WO2001071780A3 - Apparatus and method for electrochemically processing a microelectronic workpiece - Google Patents

Apparatus and method for electrochemically processing a microelectronic workpiece Download PDF

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Publication number
WO2001071780A3
WO2001071780A3 PCT/US2001/009149 US0109149W WO0171780A3 WO 2001071780 A3 WO2001071780 A3 WO 2001071780A3 US 0109149 W US0109149 W US 0109149W WO 0171780 A3 WO0171780 A3 WO 0171780A3
Authority
WO
WIPO (PCT)
Prior art keywords
electrode
fluid flow
processing
flow region
microelectronic workpiece
Prior art date
Application number
PCT/US2001/009149
Other languages
French (fr)
Other versions
WO2001071780A2 (en
Inventor
Kyle M Hanson
Scott Grace
Matt Johnson
Ken Gibbbons
Original Assignee
Semitool Inc
Kyle M Hanson
Scott Grace
Matt Johnson
Ken Gibbbons
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semitool Inc, Kyle M Hanson, Scott Grace, Matt Johnson, Ken Gibbbons filed Critical Semitool Inc
Priority to AU2001287255A priority Critical patent/AU2001287255A1/en
Publication of WO2001071780A2 publication Critical patent/WO2001071780A2/en
Publication of WO2001071780A3 publication Critical patent/WO2001071780A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition

Abstract

A method and apparatus for electrochemically processing a microelectronic workpiece. The apparatus can include one or more walls defining a processing space configured to contain a processing fluid. The processing space can include at least a first fluid flow region and a second fluid flow region. A first electrode can be disposed in the processing fluid of the first fluid flow region while a second electrode can be coupled to a portion of the microelectronic workpiece, and can be disposed in the processing fluid of the second fluid flow region. Fluid flow within the first fluid flow region can be directed generally toward the first electrode and away from the second electrode while fluid flow within the second fluid flow region can be directed generally toward the second electrode and away from the first electrode. The first electrode may include either an anode or a cathode. A third electrode can be positioned external to the processing space to clean the second electrode and/or control the electrochemical process.
PCT/US2001/009149 2000-03-21 2001-03-21 Apparatus and method for electrochemically processing a microelectronic workpiece WO2001071780A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2001287255A AU2001287255A1 (en) 2000-03-21 2001-03-21 Apparatus and method for electrochemically processing a microelectronic workpiece

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/531,828 2000-03-21
US09/531,828 US6368475B1 (en) 2000-03-21 2000-03-21 Apparatus for electrochemically processing a microelectronic workpiece

Publications (2)

Publication Number Publication Date
WO2001071780A2 WO2001071780A2 (en) 2001-09-27
WO2001071780A3 true WO2001071780A3 (en) 2004-12-23

Family

ID=24119217

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/009149 WO2001071780A2 (en) 2000-03-21 2001-03-21 Apparatus and method for electrochemically processing a microelectronic workpiece

Country Status (3)

Country Link
US (4) US6368475B1 (en)
AU (1) AU2001287255A1 (en)
WO (1) WO2001071780A2 (en)

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US6368475B1 (en) 2002-04-09
US20060191795A1 (en) 2006-08-31
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US20060191790A1 (en) 2006-08-31
US20020084183A1 (en) 2002-07-04

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