WO2001033300A3 - High precision orientation alignment and gap control stages for imprint lithography processes - Google Patents

High precision orientation alignment and gap control stages for imprint lithography processes Download PDF

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Publication number
WO2001033300A3
WO2001033300A3 PCT/US2000/030041 US0030041W WO0133300A3 WO 2001033300 A3 WO2001033300 A3 WO 2001033300A3 US 0030041 W US0030041 W US 0030041W WO 0133300 A3 WO0133300 A3 WO 0133300A3
Authority
WO
WIPO (PCT)
Prior art keywords
high precision
imprint lithography
template
gap control
substrate
Prior art date
Application number
PCT/US2000/030041
Other languages
French (fr)
Other versions
WO2001033300A2 (en
Inventor
Byung Jin Choi
Sidlgata V Sreenivasan
Stephen C Johnson
Original Assignee
Regents Board Of
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Regents Board Of filed Critical Regents Board Of
Priority to JP2001535125A priority Critical patent/JP2003517727A/en
Priority to AU14488/01A priority patent/AU1448801A/en
Priority to EP00976753.4A priority patent/EP1240550B1/en
Publication of WO2001033300A2 publication Critical patent/WO2001033300A2/en
Publication of WO2001033300A3 publication Critical patent/WO2001033300A3/en
Priority to HK03101591.8A priority patent/HK1049521A1/en

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping

Abstract

Processes and associated devices for high precision positioning of a template and substrate during imprint lithography includes a calibration system with a course calibration stage and a fine orientation stage capable of maintaining a uniform gap between the template and substrate. The fine orientation stage includes a pair of flexure members having flexure joints for motion about a pivot point intersected by first and second orientation axes. Actuators lengthen or shorten to expand or contract the flexure members. Separation of the template is achieved using a peel-and-pull method that avoids destruction of imprinted features from the substrate.
PCT/US2000/030041 1999-10-29 2000-10-30 High precision orientation alignment and gap control stages for imprint lithography processes WO2001033300A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2001535125A JP2003517727A (en) 1999-10-29 2000-10-30 High precision orientation alignment and gap control devices for imprint lithography
AU14488/01A AU1448801A (en) 1999-10-29 2000-10-30 High precision orientation alignment and gap control stages for imprint lithography processes
EP00976753.4A EP1240550B1 (en) 1999-10-29 2000-10-30 A process for separating a template from a substrate during imprint lithography, and associated imprint lithography process
HK03101591.8A HK1049521A1 (en) 1999-10-29 2003-03-04 High precision orientation alignment and gap control stages for imprint lithography processes

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US16239299P 1999-10-29 1999-10-29
US60/162,392 1999-10-29
US09/698,317 2000-10-27
US09/698,317 US6873087B1 (en) 1999-10-29 2000-10-27 High precision orientation alignment and gap control stages for imprint lithography processes

Publications (2)

Publication Number Publication Date
WO2001033300A2 WO2001033300A2 (en) 2001-05-10
WO2001033300A3 true WO2001033300A3 (en) 2002-01-24

Family

ID=26858716

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2000/030041 WO2001033300A2 (en) 1999-10-29 2000-10-30 High precision orientation alignment and gap control stages for imprint lithography processes

Country Status (6)

Country Link
US (8) US6873087B1 (en)
EP (3) EP2315076A1 (en)
JP (3) JP2003517727A (en)
AU (1) AU1448801A (en)
HK (1) HK1049521A1 (en)
WO (1) WO2001033300A2 (en)

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* Cited by examiner, † Cited by third party
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