WO2001011431A3 - Method and apparatus of holding semiconductor wafers for lithography and other wafer processes - Google Patents

Method and apparatus of holding semiconductor wafers for lithography and other wafer processes Download PDF

Info

Publication number
WO2001011431A3
WO2001011431A3 PCT/US2000/021377 US0021377W WO0111431A3 WO 2001011431 A3 WO2001011431 A3 WO 2001011431A3 US 0021377 W US0021377 W US 0021377W WO 0111431 A3 WO0111431 A3 WO 0111431A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
lithography
compliant layer
semiconductor wafers
wafer processes
Prior art date
Application number
PCT/US2000/021377
Other languages
French (fr)
Other versions
WO2001011431A2 (en
WO2001011431B1 (en
Inventor
Stephen Moffatt
Original Assignee
Applied Materials Inc
Stephen Moffatt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc, Stephen Moffatt filed Critical Applied Materials Inc
Publication of WO2001011431A2 publication Critical patent/WO2001011431A2/en
Publication of WO2001011431A3 publication Critical patent/WO2001011431A3/en
Publication of WO2001011431B1 publication Critical patent/WO2001011431B1/en
Priority to US10/705,182 priority Critical patent/US6909588B2/en
Priority to US11/056,787 priority patent/US7372690B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

Abstract

A wafer chuck is designed to allow the substrate to thermally deform during charged particle beam lithography. The wafer chuck includes a compliant layer disposed over a chuck body. During lithography processing the wafer is electrostatically held in contact with a flexible compliant layer and the wafer is exposed to the charged particle beam resulting in thermal deformation of the wafer. The compliant layer deforms with the substrate and allows the wafer to deform in a predictable manner.
PCT/US2000/021377 1999-08-06 2000-08-04 Method and apparatus of holding semiconductor wafers for lithography and other wafer processes WO2001011431A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/705,182 US6909588B2 (en) 1999-08-06 2003-11-10 Substrate holder for retaining a substrate within a processing chamber
US11/056,787 US7372690B2 (en) 1999-08-06 2005-02-10 Substrate holder which is self-adjusting for substrate deformation

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14768499P 1999-08-06 1999-08-06
US60/147,684 1999-08-06

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US10049755 A-371-Of-International 2000-08-04
US10/705,182 Continuation US6909588B2 (en) 1999-08-06 2003-11-10 Substrate holder for retaining a substrate within a processing chamber

Publications (3)

Publication Number Publication Date
WO2001011431A2 WO2001011431A2 (en) 2001-02-15
WO2001011431A3 true WO2001011431A3 (en) 2001-11-15
WO2001011431B1 WO2001011431B1 (en) 2001-12-20

Family

ID=22522496

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2000/021377 WO2001011431A2 (en) 1999-08-06 2000-08-04 Method and apparatus of holding semiconductor wafers for lithography and other wafer processes

Country Status (3)

Country Link
US (2) US6909588B2 (en)
TW (1) TW469487B (en)
WO (1) WO2001011431A2 (en)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001011431A2 (en) * 1999-08-06 2001-02-15 Applied Materials, Inc. Method and apparatus of holding semiconductor wafers for lithography and other wafer processes
US6747845B1 (en) * 2000-10-11 2004-06-08 International Business Machines Corporation Modified strain region of strain reactive slider with implanted ions, electrons or neutral atoms
US6623563B2 (en) 2001-01-02 2003-09-23 Applied Materials, Inc. Susceptor with bi-metal effect
US6554907B2 (en) * 2001-01-02 2003-04-29 Applied Materials, Inc. Susceptor with internal support
US6836316B2 (en) 2001-07-26 2004-12-28 Canon Kabushiki Kaisha Substrate holding apparatus and exposure apparatus using the same
US6734117B2 (en) * 2002-03-12 2004-05-11 Nikon Corporation Periodic clamping method and apparatus to reduce thermal stress in a wafer
US7164466B2 (en) 2002-08-27 2007-01-16 Nikon Corporation Detachable heat sink
US6794662B1 (en) * 2003-10-07 2004-09-21 Ibis Technology Corporation Thermosetting resin wafer-holding pin
US7119884B2 (en) 2003-12-24 2006-10-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1737564B1 (en) * 2004-03-12 2019-09-11 SRI International Mechanical meta-materials
US7727581B2 (en) * 2004-03-17 2010-06-01 Essilor International Compagnie Generale D' Optique Process for applying a coating on an optical lens face and implementation system
US6972914B2 (en) * 2004-03-17 2005-12-06 Essilor International Compagnie Generale D'optique Optical lens holder
US7561251B2 (en) * 2004-03-29 2009-07-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20070164476A1 (en) * 2004-09-01 2007-07-19 Wei Wu Contact lithography apparatus and method employing substrate deformation
US7636999B2 (en) * 2005-01-31 2009-12-29 Molecular Imprints, Inc. Method of retaining a substrate to a wafer chuck
US7798801B2 (en) * 2005-01-31 2010-09-21 Molecular Imprints, Inc. Chucking system for nano-manufacturing
US7830493B2 (en) * 2005-10-04 2010-11-09 Asml Netherlands B.V. System and method for compensating for radiation induced thermal distortions in a substrate or projection system
TWI275118B (en) * 2005-12-09 2007-03-01 Li Bing Huan Sample box of electron microscope for observing a general sample/live cell
US7554787B2 (en) * 2006-06-05 2009-06-30 Sri International Wall crawling devices
US7551419B2 (en) 2006-06-05 2009-06-23 Sri International Electroadhesion
US9275887B2 (en) 2006-07-20 2016-03-01 Applied Materials, Inc. Substrate processing with rapid temperature gradient control
US20080190364A1 (en) * 2007-02-13 2008-08-14 Applied Materials, Inc. Substrate support assembly
NL1036544A1 (en) * 2008-02-21 2009-08-24 Asml Netherlands Bv A lithographic apparatus having a chuck with a visco-elastic damping layer.
US8329260B2 (en) * 2008-03-11 2012-12-11 Varian Semiconductor Equipment Associates, Inc. Cooled cleaving implant
US9110685B2 (en) * 2008-03-25 2015-08-18 Qualcomm, Incorporated Apparatus and methods for managing widgets in a wireless communication environment
KR20100043478A (en) * 2008-10-20 2010-04-29 삼성전기주식회사 Electrostatic chuck and apparatus for attaching substrate using the same
US8400804B2 (en) * 2010-08-30 2013-03-19 Taiwan Semiconductor Manufacturing Co., Ltd. Memory devices having break cells
JP5686779B2 (en) 2011-10-14 2015-03-18 キヤノン株式会社 Imprint apparatus and article manufacturing method using the same

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4480284A (en) * 1982-02-03 1984-10-30 Tokyo Shibaura Denki Kabushiki Kaisha Electrostatic chuck plate
US4665463A (en) * 1983-09-30 1987-05-12 U.S. Philips Corporation Electrostatic chuck
US5310453A (en) * 1992-02-13 1994-05-10 Tokyo Electron Yamanashi Limited Plasma process method using an electrostatic chuck
US5452177A (en) * 1990-06-08 1995-09-19 Varian Associates, Inc. Electrostatic wafer clamp
EP0692814A1 (en) * 1994-07-15 1996-01-17 Applied Materials, Inc. Multi-electrode electrostatic chuck
US5729423A (en) * 1994-01-31 1998-03-17 Applied Materials, Inc. Puncture resistant electrostatic chuck
EP0856882A2 (en) * 1997-01-31 1998-08-05 Applied Materials, Inc. Stand-off pad for supporting a wafer on a substrate support chuck and method of fabricating same
US5883778A (en) * 1994-02-28 1999-03-16 Applied Materials, Inc. Electrostatic chuck with fluid flow regulator

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0712012B2 (en) 1985-12-11 1995-02-08 株式会社ニコン Projection exposure device
US5581324A (en) * 1993-06-10 1996-12-03 Nikon Corporation Thermal distortion compensated projection exposure method and apparatus for manufacturing semiconductors
FR2758916B1 (en) 1997-01-30 1999-04-02 Gec Alsthom T & D Sa FIREPLACE HOOD
WO2001011431A2 (en) * 1999-08-06 2001-02-15 Applied Materials, Inc. Method and apparatus of holding semiconductor wafers for lithography and other wafer processes

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4480284A (en) * 1982-02-03 1984-10-30 Tokyo Shibaura Denki Kabushiki Kaisha Electrostatic chuck plate
US4665463A (en) * 1983-09-30 1987-05-12 U.S. Philips Corporation Electrostatic chuck
US5452177A (en) * 1990-06-08 1995-09-19 Varian Associates, Inc. Electrostatic wafer clamp
US5310453A (en) * 1992-02-13 1994-05-10 Tokyo Electron Yamanashi Limited Plasma process method using an electrostatic chuck
US5729423A (en) * 1994-01-31 1998-03-17 Applied Materials, Inc. Puncture resistant electrostatic chuck
US5883778A (en) * 1994-02-28 1999-03-16 Applied Materials, Inc. Electrostatic chuck with fluid flow regulator
EP0692814A1 (en) * 1994-07-15 1996-01-17 Applied Materials, Inc. Multi-electrode electrostatic chuck
EP0856882A2 (en) * 1997-01-31 1998-08-05 Applied Materials, Inc. Stand-off pad for supporting a wafer on a substrate support chuck and method of fabricating same

Also Published As

Publication number Publication date
WO2001011431A2 (en) 2001-02-15
TW469487B (en) 2001-12-21
US20040084633A1 (en) 2004-05-06
US20050199825A1 (en) 2005-09-15
WO2001011431B1 (en) 2001-12-20
US7372690B2 (en) 2008-05-13
US6909588B2 (en) 2005-06-21

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