WO2001041207A9 - Packaging of integrated circuits and vertical integration - Google Patents
Packaging of integrated circuits and vertical integrationInfo
- Publication number
- WO2001041207A9 WO2001041207A9 PCT/US2000/033073 US0033073W WO0141207A9 WO 2001041207 A9 WO2001041207 A9 WO 2001041207A9 US 0033073 W US0033073 W US 0033073W WO 0141207 A9 WO0141207 A9 WO 0141207A9
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wafer
- substrate
- contact
- contacts
- vias
- Prior art date
Links
Classifications
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- H01L2924/14—Integrated circuits
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/977—Thinning or removal of substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/125—Deflectable by temperature change [e.g., thermostat element]
- Y10T428/12507—More than two components
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP00982464.0A EP1247294B1 (en) | 1999-12-06 | 2000-12-06 | Packaging of integrated circuits and vertical integration |
AU19493/01A AU1949301A (en) | 1999-12-06 | 2000-12-06 | Packaging of integrated circuits and vertical integration |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/456,225 | 1999-12-06 | ||
US09/456,225 US6322903B1 (en) | 1999-12-06 | 1999-12-06 | Package of integrated circuits and vertical integration |
Publications (2)
Publication Number | Publication Date |
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WO2001041207A1 WO2001041207A1 (en) | 2001-06-07 |
WO2001041207A9 true WO2001041207A9 (en) | 2002-11-07 |
Family
ID=23811960
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2000/033073 WO2001041207A1 (en) | 1999-12-06 | 2000-12-06 | Packaging of integrated circuits and vertical integration |
Country Status (4)
Country | Link |
---|---|
US (2) | US6322903B1 (en) |
EP (1) | EP1247294B1 (en) |
AU (1) | AU1949301A (en) |
WO (1) | WO2001041207A1 (en) |
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-
1999
- 1999-12-06 US US09/456,225 patent/US6322903B1/en not_active Expired - Lifetime
-
2000
- 2000-11-16 US US09/716,092 patent/US6693361B1/en not_active Expired - Lifetime
- 2000-12-06 AU AU19493/01A patent/AU1949301A/en not_active Abandoned
- 2000-12-06 WO PCT/US2000/033073 patent/WO2001041207A1/en active Application Filing
- 2000-12-06 EP EP00982464.0A patent/EP1247294B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1247294A1 (en) | 2002-10-09 |
EP1247294B1 (en) | 2017-10-04 |
EP1247294A4 (en) | 2009-05-06 |
WO2001041207A1 (en) | 2001-06-07 |
AU1949301A (en) | 2001-06-12 |
US6322903B1 (en) | 2001-11-27 |
US6693361B1 (en) | 2004-02-17 |
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