WO2001036320A3 - Micromachine package - Google Patents
Micromachine package Download PDFInfo
- Publication number
- WO2001036320A3 WO2001036320A3 PCT/US2000/041483 US0041483W WO0136320A3 WO 2001036320 A3 WO2001036320 A3 WO 2001036320A3 US 0041483 W US0041483 W US 0041483W WO 0136320 A3 WO0136320 A3 WO 0136320A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- micromachine
- coupon
- chip
- bead
- area
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0064—Packages or encapsulation for protecting against electromagnetic or electrostatic interferences
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/04—Networks or arrays of similar microstructural devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C99/00—Subject matter not provided for in other groups of this subclass
- B81C99/0035—Testing
- B81C99/004—Testing during manufacturing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU26166/01A AU2616601A (en) | 1999-11-15 | 2000-10-24 | Micromachine package |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US44080599A | 1999-11-15 | 1999-11-15 | |
US09/440,808 US6415505B1 (en) | 1999-11-15 | 1999-11-15 | Micromachine package fabrication method |
US09/440,808 | 1999-11-15 | ||
US09/440,805 | 1999-11-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2001036320A2 WO2001036320A2 (en) | 2001-05-25 |
WO2001036320A3 true WO2001036320A3 (en) | 2002-05-30 |
Family
ID=27032562
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2000/041483 WO2001036320A2 (en) | 1999-11-15 | 2000-10-24 | Micromachine package |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU2616601A (en) |
TW (1) | TW473903B (en) |
WO (1) | WO2001036320A2 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10258478A1 (en) * | 2002-12-10 | 2004-07-08 | Fh Stralsund | Top-bottom ball grid array package for a micro-system construction kit, has metal top and bottom parts with electric wiring/connection structures |
DE102006019080B3 (en) | 2006-04-25 | 2007-08-30 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Housing manufacturing method for e.g. infrared sensor, involves enclosing electrical circuit along metal frame, where circuit is isolated along isolating contour that does not cut surface of substrate |
DE102010031055B4 (en) * | 2010-07-07 | 2023-02-23 | Robert Bosch Gmbh | Sensor module and method of manufacturing a sensor module |
TWI455266B (en) * | 2010-12-17 | 2014-10-01 | 矽品精密工業股份有限公司 | Package structure having micro-electro-mechanical elements and manufacturing method thereof |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2100521A (en) * | 1981-05-13 | 1982-12-22 | Plessey Co Plc | Electrical device package |
US5414300A (en) * | 1993-12-10 | 1995-05-09 | Sumitomo Metal Ceramics Inc. | Lid for semiconductor package and package having the lid |
US5597767A (en) * | 1995-01-06 | 1997-01-28 | Texas Instruments Incorporated | Separation of wafer into die with wafer-level processing |
EP0828346A2 (en) * | 1996-08-29 | 1998-03-11 | Harris Corporation | Lid wafer bond packaging and micromachining |
US5742007A (en) * | 1996-08-05 | 1998-04-21 | Motorola, Inc. | Electronic device package and method for forming the same |
WO1998048461A1 (en) * | 1997-04-18 | 1998-10-29 | Amkor Technology, Inc. | Integrated circuit package |
US5860210A (en) * | 1996-09-30 | 1999-01-19 | Motorola, Inc. | Method of manufacturing an electronic component |
WO1999050913A1 (en) * | 1998-03-31 | 1999-10-07 | Honeywell Inc. | A method of making a wafer-pair having sealed chambers |
-
2000
- 2000-10-24 WO PCT/US2000/041483 patent/WO2001036320A2/en active Application Filing
- 2000-10-24 AU AU26166/01A patent/AU2616601A/en not_active Abandoned
- 2000-10-26 TW TW89121135A patent/TW473903B/en not_active IP Right Cessation
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2100521A (en) * | 1981-05-13 | 1982-12-22 | Plessey Co Plc | Electrical device package |
US5414300A (en) * | 1993-12-10 | 1995-05-09 | Sumitomo Metal Ceramics Inc. | Lid for semiconductor package and package having the lid |
US5597767A (en) * | 1995-01-06 | 1997-01-28 | Texas Instruments Incorporated | Separation of wafer into die with wafer-level processing |
US5742007A (en) * | 1996-08-05 | 1998-04-21 | Motorola, Inc. | Electronic device package and method for forming the same |
EP0828346A2 (en) * | 1996-08-29 | 1998-03-11 | Harris Corporation | Lid wafer bond packaging and micromachining |
US5860210A (en) * | 1996-09-30 | 1999-01-19 | Motorola, Inc. | Method of manufacturing an electronic component |
WO1998048461A1 (en) * | 1997-04-18 | 1998-10-29 | Amkor Technology, Inc. | Integrated circuit package |
WO1999050913A1 (en) * | 1998-03-31 | 1999-10-07 | Honeywell Inc. | A method of making a wafer-pair having sealed chambers |
Also Published As
Publication number | Publication date |
---|---|
AU2616601A (en) | 2001-05-30 |
WO2001036320A2 (en) | 2001-05-25 |
TW473903B (en) | 2002-01-21 |
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