WO2000073905A3 - Test interface for electronic circuits - Google Patents
Test interface for electronic circuits Download PDFInfo
- Publication number
- WO2000073905A3 WO2000073905A3 PCT/US2000/014768 US0014768W WO0073905A3 WO 2000073905 A3 WO2000073905 A3 WO 2000073905A3 US 0014768 W US0014768 W US 0014768W WO 0073905 A3 WO0073905 A3 WO 0073905A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- parallel interface
- interconnecting
- structures
- massively parallel
- assemblies
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
Abstract
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020017015187A KR20020028159A (en) | 1999-05-27 | 2000-05-26 | Massively parallel interface for electronic circuit |
US09/979,551 US6812718B1 (en) | 1999-05-27 | 2000-05-26 | Massively parallel interface for electronic circuits |
AU51718/00A AU5171800A (en) | 1999-05-27 | 2000-05-26 | Massively parallel interface for electronic circuit |
JP2001500957A JP2003501819A (en) | 1999-05-27 | 2000-05-26 | Massively parallel processing interface for electronic circuits |
EP00936397A EP1183604A2 (en) | 1999-05-27 | 2000-05-26 | Test interface for electronic circuirts |
US10/918,511 US7009412B2 (en) | 1999-05-27 | 2004-08-12 | Massively parallel interface for electronic circuit |
US11/327,728 US7138818B2 (en) | 1999-05-27 | 2006-01-05 | Massively parallel interface for electronic circuit |
US11/555,603 US7403029B2 (en) | 1999-05-27 | 2006-11-01 | Massively parallel interface for electronic circuit |
US11/692,138 US20070245553A1 (en) | 1999-05-27 | 2007-03-27 | Fine pitch microfabricated spring contact structure & method |
US12/175,393 US7772860B2 (en) | 1999-05-27 | 2008-07-17 | Massively parallel interface for electronic circuit |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13663799P | 1999-05-27 | 1999-05-27 | |
US60/136,637 | 1999-05-27 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09979551 A-371-Of-International | 2000-05-26 | ||
US10/918,511 Division US7009412B2 (en) | 1999-05-27 | 2004-08-12 | Massively parallel interface for electronic circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2000073905A2 WO2000073905A2 (en) | 2000-12-07 |
WO2000073905A3 true WO2000073905A3 (en) | 2001-09-07 |
Family
ID=22473706
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2000/014768 WO2000073905A2 (en) | 1999-05-27 | 2000-05-26 | Test interface for electronic circuits |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1183604A2 (en) |
JP (1) | JP2003501819A (en) |
KR (1) | KR20020028159A (en) |
AU (1) | AU5171800A (en) |
WO (1) | WO2000073905A2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7355420B2 (en) | 2001-08-21 | 2008-04-08 | Cascade Microtech, Inc. | Membrane probing system |
US7420381B2 (en) | 2004-09-13 | 2008-09-02 | Cascade Microtech, Inc. | Double sided probing structures |
US9429638B2 (en) | 2008-11-21 | 2016-08-30 | Cascade Microtech, Inc. | Method of replacing an existing contact of a wafer probing assembly |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5914613A (en) | 1996-08-08 | 1999-06-22 | Cascade Microtech, Inc. | Membrane probing system with local contact scrub |
US6812718B1 (en) | 1999-05-27 | 2004-11-02 | Nanonexus, Inc. | Massively parallel interface for electronic circuits |
US6578264B1 (en) * | 1999-06-04 | 2003-06-17 | Cascade Microtech, Inc. | Method for constructing a membrane probe using a depression |
US6358103B1 (en) * | 1999-08-02 | 2002-03-19 | Swenco Products, Inc. | No-crimp electrical connector side-by-side type |
JP2004501517A (en) * | 2000-06-20 | 2004-01-15 | ナノネクサス インコーポレイテッド | System for testing and packaging integrated circuits |
US6621280B1 (en) * | 2000-06-27 | 2003-09-16 | Agere Systems Inc. | Method of testing an integrated circuit |
US7102367B2 (en) | 2002-07-23 | 2006-09-05 | Fujitsu Limited | Probe card and testing method of semiconductor chip, capacitor and manufacturing method thereof |
US6835589B2 (en) * | 2002-11-14 | 2004-12-28 | International Business Machines Corporation | Three-dimensional integrated CMOS-MEMS device and process for making the same |
US7057404B2 (en) * | 2003-05-23 | 2006-06-06 | Sharp Laboratories Of America, Inc. | Shielded probe for testing a device under test |
JP4727948B2 (en) | 2004-05-24 | 2011-07-20 | 東京エレクトロン株式会社 | Multilayer substrate used for probe card |
US7375542B2 (en) * | 2004-06-30 | 2008-05-20 | Teradyne, Inc. | Automated test equipment with DIB mounted three dimensional tester electronics bricks |
KR100689023B1 (en) * | 2005-06-29 | 2007-03-02 | 주식회사 크라또 | Probe unit and method for fabricating thereof |
US7782072B2 (en) * | 2006-09-27 | 2010-08-24 | Formfactor, Inc. | Single support structure probe group with staggered mounting pattern |
DE102006059429A1 (en) * | 2006-12-15 | 2008-06-26 | Atg Luther & Maelzer Gmbh | Module for a test device for testing printed circuit boards |
KR20100005067A (en) * | 2007-03-13 | 2010-01-13 | 가부시키가이샤 아드반테스트 | Tcp handling device |
JP5258395B2 (en) * | 2008-06-03 | 2013-08-07 | 株式会社日本マイクロニクス | Probing device |
US8441808B2 (en) * | 2010-09-22 | 2013-05-14 | Palo Alto Research Center Incorporated | Interposer with microspring contacts |
JP6563317B2 (en) * | 2015-11-25 | 2019-08-21 | 新光電気工業株式会社 | Probe guide plate, manufacturing method thereof, and probe apparatus |
US10514391B2 (en) * | 2016-08-22 | 2019-12-24 | Kla-Tencor Corporation | Resistivity probe having movable needle bodies |
CN107237859A (en) * | 2017-07-24 | 2017-10-10 | 江苏方正环测设备有限公司 | A kind of bump testing machine damping |
KR102133675B1 (en) * | 2019-07-03 | 2020-07-13 | 주식회사 새한마이크로텍 | Test socket |
KR102164378B1 (en) * | 2019-07-17 | 2020-10-12 | 윌테크놀러지(주) | Probe card having board type space transformer |
JP2021076486A (en) * | 2019-11-11 | 2021-05-20 | 株式会社日本マイクロニクス | Electrical connection device |
CN113474663A (en) | 2019-12-18 | 2021-10-01 | 爱德万测试公司 | Automatic test equipment for testing one or more devices under test and method of operating automatic test equipment |
JP7217293B2 (en) * | 2019-12-18 | 2023-02-02 | 株式会社アドバンテスト | Automatic test equipment for testing one or more devices under test, and method for operating the automatic test equipment |
KR102075484B1 (en) * | 2019-12-30 | 2020-02-10 | 윤찬 | Socket for testing semiconductor |
KR102554635B1 (en) * | 2021-04-12 | 2023-07-13 | (주)이즈미디어 | Socket opening device for camera module inspection |
CN115236360B (en) * | 2022-09-21 | 2022-11-22 | 百信信息技术有限公司 | Improved multipurpose test special vehicle |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3630548A1 (en) * | 1986-09-08 | 1988-03-10 | Mania Gmbh | DEVICE FOR ELECTRONICALLY CHECKING CIRCUITS WITH CONTACT POINTS IN 1/20 INCH GRID |
US4924589A (en) * | 1988-05-16 | 1990-05-15 | Leedy Glenn J | Method of making and testing an integrated circuit |
EP0369112A1 (en) * | 1988-11-12 | 1990-05-23 | MANIA GmbH & Co. | Adapter for electronic test devices for printed-circuit boards and the like |
US5144228A (en) * | 1991-04-23 | 1992-09-01 | International Business Machines Corporation | Probe interface assembly |
EP0623826A1 (en) * | 1993-04-29 | 1994-11-09 | Hughes Aircraft Company | Membrane connector with stretch induced micro scrub |
WO1996015458A1 (en) * | 1994-11-15 | 1996-05-23 | Formfactor, Inc. | Probe card assembly and kit, and methods of using same |
US5600257A (en) * | 1995-08-09 | 1997-02-04 | International Business Machines Corporation | Semiconductor wafer test and burn-in |
US5828226A (en) * | 1996-11-06 | 1998-10-27 | Cerprobe Corporation | Probe card assembly for high density integrated circuits |
US5848685A (en) * | 1995-06-07 | 1998-12-15 | Xerox Corporation | Photolithographically patterned spring contact |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59187144U (en) * | 1983-05-31 | 1984-12-12 | 株式会社東芝 | Test equipment for semiconductor devices |
JPH06151532A (en) * | 1992-11-13 | 1994-05-31 | Tokyo Electron Yamanashi Kk | Prober |
JP2995134B2 (en) * | 1993-09-24 | 1999-12-27 | 東京エレクトロン株式会社 | Probe device |
-
2000
- 2000-05-26 JP JP2001500957A patent/JP2003501819A/en not_active Ceased
- 2000-05-26 EP EP00936397A patent/EP1183604A2/en not_active Withdrawn
- 2000-05-26 KR KR1020017015187A patent/KR20020028159A/en not_active Application Discontinuation
- 2000-05-26 AU AU51718/00A patent/AU5171800A/en not_active Abandoned
- 2000-05-26 WO PCT/US2000/014768 patent/WO2000073905A2/en not_active Application Discontinuation
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3630548A1 (en) * | 1986-09-08 | 1988-03-10 | Mania Gmbh | DEVICE FOR ELECTRONICALLY CHECKING CIRCUITS WITH CONTACT POINTS IN 1/20 INCH GRID |
US4924589A (en) * | 1988-05-16 | 1990-05-15 | Leedy Glenn J | Method of making and testing an integrated circuit |
EP0369112A1 (en) * | 1988-11-12 | 1990-05-23 | MANIA GmbH & Co. | Adapter for electronic test devices for printed-circuit boards and the like |
US5144228A (en) * | 1991-04-23 | 1992-09-01 | International Business Machines Corporation | Probe interface assembly |
EP0623826A1 (en) * | 1993-04-29 | 1994-11-09 | Hughes Aircraft Company | Membrane connector with stretch induced micro scrub |
WO1996015458A1 (en) * | 1994-11-15 | 1996-05-23 | Formfactor, Inc. | Probe card assembly and kit, and methods of using same |
US5848685A (en) * | 1995-06-07 | 1998-12-15 | Xerox Corporation | Photolithographically patterned spring contact |
US5600257A (en) * | 1995-08-09 | 1997-02-04 | International Business Machines Corporation | Semiconductor wafer test and burn-in |
US5828226A (en) * | 1996-11-06 | 1998-10-27 | Cerprobe Corporation | Probe card assembly for high density integrated circuits |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7355420B2 (en) | 2001-08-21 | 2008-04-08 | Cascade Microtech, Inc. | Membrane probing system |
US7420381B2 (en) | 2004-09-13 | 2008-09-02 | Cascade Microtech, Inc. | Double sided probing structures |
US8013623B2 (en) | 2004-09-13 | 2011-09-06 | Cascade Microtech, Inc. | Double sided probing structures |
US9429638B2 (en) | 2008-11-21 | 2016-08-30 | Cascade Microtech, Inc. | Method of replacing an existing contact of a wafer probing assembly |
Also Published As
Publication number | Publication date |
---|---|
WO2000073905A2 (en) | 2000-12-07 |
EP1183604A2 (en) | 2002-03-06 |
JP2003501819A (en) | 2003-01-14 |
KR20020028159A (en) | 2002-04-16 |
AU5171800A (en) | 2000-12-18 |
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