WO2001039214A2 - Improved conductive polymer device and method of manufacturing same - Google Patents
Improved conductive polymer device and method of manufacturing same Download PDFInfo
- Publication number
- WO2001039214A2 WO2001039214A2 PCT/US2000/031876 US0031876W WO0139214A2 WO 2001039214 A2 WO2001039214 A2 WO 2001039214A2 US 0031876 W US0031876 W US 0031876W WO 0139214 A2 WO0139214 A2 WO 0139214A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- metal
- internal
- external
- array
- metal strips
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/021—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient formed as one or more layers or coatings
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU16613/01A AU1661301A (en) | 1999-11-23 | 2000-11-20 | Improved conductive polymer device and method of manufacturing same |
EP00979209A EP1236210A2 (en) | 1999-11-23 | 2000-11-20 | Improved conductive polymer device and method of manufacturing same |
KR1020027006470A KR20020049057A (en) | 1999-11-23 | 2000-11-20 | Improved conductive polymer device and method of manufacturing same |
JP2001540793A JP2003515920A (en) | 1999-11-23 | 2000-11-20 | Improved conductive polymer material and method for producing the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/448,051 US6429533B1 (en) | 1999-11-23 | 1999-11-23 | Conductive polymer device and method of manufacturing same |
US09/448,051 | 1999-11-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2001039214A2 true WO2001039214A2 (en) | 2001-05-31 |
WO2001039214A3 WO2001039214A3 (en) | 2001-11-22 |
Family
ID=23778816
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2000/031876 WO2001039214A2 (en) | 1999-11-23 | 2000-11-20 | Improved conductive polymer device and method of manufacturing same |
Country Status (8)
Country | Link |
---|---|
US (1) | US6429533B1 (en) |
EP (1) | EP1236210A2 (en) |
JP (1) | JP2003515920A (en) |
KR (1) | KR20020049057A (en) |
CN (1) | CN1399782A (en) |
AU (1) | AU1661301A (en) |
TW (1) | TW473746B (en) |
WO (1) | WO2001039214A2 (en) |
Families Citing this family (28)
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US6854176B2 (en) * | 1999-09-14 | 2005-02-15 | Tyco Electronics Corporation | Process for manufacturing a composite polymeric circuit protection device |
US6640420B1 (en) * | 1999-09-14 | 2003-11-04 | Tyco Electronics Corporation | Process for manufacturing a composite polymeric circuit protection device |
TW587408B (en) * | 2000-10-09 | 2004-05-11 | Huang Yu Ching | A structure and its manufacturing method for polymeric circuit protection device |
TW517421B (en) * | 2001-05-03 | 2003-01-11 | Inpaq Technology Co Ltd | Structure of SMT-type recoverable over-current protection device and its manufacturing method |
US6683375B2 (en) * | 2001-06-15 | 2004-01-27 | Fairchild Semiconductor Corporation | Semiconductor die including conductive columns |
TW529215B (en) * | 2001-08-24 | 2003-04-21 | Inpaq Technology Co Ltd | IC carrying substrate with an over voltage protection function |
TW525863U (en) * | 2001-10-24 | 2003-03-21 | Polytronics Technology Corp | Electric current overflow protection device |
TW529846U (en) * | 2001-11-12 | 2003-04-21 | Polytronics Technology Corp | Over-current protection component and the device |
TW528210U (en) * | 2001-11-12 | 2003-04-11 | Polytronics Technology Corp | Battery protection device of multi-layer structure |
KR100429383B1 (en) * | 2001-12-22 | 2004-04-29 | 삼화콘덴서공업주식회사 | Method and apparatus for manufacturing of ptc metal electrode |
US7152291B2 (en) | 2002-04-15 | 2006-12-26 | Avx Corporation | Method for forming plated terminations |
TWI299559B (en) * | 2002-06-19 | 2008-08-01 | Inpaq Technology Co Ltd | Ic substrate with over voltage protection function and method for manufacturing the same |
JP4135651B2 (en) * | 2003-03-26 | 2008-08-20 | 株式会社村田製作所 | Multilayer positive temperature coefficient thermistor |
US7701323B1 (en) * | 2003-05-30 | 2010-04-20 | Interconnect Portfolio Llc | Low profile discrete electronic components and applications of same |
US7042331B2 (en) * | 2003-08-12 | 2006-05-09 | Delphi Technologies, Inc. | Fabrication of thick film electrical components |
TWI265534B (en) * | 2003-12-31 | 2006-11-01 | Polytronics Technology Corp | Over-current protection apparatus |
TWM254809U (en) * | 2004-03-09 | 2005-01-01 | Protectronics Technology Corp | Multi-layer over-current protector |
WO2006080805A1 (en) * | 2005-01-27 | 2006-08-03 | Ls Cable Ltd. | Surface-mounting type thermistor having multi layers and method for manufacturing the same |
US7901829B2 (en) * | 2005-09-13 | 2011-03-08 | 3M Innovative Properties Company | Enhanced catalyst interface for membrane electrode assembly |
JP2007234800A (en) * | 2006-02-28 | 2007-09-13 | Tdk Corp | Electronic component and manufacturing method thereof |
NO334350B1 (en) * | 2006-05-16 | 2014-02-10 | Hamworthy Plc | Method of producing a plate-shaped electrode and a plate-shaped electrode for an electrostatic coalescer |
KR101650964B1 (en) * | 2008-07-10 | 2016-08-24 | 타이코 일렉트로닉스 저팬 지.케이. | Ptc device and electric device containing same |
GB0913171D0 (en) * | 2009-07-29 | 2009-09-02 | Airbus Operations Ltd | Adjustable shim |
TWI562718B (en) * | 2012-06-05 | 2016-12-11 | Ind Tech Res Inst | Emi shielding device and manufacturing method thereof |
US10001320B2 (en) * | 2014-12-26 | 2018-06-19 | Samsung Electronics Co., Ltd. | Laminated structure and vacuum insulating material including the same |
JP6430823B2 (en) * | 2014-12-26 | 2018-11-28 | 三星電子株式会社Samsung Electronics Co.,Ltd. | Laminated body and vacuum heat insulating material using the same |
DE102019100316A1 (en) * | 2019-01-08 | 2020-07-09 | Tdk Electronics Ag | Thermistor and method of manufacturing the thermistor |
FR3105576B1 (en) | 2019-12-20 | 2023-07-28 | Commissariat Energie Atomique | Low noise pixel for image sensor |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999045551A2 (en) * | 1998-03-05 | 1999-09-10 | Bourns, Multifuse (Hong Kong), Ltd. | Multilayer conductive polymer device and method of manufacturing same |
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-
1999
- 1999-11-23 US US09/448,051 patent/US6429533B1/en not_active Expired - Fee Related
-
2000
- 2000-11-20 EP EP00979209A patent/EP1236210A2/en not_active Withdrawn
- 2000-11-20 TW TW089123416A patent/TW473746B/en not_active IP Right Cessation
- 2000-11-20 JP JP2001540793A patent/JP2003515920A/en not_active Withdrawn
- 2000-11-20 KR KR1020027006470A patent/KR20020049057A/en not_active Application Discontinuation
- 2000-11-20 WO PCT/US2000/031876 patent/WO2001039214A2/en not_active Application Discontinuation
- 2000-11-20 CN CN00816122A patent/CN1399782A/en active Pending
- 2000-11-20 AU AU16613/01A patent/AU1661301A/en not_active Abandoned
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999045551A2 (en) * | 1998-03-05 | 1999-09-10 | Bourns, Multifuse (Hong Kong), Ltd. | Multilayer conductive polymer device and method of manufacturing same |
Also Published As
Publication number | Publication date |
---|---|
KR20020049057A (en) | 2002-06-24 |
TW473746B (en) | 2002-01-21 |
WO2001039214A3 (en) | 2001-11-22 |
CN1399782A (en) | 2003-02-26 |
US6429533B1 (en) | 2002-08-06 |
EP1236210A2 (en) | 2002-09-04 |
JP2003515920A (en) | 2003-05-07 |
AU1661301A (en) | 2001-06-04 |
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