WO2001067512A3 - Method and apparatus for delivering power to high performance electronic assemblies - Google Patents

Method and apparatus for delivering power to high performance electronic assemblies Download PDF

Info

Publication number
WO2001067512A3
WO2001067512A3 PCT/US2001/007410 US0107410W WO0167512A3 WO 2001067512 A3 WO2001067512 A3 WO 2001067512A3 US 0107410 W US0107410 W US 0107410W WO 0167512 A3 WO0167512 A3 WO 0167512A3
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
conductive
high performance
conductive member
delivering power
Prior art date
Application number
PCT/US2001/007410
Other languages
French (fr)
Other versions
WO2001067512A2 (en
Inventor
Joseph Ted Ii Dibene
David Hartke
Edward J Derian
Carl E Hoge
James M Broder
Andreas Jose B San
Joseph S Riel
Original Assignee
Incep Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Incep Technologies Inc filed Critical Incep Technologies Inc
Priority to CA002402229A priority Critical patent/CA2402229A1/en
Priority to EP01944111A priority patent/EP1261999A2/en
Priority to AU2001266554A priority patent/AU2001266554A1/en
Publication of WO2001067512A2 publication Critical patent/WO2001067512A2/en
Publication of WO2001067512A3 publication Critical patent/WO2001067512A3/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/189—Power distribution
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1092—Plug-in assemblages of components, e.g. IC sockets with built-in components, e.g. intelligent sockets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10704—Pin grid array [PGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Abstract

A method, apparatus, and article of manufacture for providing power from a first circuit board having a first circuit board first conductive surface and a first circuit board second conductive surface to a second circuit board having a second circuit board first conductive surface and a second circuit board second conductive surface is described. The apparatus comprises a first conductive member, including a first end having a first conductive member surface electrically coupleable to the first circuit board first conductive surface and a second end distal from the first end having a first conductive member second surface electrically coupleable to the second circuit board first surface. The apparatus also comprises a second conductive member, having a second conductive member first surface electrically coupleable to the first circuit board second surface and a second conductive member second surface distal from the second conductive member first surface electrically coupleable to the second circuit board second conductive surface.
PCT/US2001/007410 2000-03-08 2001-03-08 Method and apparatus for delivering power to high performance electronic assemblies WO2001067512A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CA002402229A CA2402229A1 (en) 2000-03-08 2001-03-08 Method and apparatus for delivering power to high performance electronic assemblies
EP01944111A EP1261999A2 (en) 2000-03-08 2001-03-08 Method and apparatus for delivering power to high performance electronic assemblies
AU2001266554A AU2001266554A1 (en) 2000-03-08 2001-03-08 Method and apparatus for delivering power to high performance electronic assemblies

Applications Claiming Priority (14)

Application Number Priority Date Filing Date Title
US18777700P 2000-03-08 2000-03-08
US60/187,777 2000-03-08
US19605900P 2000-04-10 2000-04-10
US60/196,059 2000-04-10
US21981300P 2000-07-21 2000-07-21
US60/219,813 2000-07-21
US23297100P 2000-09-14 2000-09-14
US60/232,971 2000-09-14
US25122200P 2000-12-04 2000-12-04
US25118400P 2000-12-04 2000-12-04
US25122300P 2000-12-04 2000-12-04
US60/251,222 2000-12-04
US60/251,184 2000-12-04
US60/251,223 2000-12-04

Publications (2)

Publication Number Publication Date
WO2001067512A2 WO2001067512A2 (en) 2001-09-13
WO2001067512A3 true WO2001067512A3 (en) 2002-05-10

Family

ID=27569217

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/007410 WO2001067512A2 (en) 2000-03-08 2001-03-08 Method and apparatus for delivering power to high performance electronic assemblies

Country Status (4)

Country Link
EP (1) EP1261999A2 (en)
AU (1) AU2001266554A1 (en)
CA (1) CA2402229A1 (en)
WO (1) WO2001067512A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6801431B2 (en) 1999-07-15 2004-10-05 Incep Technologies, Inc. Integrated power delivery and cooling system for high power microprocessors
US20030214800A1 (en) 1999-07-15 2003-11-20 Dibene Joseph Ted System and method for processor power delivery and thermal management
DE10107839A1 (en) 2001-02-16 2002-09-05 Philips Corp Intellectual Pty Arrangement with an integrated circuit mounted on a carrier and a power supply assembly
US6979784B1 (en) 2003-10-17 2005-12-27 Advanced Micro Devices, Inc. Component power interface board
DE102021209318A1 (en) 2021-08-25 2023-03-02 Robert Bosch Gesellschaft mit beschränkter Haftung Drive arrangement of an electric bicycle

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5065280A (en) * 1990-08-30 1991-11-12 Hewlett-Packard Company Flex interconnect module
EP0582145A1 (en) * 1992-08-05 1994-02-09 The Whitaker Corporation Coaxial connector for connecting two circuit boards
JPH08204304A (en) * 1995-01-30 1996-08-09 Meidensha Corp Printed board group
US5825633A (en) * 1996-11-05 1998-10-20 Motorola, Inc. Multi-board electronic assembly including spacer for multiple electrical interconnections
US6231352B1 (en) * 1999-02-11 2001-05-15 Radiall Coaxial coupling for interconnecting two printed circuit cards

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5065280A (en) * 1990-08-30 1991-11-12 Hewlett-Packard Company Flex interconnect module
EP0582145A1 (en) * 1992-08-05 1994-02-09 The Whitaker Corporation Coaxial connector for connecting two circuit boards
JPH08204304A (en) * 1995-01-30 1996-08-09 Meidensha Corp Printed board group
US5825633A (en) * 1996-11-05 1998-10-20 Motorola, Inc. Multi-board electronic assembly including spacer for multiple electrical interconnections
US6231352B1 (en) * 1999-02-11 2001-05-15 Radiall Coaxial coupling for interconnecting two printed circuit cards

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 12 26 December 1996 (1996-12-26) *

Also Published As

Publication number Publication date
WO2001067512A2 (en) 2001-09-13
EP1261999A2 (en) 2002-12-04
CA2402229A1 (en) 2001-09-13
AU2001266554A1 (en) 2001-09-17

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