WO2001048870A3 - Interconnect for microelectronic structures with enhanced spring characteristics - Google Patents
Interconnect for microelectronic structures with enhanced spring characteristics Download PDFInfo
- Publication number
- WO2001048870A3 WO2001048870A3 PCT/US2000/035450 US0035450W WO0148870A3 WO 2001048870 A3 WO2001048870 A3 WO 2001048870A3 US 0035450 W US0035450 W US 0035450W WO 0148870 A3 WO0148870 A3 WO 0148870A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- interconnection
- spring constant
- interconnect
- coupled
- spring characteristics
- Prior art date
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- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/49—Method of mechanical manufacture
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- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49224—Contact or terminal manufacturing with coating
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU26036/01A AU2603601A (en) | 1999-12-28 | 2000-12-27 | Interconnect for microelectronic structures with enhanced spring characteristics |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/473,414 US6827584B2 (en) | 1999-12-28 | 1999-12-28 | Interconnect for microelectronic structures with enhanced spring characteristics |
US09/473,414 | 1999-12-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2001048870A2 WO2001048870A2 (en) | 2001-07-05 |
WO2001048870A3 true WO2001048870A3 (en) | 2002-02-21 |
Family
ID=23879422
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2000/035450 WO2001048870A2 (en) | 1999-12-28 | 2000-12-27 | Interconnect for microelectronic structures with enhanced spring characteristics |
Country Status (3)
Country | Link |
---|---|
US (4) | US6827584B2 (en) |
AU (1) | AU2603601A (en) |
WO (1) | WO2001048870A2 (en) |
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Also Published As
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US20060211278A1 (en) | 2006-09-21 |
US20040102064A1 (en) | 2004-05-27 |
AU2603601A (en) | 2001-07-09 |
US20020164893A1 (en) | 2002-11-07 |
US20080120833A1 (en) | 2008-05-29 |
WO2001048870A2 (en) | 2001-07-05 |
US7048548B2 (en) | 2006-05-23 |
US7325302B2 (en) | 2008-02-05 |
US6827584B2 (en) | 2004-12-07 |
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