WO2001033615A3 - Method and apparatus for supercritical processing of multiple workpieces - Google Patents

Method and apparatus for supercritical processing of multiple workpieces Download PDF

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Publication number
WO2001033615A3
WO2001033615A3 PCT/US2000/041787 US0041787W WO0133615A3 WO 2001033615 A3 WO2001033615 A3 WO 2001033615A3 US 0041787 W US0041787 W US 0041787W WO 0133615 A3 WO0133615 A3 WO 0133615A3
Authority
WO
WIPO (PCT)
Prior art keywords
supercritical processing
transfer module
robot
entrance
workpieces
Prior art date
Application number
PCT/US2000/041787
Other languages
French (fr)
Other versions
WO2001033615A2 (en
Inventor
Maximilian A Biberger
Frederick Paul Layman
Thomas Robert Sutton
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to AU32672/01A priority Critical patent/AU3267201A/en
Priority to JP2001535218A priority patent/JP5073902B2/en
Priority to CA002387341A priority patent/CA2387341A1/en
Priority to EP00991448A priority patent/EP1234322A2/en
Publication of WO2001033615A2 publication Critical patent/WO2001033615A2/en
Publication of WO2001033615A3 publication Critical patent/WO2001033615A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67213—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one ion or electron beam chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling

Abstract

An apparatus for supercritical processing of multiple workpieces comprises a transfer module, first and second supercritical processing modules, and a robot. The transfer module includes an entrance. The first and second supercritical processing modules are coupled to the transfer module. The robot is preferably located with the transfer module. In operation, the robot transfers a first workpiece from the entrance of the transfer module to the first supercritical processing module. The robot then transfers a second workpiece from the entrance to the second supercritical processing module. After the workpieces have been processed, the robot returns the first and second workpieces to the entrance of the transfer module. Alternatively, the apparatus includes additional supercritical processing modules coupled to the transfer module.
PCT/US2000/041787 1999-11-02 2000-11-01 Method and apparatus for supercritical processing of multiple workpieces WO2001033615A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
AU32672/01A AU3267201A (en) 1999-11-02 2000-11-01 Method and apparatus for supercritical processing of multiple workpieces
JP2001535218A JP5073902B2 (en) 1999-11-02 2000-11-01 Method and apparatus for supercritical processing of multiple workpieces
CA002387341A CA2387341A1 (en) 1999-11-02 2000-11-01 Method and apparatus for supercritical processing of multiple workpieces
EP00991448A EP1234322A2 (en) 1999-11-02 2000-11-01 Method and apparatus for supercritical processing of multiple workpieces

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16312199P 1999-11-02 1999-11-02
US60/163,121 1999-11-02

Publications (2)

Publication Number Publication Date
WO2001033615A2 WO2001033615A2 (en) 2001-05-10
WO2001033615A3 true WO2001033615A3 (en) 2001-12-06

Family

ID=22588579

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/US2000/041853 WO2001046999A2 (en) 1999-11-02 2000-11-01 Method and apparatus for supercritical processing of a workpiece
PCT/US2000/041787 WO2001033615A2 (en) 1999-11-02 2000-11-01 Method and apparatus for supercritical processing of multiple workpieces

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PCT/US2000/041853 WO2001046999A2 (en) 1999-11-02 2000-11-01 Method and apparatus for supercritical processing of a workpiece

Country Status (9)

Country Link
US (2) US7060422B2 (en)
EP (2) EP1243021A2 (en)
JP (2) JP5073902B2 (en)
KR (2) KR100744888B1 (en)
CN (2) CN1175470C (en)
AU (2) AU4902201A (en)
CA (2) CA2387341A1 (en)
TW (1) TW484169B (en)
WO (2) WO2001046999A2 (en)

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