US5914613A
(en)
|
1996-08-08 |
1999-06-22 |
Cascade Microtech, Inc. |
Membrane probing system with local contact scrub
|
US6256882B1
(en)
|
1998-07-14 |
2001-07-10 |
Cascade Microtech, Inc. |
Membrane probing system
|
US6445202B1
(en)
|
1999-06-30 |
2002-09-03 |
Cascade Microtech, Inc. |
Probe station thermal chuck with shielding for capacitive current
|
US6340895B1
(en)
*
|
1999-07-14 |
2002-01-22 |
Aehr Test Systems, Inc. |
Wafer-level burn-in and test cartridge
|
JP4256031B2
(en)
*
|
1999-07-27 |
2009-04-22 |
東京エレクトロン株式会社 |
Processing apparatus and temperature control method thereof
|
US8076216B2
(en)
|
2008-11-11 |
2011-12-13 |
Advanced Inquiry Systems, Inc. |
Methods and apparatus for thinning, testing and singulating a semiconductor wafer
|
EP1356499A2
(en)
|
2000-07-10 |
2003-10-29 |
Temptronic Corporation |
Wafer chuck with interleaved heating and cooling elements
|
US6965226B2
(en)
|
2000-09-05 |
2005-11-15 |
Cascade Microtech, Inc. |
Chuck for holding a device under test
|
US6914423B2
(en)
|
2000-09-05 |
2005-07-05 |
Cascade Microtech, Inc. |
Probe station
|
US6967177B1
(en)
*
|
2000-09-27 |
2005-11-22 |
Lsi Logic Corporation |
Temperature control system
|
DE20114544U1
(en)
|
2000-12-04 |
2002-02-21 |
Cascade Microtech Inc |
wafer probe
|
US20030016727A1
(en)
*
|
2001-06-29 |
2003-01-23 |
Tokyo Electron Limited |
Method of and apparatus for measuring and controlling substrate holder temperature using ultrasonic tomography
|
WO2003052435A1
(en)
|
2001-08-21 |
2003-06-26 |
Cascade Microtech, Inc. |
Membrane probing system
|
WO2003020467A1
(en)
*
|
2001-08-31 |
2003-03-13 |
Cascade Microtech, Inc. |
Optical testing device
|
US7163587B2
(en)
*
|
2002-02-08 |
2007-01-16 |
Axcelis Technologies, Inc. |
Reactor assembly and processing method
|
DE10216786C5
(en)
*
|
2002-04-15 |
2009-10-15 |
Ers Electronic Gmbh |
Method and apparatus for conditioning semiconductor wafers and / or hybrids
|
US6745575B2
(en)
|
2002-07-11 |
2004-06-08 |
Temptronic Corporation |
Workpiece chuck with temperature control assembly having spacers between layers providing clearance for thermoelectric modules
|
TWI260725B
(en)
|
2002-07-11 |
2006-08-21 |
Temptronic Corp |
Workpiece chuck with temperature control assembly having spacers between layers providing clearance for thermoelectric modules and method for supporting a workpiece with the workpiece chuck
|
US6819131B2
(en)
*
|
2002-07-11 |
2004-11-16 |
Motorola, Inc. |
Passive, grease-free cooled device fixtures
|
JP4659328B2
(en)
*
|
2002-10-21 |
2011-03-30 |
東京エレクトロン株式会社 |
Probe device for controlling the temperature of an object to be inspected
|
US20040124865A1
(en)
*
|
2002-12-26 |
2004-07-01 |
Chuang Kun Fu |
Method and structure for wafer-level reliability electromigration and stress migration test by isothermal heater
|
US7079760B2
(en)
*
|
2003-03-17 |
2006-07-18 |
Tokyo Electron Limited |
Processing system and method for thermally treating a substrate
|
US7492172B2
(en)
|
2003-05-23 |
2009-02-17 |
Cascade Microtech, Inc. |
Chuck for holding a device under test
|
US7057404B2
(en)
|
2003-05-23 |
2006-06-06 |
Sharp Laboratories Of America, Inc. |
Shielded probe for testing a device under test
|
CN1301534C
(en)
*
|
2003-07-15 |
2007-02-21 |
旺宏电子股份有限公司 |
Method and apparatus for preventing abnormal event of temperature and gas flow of semiconductor boiler tube
|
KR100875527B1
(en)
*
|
2003-08-18 |
2008-12-23 |
가부시키가이샤 아드반테스트 |
Temperature control device and temperature control method
|
US7310230B2
(en)
*
|
2003-08-21 |
2007-12-18 |
Delta Design, Inc. |
Temperature control system which sprays liquid coolant droplets against an IC-module at a sub-atmospheric pressure
|
KR100536610B1
(en)
*
|
2003-08-29 |
2005-12-14 |
삼성전자주식회사 |
Apparatus For Calibrating Probe Station
|
US20050067146A1
(en)
*
|
2003-09-02 |
2005-03-31 |
Thayer John Gilbert |
Two phase cooling system method for burn-in testing
|
US7129731B2
(en)
*
|
2003-09-02 |
2006-10-31 |
Thermal Corp. |
Heat pipe with chilled liquid condenser system for burn-in testing
|
US7013956B2
(en)
*
|
2003-09-02 |
2006-03-21 |
Thermal Corp. |
Heat pipe evaporator with porous valve
|
US20050067147A1
(en)
*
|
2003-09-02 |
2005-03-31 |
Thayer John Gilbert |
Loop thermosyphon for cooling semiconductors during burn-in testing
|
US7250626B2
(en)
|
2003-10-22 |
2007-07-31 |
Cascade Microtech, Inc. |
Probe testing structure
|
US6976782B1
(en)
|
2003-11-24 |
2005-12-20 |
Lam Research Corporation |
Methods and apparatus for in situ substrate temperature monitoring
|
US20070248515A1
(en)
*
|
2003-12-01 |
2007-10-25 |
Tompa Gary S |
System and Method for Forming Multi-Component Films
|
US7106416B2
(en)
*
|
2003-12-10 |
2006-09-12 |
Asml Netherlands B.V. |
Lithographic apparatus and device manufacturing method
|
US7187188B2
(en)
|
2003-12-24 |
2007-03-06 |
Cascade Microtech, Inc. |
Chuck with integrated wafer support
|
JP2007517231A
(en)
|
2003-12-24 |
2007-06-28 |
カスケード マイクロテック インコーポレイテッド |
Active wafer probe
|
KR100662907B1
(en)
*
|
2004-09-11 |
2007-01-02 |
삼성전자주식회사 |
Troidal line filter and method for winding coil of troidal line filter
|
DE202005021435U1
(en)
|
2004-09-13 |
2008-02-28 |
Cascade Microtech, Inc., Beaverton |
Double-sided test setups
|
US7061264B2
(en)
*
|
2004-09-29 |
2006-06-13 |
Agere Systems, Inc. |
Test semiconductor device and method for determining Joule heating effects in such a device
|
US7091737B2
(en)
|
2004-10-01 |
2006-08-15 |
Intel Corporation |
Apparatus and methods for self-heating burn-in processes
|
CN100353516C
(en)
*
|
2004-10-20 |
2007-12-05 |
力晶半导体股份有限公司 |
Semiconductor machine
|
US7304490B2
(en)
*
|
2004-11-05 |
2007-12-04 |
Solid State Measurements, Inc. |
In-situ wafer and probe desorption using closed loop heating
|
WO2006060134A2
(en)
*
|
2004-11-15 |
2006-06-08 |
Cree, Inc. |
Restricted radiated heating assembly for high temperature processing
|
US7731798B2
(en)
*
|
2004-12-01 |
2010-06-08 |
Ultratech, Inc. |
Heated chuck for laser thermal processing
|
US7587901B2
(en)
|
2004-12-20 |
2009-09-15 |
Amerigon Incorporated |
Control system for thermal module in vehicle
|
DE102005001163B3
(en)
*
|
2005-01-10 |
2006-05-18 |
Erich Reitinger |
Semiconductor wafers` testing method, involves testing wafer by probes, and reducing heating energy with constant cooling efficiency, under consideration of detected increase of temperature of fluids flowing via tempered chuck device
|
US7218129B2
(en)
*
|
2005-01-12 |
2007-05-15 |
International Business Machines Corporation |
System, apparatus and method for controlling temperature of an integrated circuit under test
|
US7535247B2
(en)
|
2005-01-31 |
2009-05-19 |
Cascade Microtech, Inc. |
Interface for testing semiconductors
|
US7656172B2
(en)
|
2005-01-31 |
2010-02-02 |
Cascade Microtech, Inc. |
System for testing semiconductors
|
TWI288240B
(en)
*
|
2005-06-14 |
2007-10-11 |
Siliconware Precision Industries Co Ltd |
Electronic component test system including temperature measurement by light
|
JP4356661B2
(en)
*
|
2005-07-25 |
2009-11-04 |
住友電気工業株式会社 |
Wafer holder and wafer prober equipped with the same
|
JP4950688B2
(en)
*
|
2006-03-13 |
2012-06-13 |
東京エレクトロン株式会社 |
Mounting device
|
US8226769B2
(en)
*
|
2006-04-27 |
2012-07-24 |
Applied Materials, Inc. |
Substrate support with electrostatic chuck having dual temperature zones
|
US7453277B2
(en)
*
|
2006-06-06 |
2008-11-18 |
Advanced Inquiry Systems, Inc. |
Apparatus for full-wafer test and burn-in mechanism
|
US7764072B2
(en)
|
2006-06-12 |
2010-07-27 |
Cascade Microtech, Inc. |
Differential signal probing system
|
US7403028B2
(en)
|
2006-06-12 |
2008-07-22 |
Cascade Microtech, Inc. |
Test structure and probe for differential signals
|
US7723999B2
(en)
|
2006-06-12 |
2010-05-25 |
Cascade Microtech, Inc. |
Calibration structures for differential signal probing
|
US8222511B2
(en)
*
|
2006-08-03 |
2012-07-17 |
Gentherm |
Thermoelectric device
|
US20080088301A1
(en)
*
|
2006-09-29 |
2008-04-17 |
Yie Wei Tan |
Testing device handler
|
US20080087316A1
(en)
|
2006-10-12 |
2008-04-17 |
Masa Inaba |
Thermoelectric device with internal sensor
|
KR20080053768A
(en)
*
|
2006-12-11 |
2008-06-16 |
삼성전자주식회사 |
Wafer chuck and apparatus having the same and method for testing the electrical characteristic of wafer
|
DE102008013978B4
(en)
|
2007-03-16 |
2021-08-12 |
Cascade Microtech, Inc. |
Chuck with triaxial structure
|
DE102008021242A1
(en)
*
|
2007-04-30 |
2008-11-13 |
Suss Microtec Test Systems Gmbh |
Device and method for controlling a movement device
|
US20080286344A1
(en)
*
|
2007-05-16 |
2008-11-20 |
Olivia Darmuzey |
Solid form
|
KR100891384B1
(en)
*
|
2007-06-14 |
2009-04-02 |
삼성모바일디스플레이주식회사 |
Flexible substrate bonding apparatus and debonding apparatus
|
US9105809B2
(en)
|
2007-07-23 |
2015-08-11 |
Gentherm Incorporated |
Segmented thermoelectric device
|
US7876114B2
(en)
|
2007-08-08 |
2011-01-25 |
Cascade Microtech, Inc. |
Differential waveguide probe
|
US7877827B2
(en)
|
2007-09-10 |
2011-02-01 |
Amerigon Incorporated |
Operational control schemes for ventilated seat or bed assemblies
|
JP5074878B2
(en)
*
|
2007-10-15 |
2012-11-14 |
東京エレクトロン株式会社 |
Inspection device
|
CN105291920B
(en)
|
2008-02-01 |
2018-12-25 |
金瑟姆股份公司 |
Condensation and humidity sensor for thermoelectric device
|
WO2010009422A1
(en)
|
2008-07-18 |
2010-01-21 |
Amerigon Incorporated |
Climate controlled bed assembly
|
US7863890B2
(en)
*
|
2008-08-19 |
2011-01-04 |
Kia Silverbrook |
Apparatus for testing integrated circuitry
|
US7804292B2
(en)
*
|
2008-08-19 |
2010-09-28 |
Silverbrook Research Pty Ltd |
Method for testing integrated circuits mounted on a carrier
|
US7786723B2
(en)
*
|
2008-08-19 |
2010-08-31 |
Silverbrook Research Pty Ltd |
Test stage for a carrier having printhead integrated circuitry thereon
|
US7888957B2
(en)
|
2008-10-06 |
2011-02-15 |
Cascade Microtech, Inc. |
Probing apparatus with impedance optimized interface
|
US8410806B2
(en)
|
2008-11-21 |
2013-04-02 |
Cascade Microtech, Inc. |
Replaceable coupon for a probing apparatus
|
US8319503B2
(en)
|
2008-11-24 |
2012-11-27 |
Cascade Microtech, Inc. |
Test apparatus for measuring a characteristic of a device under test
|
KR101015600B1
(en)
*
|
2008-12-19 |
2011-02-17 |
세크론 주식회사 |
Stage unit for a probe station and apparatus for testing a wafer including the same
|
DE102009018434B4
(en)
*
|
2009-04-22 |
2023-11-30 |
Ev Group Gmbh |
Receiving device for holding semiconductor substrates
|
NL2004980A
(en)
*
|
2009-07-13 |
2011-01-17 |
Asml Netherlands Bv |
Heat transfers assembly, lithographic apparatus and manufacturing method.
|
JP5407749B2
(en)
*
|
2009-10-26 |
2014-02-05 |
日本電気株式会社 |
In-circuit test fixture cooling structure
|
US8519729B2
(en)
*
|
2010-02-10 |
2013-08-27 |
Sunpower Corporation |
Chucks for supporting solar cell in hot spot testing
|
SG184008A1
(en)
*
|
2010-03-12 |
2012-10-30 |
Cascade Microtech Inc |
System for testing semiconductors
|
JP5620574B2
(en)
|
2010-06-07 |
2014-11-05 |
カスケード マイクロテックインコーポレイテッドCascade Microtech,Incorporated |
High voltage chuck for probe station
|
US9719169B2
(en)
*
|
2010-12-20 |
2017-08-01 |
Novellus Systems, Inc. |
System and apparatus for flowable deposition in semiconductor fabrication
|
US20120196242A1
(en)
*
|
2011-01-27 |
2012-08-02 |
Applied Materials, Inc. |
Substrate support with heater and rapid temperature change
|
US8618513B2
(en)
|
2011-05-23 |
2013-12-31 |
Kla-Tencor Corporation |
Apparatus and methods for forming an electrical conduction path through an insulating layer
|
SG188036A1
(en)
|
2011-08-18 |
2013-03-28 |
Asml Netherlands Bv |
Lithographic apparatus, support table for a lithographic apparatus and device manufacturing method
|
US9689935B2
(en)
*
|
2011-09-30 |
2017-06-27 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Hall-effect measurement apparatus
|
US9685599B2
(en)
|
2011-10-07 |
2017-06-20 |
Gentherm Incorporated |
Method and system for controlling an operation of a thermoelectric device
|
US9989267B2
(en)
|
2012-02-10 |
2018-06-05 |
Gentherm Incorporated |
Moisture abatement in heating operation of climate controlled systems
|
US9891541B2
(en)
*
|
2012-05-17 |
2018-02-13 |
Asml Netherlands B.V. |
Thermal conditioning unit, lithographic apparatus and device manufacturing method
|
US9984866B2
(en)
*
|
2012-06-12 |
2018-05-29 |
Component Re-Engineering Company, Inc. |
Multiple zone heater
|
US9224626B2
(en)
|
2012-07-03 |
2015-12-29 |
Watlow Electric Manufacturing Company |
Composite substrate for layered heaters
|
US9673077B2
(en)
|
2012-07-03 |
2017-06-06 |
Watlow Electric Manufacturing Company |
Pedestal construction with low coefficient of thermal expansion top
|
KR101434425B1
(en)
|
2013-01-31 |
2014-09-02 |
(주) 예스티 |
Heater having rapid cooling function
|
US20140251214A1
(en)
*
|
2013-03-06 |
2014-09-11 |
Applied Materials, Inc. |
Heated substrate support with flatness control
|
JP6382295B2
(en)
*
|
2013-03-15 |
2018-08-29 |
コンポーネント リ−エンジニアリング カンパニー インコーポレイテッド |
Multi-zone heater
|
KR101794744B1
(en)
|
2013-08-14 |
2017-12-01 |
에프이아이 컴파니 |
Circuit probe for charged particle beam system
|
US9847222B2
(en)
|
2013-10-25 |
2017-12-19 |
Lam Research Corporation |
Treatment for flowable dielectric deposition on substrate surfaces
|
US9662962B2
(en)
|
2013-11-05 |
2017-05-30 |
Gentherm Incorporated |
Vehicle headliner assembly for zonal comfort
|
US20150162169A1
(en)
*
|
2013-12-05 |
2015-06-11 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Etching apparatus and method
|
SG11201606361QA
(en)
*
|
2014-02-14 |
2016-09-29 |
Applied Materials Inc |
Gas cooled substrate support for stabilized high temperature deposition
|
JP6652493B2
(en)
|
2014-02-14 |
2020-02-26 |
ジェンサーム インコーポレイテッドGentherm Incorporated |
Conductive and convective temperature control sheet
|
US9678148B2
(en)
*
|
2014-06-06 |
2017-06-13 |
Advantest Corporation |
Customizable tester having testing modules for automated testing of devices
|
US9995767B2
(en)
*
|
2014-06-06 |
2018-06-12 |
Advantest Corporation |
Universal container for device under test
|
US9638749B2
(en)
|
2014-06-06 |
2017-05-02 |
Advantest Corporation |
Supporting automated testing of devices in a test floor system
|
US9618574B2
(en)
|
2014-06-06 |
2017-04-11 |
Advantest Corporation |
Controlling automated testing of devices
|
US9618570B2
(en)
*
|
2014-06-06 |
2017-04-11 |
Advantest Corporation |
Multi-configurable testing module for automated testing of a device
|
CN105374657B
(en)
*
|
2014-07-18 |
2017-07-25 |
中微半导体设备(上海)有限公司 |
Plasma processing apparatus and its temprature control method
|
US10049921B2
(en)
|
2014-08-20 |
2018-08-14 |
Lam Research Corporation |
Method for selectively sealing ultra low-k porous dielectric layer using flowable dielectric film formed from vapor phase dielectric precursor
|
CN107251247B
(en)
|
2014-11-14 |
2021-06-01 |
查尔斯·J·柯西 |
Heating and cooling techniques
|
US11857004B2
(en)
|
2014-11-14 |
2024-01-02 |
Gentherm Incorporated |
Heating and cooling technologies
|
US11639816B2
(en)
|
2014-11-14 |
2023-05-02 |
Gentherm Incorporated |
Heating and cooling technologies including temperature regulating pad wrap and technologies with liquid system
|
US9714914B2
(en)
|
2015-01-20 |
2017-07-25 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
CMOS compatible biofet
|
US9968927B2
(en)
|
2015-05-22 |
2018-05-15 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Optical biosensor device
|
US9916977B2
(en)
|
2015-11-16 |
2018-03-13 |
Lam Research Corporation |
Low k dielectric deposition via UV driven photopolymerization
|
US10388546B2
(en)
|
2015-11-16 |
2019-08-20 |
Lam Research Corporation |
Apparatus for UV flowable dielectric
|
US10499461B2
(en)
*
|
2015-12-21 |
2019-12-03 |
Intel Corporation |
Thermal head with a thermal barrier for integrated circuit die processing
|
SE539700C2
(en)
*
|
2016-05-09 |
2017-11-07 |
Blb Ind Ab |
A table system for an additive manufacturing machinery for plastic components
|
US10522400B2
(en)
*
|
2016-05-27 |
2019-12-31 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Embedded temperature control system for a biosensor
|
KR102609312B1
(en)
|
2016-09-13 |
2023-12-01 |
삼성전자주식회사 |
Apparatus and Method for improving wafer warpage
|
TWI661207B
(en)
*
|
2016-09-26 |
2019-06-01 |
旺矽科技股份有限公司 |
Chip probing equipment
|
US10101295B2
(en)
|
2016-12-15 |
2018-10-16 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
On-chip reference electrode for biologically sensitive field effect transistor
|
US10509425B2
(en)
*
|
2017-01-20 |
2019-12-17 |
Lam Research Corporation |
Virtual metrology method for ESC temperature estimation using thermal control elements
|
KR101877667B1
(en)
*
|
2017-02-28 |
2018-07-11 |
세메스 주식회사 |
Method of testing semiconductor packages
|
US10677842B2
(en)
|
2017-05-26 |
2020-06-09 |
Advantest Corporation |
DUT testing with configurable cooling control using DUT internal temperature data
|
JP6827385B2
(en)
*
|
2017-08-03 |
2021-02-10 |
東京エレクトロン株式会社 |
Inspection system
|
WO2019180785A1
(en)
*
|
2018-03-19 |
2019-09-26 |
日新電機株式会社 |
Substrate heating system and substrate processing device
|
US10991869B2
(en)
|
2018-07-30 |
2021-04-27 |
Gentherm Incorporated |
Thermoelectric device having a plurality of sealing materials
|
JP2020047860A
(en)
*
|
2018-09-20 |
2020-03-26 |
東京エレクトロン株式会社 |
Inspection device and inspection method
|
JP7213080B2
(en)
*
|
2018-12-19 |
2023-01-26 |
東京エレクトロン株式会社 |
Mounting table
|
US11152557B2
(en)
|
2019-02-20 |
2021-10-19 |
Gentherm Incorporated |
Thermoelectric module with integrated printed circuit board
|
DE102019005093A1
(en)
*
|
2019-07-22 |
2021-01-28 |
Att Advanced Temperature Test Systems Gmbh |
METHOD FOR TEMPERATURE CONTROL AND - REGULATION OF A CHUCK FOR A WAFER, A TEMPERATURE CONTROL DEVICE FOR TEMPERATURE CONTROLLING OF A CHUCK AND A WAFER TEST SYSTEM FOR TESTING A WAFER
|
JP6845286B2
(en)
*
|
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|
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(en)
*
|
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|
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(en)
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|
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|
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(en)
|
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|
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(en)
|
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|
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(en)
*
|
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|
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(en)
*
|
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|
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*
|
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|
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*
|
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|
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(en)
*
|
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|
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|
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|
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|
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|
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|
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|