficient utilization of the material of the deposition layer is achieved. The source of energy may be a laser generating a laser beam, sources of electron beams or ion beams. If the source of energy is a laser, preferably an ultraviolet laser is defined. Where a UV laser is used, the material carrier element is made transparent to the ultraviolet radiation to permit the laser beam to impinge directly onto the deposition layer through the material carrier element. The present invention is further directed to a device which monitors the motion of the target and source of energy to produce an output pattern of electrical pulses capable of driving a source of energy to generate pulses of energy or to suppress the same. These electrical pulses are delivered at a rate (or interval) that is a function of the relative position between the target and the source of energy. These and other novel features and advantages of this invention will be fully understood from the following detailed description of the accompanying Drawings. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic representation of the fabrication tool using pulse-position synchronization technique of the present invention; Figure 2 is a schematic representation of the steps of the method for pulse-position synchronization of the present invention;

Figures 3A-3F are schematic diagrams illustrating motion synchronized patterning of laser pulses according to the present invention;

FIG. 4 is an overall block diagram of the apparatus of the present invention;

FIG. 5 is a block diagram of a controller subsystem of the apparatus of the present invention coordinating the substrate motion and laser activation-deactivation;

FIG. 6 is a block diagram of a controller subsystem for laser motion and laser actuation-deactuation control of the apparatus of the present invention; and

FIG. 7 is a flow chart diagram of the computer operational principle of the control unit of the apparatus of the present invention. DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to Figure 1, the fabrication tool system 10 of the present invention includes a source of energy 11 capable of generating pulses of energy 12, a material carrier element 13, a substrate 14, and a control unit 15. The control unit 15 is operatively coupled to the source of energy 11 through a communication channel 16, to the material carrier element 13 through a communication channel 17, and to the substrate 14 through a communication channel 18.

Although the source of energy 11 may be either an ultraviolet laser capable of generating UV laser beams, a source of electron beams, or source of ion beams, for sake of simplicity the UV laser will be further referred herein as the source of energy 11.

The ultraviolet laser 11, such as an excimer laser, may be pulsed preferably at a rate about 10 Hz and may have a pulse width shorter than 10 microseconds.

The material carrier element 13 includes a deposition layer 19 facing the substrate 14. To allow the laser pulses to impinge upon the deposition layer 19, the material carrier element 13 is formed transparent to the ultraviolet radiation.

The deposition layer 19 contains a depositable material, such as powders, metals, composites, alloys, ceramics, and a vaporizable substance which may be a binder, a molecular precursor, and/or a solvent. The vaporizable substance rapidly decomposes when exposed to an energetic pulse to propel the other constituents of the depositable material to the substrate 14. Powders may be composed of a distribution of powder sizes to enable closely packed matrix. Molecular precursors react to produce the externally generated densification energy (thermal or optical) or to produce an exothermic reaction when activated from the source of energy 11. The control unit 15, described in detail in further paragraphs with reference to FIGS. 4-7, is a device that controls the entire operation of the fabrication tool system 10 by changing modes of operation of the fabrication tool system 10 (by either intercepting the material carrier element 13 with the laser pulse or by allowing a direct access of the laser pulse to the surface of the substrate 14) , in combination with synchronizing the relative motion between the target (either the material carrier element in the case of the "additive" mode of operation or the substrate in the case of "subtractive" mode of operation) with the actuating and deactuating of the laser 11. The "additive" process carried out in the fabrication tool 10, is essentially a Direct Write deposition process which may use Matrix Assisted Pulse Laser Evaporation, Laser Induced Forward Transfer or Forward Transfer Processes.

The communication channels 16, 17, and 18 include electromechanical translation units 20, 21, and 22, respectively, which are capable of translating data transmitted from the control unit 15 into mechanical displacement of the laser 11, material carrier element 13 and the substrate 14 in order that the control unit 15 is capable of controlling and driving the motion of the major elements of the fabrication tool 10.

Simultaneously, through the communication channels 16, 17, and 18, the control unit "reads" the positions of the source of energy 11, material carrier element 13, and the substrate 14 so that the control unit 15 monitors on one or more axes, the motion of the laser 11, material carrier element 13 and the substrate 14. By "reading" positions of motors or stages of the units 20, 21, 22, and/or the scanning mirrors of the laser 11, the control unit 15 produces an output pattern of electrical pulses capable of commanding or controlling the laser 11.

The electrical pulses are transmitted through the communication channel 16 to the laser 11 in order to command the control unit 15 for actuation and termination of the laser 11 to generate and/or to terminate laser pulses in precise synchronization with the relative motion of the laser 11, material carrier element 13 and the substrate 14 in a predetermined synchronization pattern. The electrical pulses are delivered at rates (or intervals) that are a function of the position of the laser 11, material carrier element 13, and the substrate 14. Under computer control, prescribing pulsing patterns may be generated by a CAD/CAM program or other control software. Thus, under the control of the control unit 15, the precise location of deposition events or ablating laser pulses can be accomplished.

As shown in Figure 2, the pulse-position synchronization is carried out in the following manner: exposing the target to a first laser pulse from the laser 11, pausing the exposure of the target while providing relative motion between the target and the laser, and substantially stopping relative motion between the target and the laser, exposing the target to a second laser pulse.

With slight modification, the pulse-position synchronization of the present invention may be also carried out in the following manner: exposing a target to a first laser pulse, pausing the exposure of the target while providing relative motion between the target and the laser at a predetermined maximum speed, and substantially slowing (or stopping) the relative motion between the target and the laser, while exposing the target to a second laser pulse. In this process of the relative motion between the target and the laser, can be slowed to less than 10% of the predetermined maximum speed while exposing the target to the second laser pulse. Referring to both Figures 1 and 2, in the "additive" mode of operation (the material carrier element interferes with the laser pulse) the exposure to the first laser pulse takes place at a predetermined area 23 at which the depositable material of the deposition layer 19 is ablated to be transferred to the substrate 14 for deposition thereon as a miniature structure 24. Once the first ablation at the area 23 has been accomplished, the laser pulse is seized by the control unit 15 and the laser 11 moves to another area 25 of the deposition layer 19. It is extremely essential in the fabrication tool 10 of the present invention, that the area 25 is chosen by the control unit 15 to be non-ablated area adjacent to the area 23, thus providing an efficient utilization of the deposition layer 19. After the control unit 15 coordinated the laser 11 with the area 25 of the deposition layer 19, the second laser pulse is generated (relative motion between the laser and the material carrier element is slowed down or stopped completely) and ablates the area 25 of deposition layer 19. The miniature structure 24 created during the patterned "additive" process in the fabrication tool 10 may include an electrical element, mechanical, or electromechanical element, etc. Electrical elements can be formed which would include resistors, capacitors, sensors, inductors, antennae, etc. In the patterned "subtractive" process, when the material carrier element 13 does not intercept with the laser pulses 12, the laser 11 is aligned with a predetermined area of the substrate 14 under the control of the control unit 15, so that the laser pulses 12 impinge directly upon the substrate 14 to create holes, vias 26, channels 27, registration marks, waveguides, gratings, scribe lines. During the "subtractive" (micromachining) process, etching, trimming or cleaning of the substrate can be also performed. The fabrication tool 10 can be used only with a single rough alignment of the elements (substrate, material carrier element, laser) and does not need registration marks, as switching between the patterned "additive" mode and the "subtractive" mode of operation can be completed without removing the substrate 14 from the fabrication tool 10.

The system can operate at any pressure and temperature and may have a controlled atmosphere (oxidizing, reducing or inert) . Referring now to Figures 3A-3F, a stepwise process of motion-synchronized patterning of laser pulses providing for a close packed arrangement of the laser "shots" is carried out as follows. With regard to Figure 3A, an arbitrary area 28 is preselected on the substrate 14 to be filled with laser "shots" in such a way as to leave the smoothest possible surface. This can be accomplished by selecting a suitable pulse spacing D (best shown in FIG. 3C) which is generally less or equal to the laser spot diameter. The laser pulse separation distance D is the same in both X and Y directions. The laser is raster scanned in a pattern shown in Figure 3B which starts at the initial point 29 at the bottom of the area 28 and follows along the line 30 to the right towards the side 31 of the area 28. The centers of laser pulses coincide with the centers of the diagram circles 32. When the last laser shot 33 on the line 30 is made, the laser 11 is deactuated and the relative disposition between the target and the laser changes to align the laser with a line 34 (the dashed line 35 represents change of relative interposition between the target and the laser when the laser is blanked or disabled) . Along the line 34, the laser pulses are sequentially placed onto the area 28 of the target 11 from the side 31 of the area 28 towards the side surface 36 thereof. By pulsing the laser 11 along the line 34 at predetermined pulse spacing D, a row of laser spots 37 is formed at the area 28 of the target. When the last laser spot (adjacent to the side 36 of area 28) on the line 34 is made, the laser 11 is disabled, and the control unit 15 changes a relative disposition between the laser 11 and the target so that to align the laser 11 with a line 38 of the area 28. Again, transition from the line 34 to the line 38 is shown in dashed line 39 representing a change in relative disposition between the laser and the target when the laser is disabled or blanked. The process continues further until the last row 40 of the laser spots 41 is finished. The spot centers are said to be in a close packed arrangement.

Increasing the number of pulses per unit area by a factor of N² can be accomplished while preserving a close packed distribution of laser spots. This can be done by repeating similar scans with the starting point 41 (shown in Figure 3C) offset from the original starting point 29 shown in Figure 3B. The similar scan is repeated as shown in Figures 3D and 3E with starting points 42 and 43, respectively, offset from the starting points 41 and 29. The superimposed pattern of four scans, shown in sequence in Figures 3B-3E, is illustrated in Figure 3F showing a close packed arrangement of the laser shots on the area 28 providing for the smoothest possible surface. This process has been tested by the Applicants of the present Patent Application both for deposition process and for micromachining.

The advantages of the fabrication technique of the present invention have been attained due to the design of the apparatus 10, and particularly due to a functional performance and operational approach of the control unit 15, best shown in Figures 4-7. The control unit 15 coordinates all aspects of deposition/ablation process; provides interfacing for an operator control and monitoring; monitors all critical subsystems (including optical systems) of the apparatus 10 for quality control and safety; provides communication with external systems and data bases, both internal and external; and provides for compatibility with CAD/CAM control. Referring to Figure 4, showing the overall block diagram of the system of the present invention, the control unit 15 includes a main computer 52 and a motion/laser controller 53. The main computer 52 interchanges data with the motion/laser controller 53 through the bi-directional communication channel 57. The motion/laser controller 53, is external or internal to the main computer 52, provides accurate (approximately 1 micron) dynamic closed loop position control of the substrate, material carrier element position, and scanning laser beam. The motion-laser controller 53 moves substrate with high speed (up to 1 meter per second) and accuracy (approximately 1 micron) as well as provides for smoothness of travel for patterned deposition of ablating micromachining.

A substrate fixture 60 provides for holding the substrate reliably, keeps it at required level, controls its temperature as well as atmosphere. The fixture 60 includes stages 62 and 63, best shown in FIGS. 4 and 5, which being controlled by the motion/laser controller 53, provide for a required displacement of the substrate 14 in accordance to a prescribed path, as will be described in detail in further paragraphs with reference to Figure 5. For controlling and monitoring the displacement and position of the substrate 14, the bi-directional communication link 18 operatively couples the stages 62 and 63 of the substrate fixture 60 with the motion/laser controller 53 to convey control signals to the fixture 60 and readings of the position to the motion/laser controller 53.

The motion/laser controller 53 further communicates with the material carrier element 13 through the bi- directional communication channel 17 which has included therein the mechanism 21 responsible for mechanical displacement of the material carrier element 13 either into intercepting position with the laser beam 12 (in the "material transfer" mode of operation) or away from interception with the laser beam 12 (in the "material removal" mode of operation) . The mechanism 21 also changes a position of the material carrier element with regard to the laser beam 12 according to the prescribed path for attaining the effective utilization of the depositable material of the deposition layer 19, deposition of a specific depositable material contained in the deposition layer 19, and deposition of the depositable material on an aimed area of the substrate 14. Depending on the type of the material carrier element 13, the mechanism 21 has distinctive design features adapted for the particular type of the material carrier element, but which in any event, mechanically displaces the material carrier element 13 as prescribed by the motion/laser controller 53 through the channel 17. The mechanism 21 may include "reel-to-reel" mechanism, spinning-sliding vacuum system, or other motion actuating mechanisms.

The control unit 15, as can be seen in Figure 4, is operatively coupled to the laser system 11 through the communication channel 16.

The laser 12 provides focusable pulsed energy source serving to: transfer material from the deposition layer 19 to the substrate 14 in the "material transfer" mode of operation; ablatively remove the material from the surface of the substrate 14 in the "material removal" mode of operation; remove foreign material from the substrate and/or prepare and activate the substrate surface before or after deposition in the "material removal" mode of operation, particularly "cleaning" mode of operation; and shape and refine deposited or existing structures to desired dimensions or values in the "material removal" mode of operation, particularly "laser trimming" mode of operation.

As discussed in the previous paragraphs, the ultraviolet pulsed laser is preferred due to superior ablation characteristics for many materials. Specifically, all solid state frequency tripled neodymium vanadate lasers (radiating at approximately 355 nm) , and frequency quadrupled energy laser (radiating approximately at 266 nm) are preferred because they offer high repetition rates, short pulses, sufficient beam quality, high average power, and superior reliability at low maintenance. The laser beam 12 impinges upon the splitter 65 whereat the laser beam 12 splits into a beam 66 directed to an objective 67 which further focuses the beam 66 and directs the same to either the surface of the material carrier element 13 or to the surface of the substrate 14. The mirror splitter 65 is a highly reflective at laser wavelength but transparent for invisible spectrum for the video system 69. Another portion of the laser beam 12, particularly the beam 68, is directed by the splitter 65 to a video system 69 which includes a video microscope/video camera 70 and a video monitor 71, best shown in Figure 6. The signal from the video microscope/video camera 70 is supplied to a machine vision system 72 for image capture and processing. The video system/machine vision system permits an operator to accurately position substrate for registration and scaling with existing pattern; to measure and inspect the substrate; and to facilitate leveling, focusing and displacement of the substrate and the objective 67 in the direction shown by arrows 73 and 74. The optical subsystem of the apparatus 10 of the present invention which includes the video system 69, video microscope/video camera 70, video monitor 71, and the machine vision system 72 is a well- known machine vision technique and is not intended to be described herein in further detail. The data from the machine vision system 72 are transmitted to the main computer 52 for storing, further processing, and for communication with the motion/laser controller 53 through the communication channel 57 for further control of the relative disposition between the elements of the system 10, as well as actuation-deactuation of the laser 11.

Referring now to Figure 5, showing a block diagram of the substrate motion/laser controller 53 for substrate motion and laser activation-deactivation control, the motion/laser controller 53, either external or internal to the main computer 52, provides accurate (approximately 1 micron) dynamic closed loop position control of the substrate. In this manner, the controller 53 monitors real time position of the substrate and coordinates the same with generating of laser pulses so that the laser pulses can be triggered with very high alignment accuracy.

As best shown in Figure 5, the main computer 52, through the motion-laser controller 53, transmits signals representative of a prescribed path (received from the "Design Concept" block 75 of the Figure 4) which is a

CAD/CAM developed design concept for layout of miniature structures or micromachining layout) is supplied to the motion control board 77 via a channel 78. The motion control board 77 in accordance with the prescribed path controls an X-motor 79 and a Y-motor 80 to force the stages 62 and 63 carrying the substrate 14 to move the same in required direction a required distance. At the same time, an X-encoder 81 is coupled to the X-stage 62, and the Y- encoder 82 is coupled to the Y-stage 63 for measuring X and Y displacements of the stages 62, 63 and translating them into the format understood by the motor control board 77 and the processing block 83. The data from X-encoder 81 and Y-encoder 82 are supplied through the channels 84 and 85, respectively to the motion control board for being processed and used for generating various control signals outputted through outputs 86. These control signals may be further transmitted to the optical system of the laser for controlling the laser shutters, laser optical zoom, aperture selection, etc.

Simultaneously, the data corresponding to X and Y displacements of the stages 62 and 63 are transmitted from the X-encoder 81 and Y-encoder 82 through the communication links 87 and 88, respectively, to the processing block 83 wherein the X and Y displacements are processed and calculated according to the formula ( X² + Y² ) , wherein m X is a displacement of the stage 62, Y is Y displacement of the stage 63 and m is an integer defining the number of pulses for a displacement vector. The data from the processing block 83 is outputted through the channel 89 to a "distance - to pulse out" converter 90. The converter 90 thus receives vector displacement increment and in response thereto, generates trigger pulse which is transmitted to the laser 11 through the line 91 for actuating-deactuating the laser 11. Thus, the laser 11 generates laser beam 12 once a required displacement of the substrate 14 has been attained. The "distance-to-pulse out" converter 90 is a converter manufactured by Aerotech, Inc. for operation of the known micromachining stations.

As was described in previous paragraphs, change of the relative disposition between the laser beam, substrate and/or material carrier element, may be implemented in following three fashions : movement of the substrate with respect to the immovable laser beam; scanning of the laser beam with regard to the substrate and/or material carrier element; and combinatorial motion of the substrate and the laser beam. Thus, when scanning of the laser beam with respect to the substrate and/or material carrier element is chosen for operation, the system 10 of the present invention will operate in accordance with Figure 6, illustrating the motion/laser controller 53, particularly, a subsystem thereof for laser motion and laser actuation-deactuation control. As shown in Figure 6, data representative of the prescribed path 76 are supplied to the motion control board 92 (which may coincide with the motion control board 77) . The motion control board 92, in the manner described with respect to Figure 5, transmits control signal over the line

94 either to the optical system of the laser 11 or to mechanical stages carrying the laser 12 for displacement of the laser beam generated by the laser 11, thus providing scanning of the laser beam over the surface of the material carrier element 13 or the substrate 14. X and Y encoders

95 and 96, or other means sensing displacement of the scanning laser beam receive information from the "optical system/stages" 93 of the laser 11 and transmit this information to a processing block 97 which processes the information received from the encoder 95, 96 either in the same manner as the processing block 83 of Figure 5, or in any other fashion known to those skilled in the art, and outputs the data representative of the displacement of the laser beam through the line 98 to the "distance-to-pulse out" converter 20 which in well-known manner converts the data representative of the displacement of the scanning laser beam into the controlling trigger pulses which are supplied to the laser 11 through the line 100 for actuating/ deactuating the laser 11. The generated laser beam 12 is further directed to the material carrier element 13 or the substrate 14 as described in the previous paragraphs. In this manner, the firing of the laser beam will be coordinated in precise fashion with the scanning of the laser beam with regard to the substrate 14 or the material carrier element 13. The laser beam travels to the target (material carrier elements 13 or the substrate 14) through the objective 67. The objective 67 is provided for final imaging of the UV laser beam and video magnification. The objective 67 is mounted on a focusing stage providing displacement in the direction shown by arrows 73 to permit proper imaging regardless of the substrate height, and regardless of whether the material carrier element is in the beam path. Referring to Figure 7, showing a block diagram of the operational principles of the control unit of the apparatus of the present invention, the flow chart begins with block 110 corresponding to the pre- start-up procedure which includes alignment of the elements (substrate, material carrier element, laser beam) of the system, registration and positioning. Initially, the material carrier element is maintained in an interception path position with the laser. From the block 110, the logic moves to the block 112 "Deposition or subtraction mode?" If a subtraction ("material removal" mode of operation) is chosen, the logic moves to the block 114 "Remove material carrier element from the beam path". In accordance with the command of the block 114, the control unit 15 then outputs a control signal to mechanism 21, best shown in Figure 4, for displacing the material carrier element 13 away from the interception position with the laser beam 12.

From the block 114, the logic moves to the block 116 "Translate substrate (or beam) along prescribed path".

If in the logic block 112, the deposition ("material transfer" mode of operation) is chosen, the logic moves again to the block 116. The logic block 116 receives a desired pattern path which corresponds to the prescribed path 76 best shown in FIGS. 4-6. Thus, upon receiving the desired pattern path, the logic block 116 changes relative disposition between the substrate and the beam in accordance with the prescribed path. From the block 116, the flow chart moves to the logic block 118 "Fire laser at current location?". If the laser has to be fired, i.e., the answer is "Yes", the logic moves to the block 120 "Admit controlled-energy laser pulse". At this instance, the motion/laser controller 53, as best shown in Figures 4-6, "commands" the laser 11 to generate a laser pulse which impinges at a predetermined area of the substrate 14 (in the "material removal" mode of operation) , or the material carrier element 13 (in the "material transfer" mode of operation) . After the laser beam modifies either the deposition layer 19 of the material carrier element 13 or the surface of the substrate 14, the flow chart moves to the logic block 122 "Increment materials carrier position (deposition mode)". In this instance, the control unit 15 deactuates the laser 11, thus seizing the laser beam, and moves the material carrier element 13 to the next position according to the prescribed path 76 if the apparatus 10 operates in the "materials transfer" mode of operation. If however the apparatus 10 operates in the "material removal" mode of operation, the control unit 15 seizes the laser beam and moves the substrate to the next position in accordance with the prescribed path 76. Thus, from the logic block 122, the flow chart returns to the logic block 116, where the translation of the substrate (or the laser beam) is performed in accordance with prescribed path 76. If however the answer to the logic block 118 is "No", meaning that the laser is not to be fired at a current location of the substrate or the laser beam, the logic flows to the block 124 "All Paths Complete?". If the answer is "Yes", the logic flows to the "End Procedure" block 126.

If however, in the logic block 124, it is decided that not all prescribed paths have been yet completed, i.e., the answer is "No", the logic returns to the block 116 to translate the substrate (or the laser beam) along the prescribed path 76 for further leading the operational flow either along the loop comprised of logic blocks 118, 120, 122 and 116; or along the loop comprised of the logic blocks 118, 124, 116, in sequence. As it is clear from the above disclosure, the technique for pulse position synchronization in miniature structure manufacturing processes applied to Direct Write/micromachining technology, can greatly improve uniformity, reproducibility, and overall process control. Known materials used in this invention which are transparent to laser beams include fuse silica, borosilicate glass, polyester films such as Mylar, acrylic as well as a wide variety of other compositions well-known in the art . Although this invention has been described in connection with specific forms and embodiments thereof, it will be appreciated that various modifications other than those discussed above may be resorted to without departing from the spirit or scope of the invention. For example, equivalent elements may be substituted for those specifically shown and described, certain features may be used independently of other features, and in certain cases, particular locations of elements may be reversed or interposed, all without departing from the spirit or scope of the invention as defined in the appended Claims.

Claims

WHAT IS CLAIMED IS: 1. A method for pulse-position synchronization in miniature structures manufacturing processes, comprising the steps of: (a) providing a fabrication tool, including: a target, a source of energy capable of generating pulses of energy, and control means operatively coupled to said source of energy and said target;

(b) generating a first pulse of energy from said source of energy;

(c) exposing said target to said first pulse of energy; (d) terminating said first pulse of energy;

(e) initiating relative motion between said target and said source of energy;

(f) slowing said relative motion between said target and said source of energy; (g) generating a second pulse of energy; and

(h) exposing said target to said second pulse of energy.

2. The method of Claim 1, wherein in said step (e) , said relative motion between said target and said source of energy is performed at a predetermined maximum speed.

3. The method of Claim 2, wherein in said step (f) , said relative motion between said target and said source of energy is slowed to less than 10% of said predetermined maximum speed while performing said step (h) .

4. The method of Claim 1, wherein in said step (f) , said relative motion between said target and said source of energy is slowed to a complete stop prior to exposure of said target to said second pulse generation.

5. The method of Claim 1, wherein in said step (e) , said relative motion between said target and said source of energy is initiated after said first pulse of energy has been substantially ceased.

6. The method of Claim 1, further comprising the steps of: by means of said control means operating said fabrication tool in either of an additive mode of operation and a subtractive mode of operation.

7. The method of Claim 6, further comprising the steps of: providing a material carrier element in the additive mode of operation having a deposition layer thereon, said material carrier element constituting said target; and in said step (c) , exposing a predetermined first area of said deposition layer to said first pulse of energy, thus ablating said deposition layer at said predetermined first area thereof.

8. The method of Claim 7, further including the steps of in said step (h) , exposing a non-ablated second area of said deposition layer to said second pulse of energy.

9. The method of Claim 8, wherein said non-ablated second area is located adjacent to said predetermined first area of said deposition layer.

10. The method of Claim 9, further comprising the steps of: providing a substrate spaced from said material carrier element, and transferring a depositable material of said deposition layer ablated from either of said first and second areas thereof to said substrate for deposition thereon at locations substantially corresponding to said first and second areas of said deposition layer of said material carrier element.

11. The method of Claim 7, wherein said source of energy includes an ultraviolet laser, and wherein said material carrier element is transparent to the ultraviolet radiation.

12. The method of Claim 6, wherein said target is a substrate in said subtractive mode of operation.

13. A method for pulsing position synchronization in miniature structures manufacturing processes, comprising the steps of: providing a target, providing a source of energy, generating from said source of energy at least a first pulse of energy and a second pulse of energy from said source of energy capable of ablating said target upon exposure thereto,

exposing said target to said first pulse of energy at a predetermined first area of said target, initiating a relative motion between said target and said source of energy while pausing said exposure of said target to said first pulse of energy, substantially terminating said relative motion between said target and said source of energy, and exposing said target to said second pulse of energy at a second area of said target.

14. The method of Claim 13, wherein said target includes a material carrier element having a deposition layer disposed thereon, said method further comprising the steps of: changing the relative disposition between said material carrier element and said source of energy for finding a non-ablated said second area or said deposition layer adjacent to said predetermined first area.

15. The method of Claim 14, further comprising the steps of: providing a substrate spaced from said material carrier element, and depositing a depositable material ablated from said deposition layer of said material carrier element at respective areas of said substrate corresponding to said predetermined first area and said second area of said material carrier element, thereby creating miniature structures on said substrate.

16. The method of Claim 13, wherein said target includes a substrate, said method further comprising the step of: ablating said substrate at said first and second areas thereof thereby providing a patterned micromachining of said substrate.