WO2001075534A3 - System and method for predicting software models using material-centric process instrumentation - Google Patents

System and method for predicting software models using material-centric process instrumentation Download PDF

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Publication number
WO2001075534A3
WO2001075534A3 PCT/US2001/010477 US0110477W WO0175534A3 WO 2001075534 A3 WO2001075534 A3 WO 2001075534A3 US 0110477 W US0110477 W US 0110477W WO 0175534 A3 WO0175534 A3 WO 0175534A3
Authority
WO
WIPO (PCT)
Prior art keywords
software models
process instrumentation
predicting software
centric process
run
Prior art date
Application number
PCT/US2001/010477
Other languages
French (fr)
Other versions
WO2001075534A2 (en
Inventor
Rafael Mendez
Randy Smith
Matthew Weldon
Adithya Mokshagundam
David G Wasinger
Original Assignee
Speedfam Ipec Corp
Rafael Mendez
Randy Smith
Matthew Weldon
Adithya Mokshagundam
David G Wasinger
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedfam Ipec Corp, Rafael Mendez, Randy Smith, Matthew Weldon, Adithya Mokshagundam, David G Wasinger filed Critical Speedfam Ipec Corp
Priority to AU2001249724A priority Critical patent/AU2001249724A1/en
Publication of WO2001075534A2 publication Critical patent/WO2001075534A2/en
Publication of WO2001075534A3 publication Critical patent/WO2001075534A3/en

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Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
    • G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
    • G05B13/0205—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric not using a model or a simulator of the controlled system
    • G05B13/026—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric not using a model or a simulator of the controlled system using a predictor
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
    • G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
    • G05B13/04—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators
    • G05B13/048—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators using a predictor
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B17/00—Systems involving the use of models or simulators of said systems
    • G05B17/02—Systems involving the use of models or simulators of said systems electric
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/04—Programme control other than numerical control, i.e. in sequence controllers or logic controllers
    • G05B19/042—Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45232—CMP chemical mechanical polishing of wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Health & Medical Sciences (AREA)
  • Artificial Intelligence (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Evolutionary Computation (AREA)
  • Medical Informatics (AREA)
  • Software Systems (AREA)
  • General Factory Administration (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

A system and method for predicting software models used in chemical mechanical polishing (CMP) of workpieces using material-centric process instrumentation. One embodiment is a system which includes a feed forward loop (44) for computing predictive calculations, a feed back loop (46) for computing run-to-run calculations, a historical database (48) which links together the feed forward and feed back loops, and a computational engine (56) used to calculate new or adjusted CMP process parameters.
PCT/US2001/010477 2000-04-03 2001-03-30 System and method for predicting software models using material-centric process instrumentation WO2001075534A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2001249724A AU2001249724A1 (en) 2000-04-03 2001-03-30 System and method for predicting software models using material-centric process instrumentation

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US19423700P 2000-04-03 2000-04-03
US60/194,237 2000-04-03

Publications (2)

Publication Number Publication Date
WO2001075534A2 WO2001075534A2 (en) 2001-10-11
WO2001075534A3 true WO2001075534A3 (en) 2002-05-23

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/010477 WO2001075534A2 (en) 2000-04-03 2001-03-30 System and method for predicting software models using material-centric process instrumentation

Country Status (3)

Country Link
US (1) US20010039462A1 (en)
AU (1) AU2001249724A1 (en)
WO (1) WO2001075534A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108490787A (en) * 2018-04-29 2018-09-04 天津大学 Saturation system Composite nonlinear feedback control device design method based on event triggering

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7008300B1 (en) * 2000-10-10 2006-03-07 Beaver Creek Concepts Inc Advanced wafer refining
US6640151B1 (en) 1999-12-22 2003-10-28 Applied Materials, Inc. Multi-tool control system, method and medium
US6708074B1 (en) 2000-08-11 2004-03-16 Applied Materials, Inc. Generic interface builder
US7188142B2 (en) 2000-11-30 2007-03-06 Applied Materials, Inc. Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility
US6782343B2 (en) * 2001-02-28 2004-08-24 Asm International N.V. Resource consumption calculator
US7103439B1 (en) * 2001-04-02 2006-09-05 Advanced Micro Devices, Inc. Method and apparatus for initializing tool controllers based on tool event data
JP4348412B2 (en) * 2001-04-26 2009-10-21 東京エレクトロン株式会社 Measurement system cluster
US7089075B2 (en) * 2001-05-04 2006-08-08 Tokyo Electron Limited Systems and methods for metrology recipe and model generation
US7160739B2 (en) 2001-06-19 2007-01-09 Applied Materials, Inc. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
US7698012B2 (en) 2001-06-19 2010-04-13 Applied Materials, Inc. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
JP4876345B2 (en) * 2001-08-22 2012-02-15 株式会社ニコン Simulation method and apparatus, and polishing method and apparatus using the same
US20030220708A1 (en) * 2001-11-28 2003-11-27 Applied Materials, Inc. Integrated equipment set for forming shallow trench isolation regions
US20030199112A1 (en) 2002-03-22 2003-10-23 Applied Materials, Inc. Copper wiring module control
US6799311B1 (en) * 2002-06-27 2004-09-28 Advanced Micro Devices, Inc. Batch/lot organization based on quality characteristics
US7668702B2 (en) * 2002-07-19 2010-02-23 Applied Materials, Inc. Method, system and medium for controlling manufacturing process using adaptive models based on empirical data
DE10348563B4 (en) 2002-10-22 2014-01-09 Fisher-Rosemount Systems, Inc. Integration of graphic display elements, process modules and control modules in process plants
US9983559B2 (en) 2002-10-22 2018-05-29 Fisher-Rosemount Systems, Inc. Updating and utilizing dynamic process simulation in an operating process environment
US7272459B2 (en) 2002-11-15 2007-09-18 Applied Materials, Inc. Method, system and medium for controlling manufacture process having multivariate input parameters
US7254453B2 (en) * 2002-11-21 2007-08-07 Advanced Micro Devices, Inc. Secondary process controller for supplementing a primary process controller
US20050033464A1 (en) * 2003-08-06 2005-02-10 Siemens Dematic Electronics Assembly Systems, Inc. Real time closed-loop process control system for defect prevention
US20060107898A1 (en) * 2004-11-19 2006-05-25 Blomberg Tom E Method and apparatus for measuring consumption of reactants
DE102005009022A1 (en) * 2005-02-28 2006-09-07 Advanced Micro Devices, Inc., Sunnyvale Automatic throughput control system and method of operating the same
WO2006093604A2 (en) * 2005-02-28 2006-09-08 Advanced Micro Devices Inc Automated throughput control system and method of operating the same
JP4884801B2 (en) * 2005-10-06 2012-02-29 東京エレクトロン株式会社 Processing system
US8055370B1 (en) * 2006-06-23 2011-11-08 Novellus Systems, Inc. Apparatus and methods for monitoring health of semiconductor process systems
US8151814B2 (en) * 2009-01-13 2012-04-10 Asm Japan K.K. Method for controlling flow and concentration of liquid precursor
JP5334787B2 (en) * 2009-10-09 2013-11-06 株式会社日立ハイテクノロジーズ Plasma processing equipment
CN104155914A (en) * 2014-09-01 2014-11-19 湘潭大学 CMP process intelligent decision making system for polishing carbide blade
US10878140B2 (en) 2016-07-27 2020-12-29 Emerson Process Management Power & Water Solutions, Inc. Plant builder system with integrated simulation and control system configuration
US11418969B2 (en) 2021-01-15 2022-08-16 Fisher-Rosemount Systems, Inc. Suggestive device connectivity planning

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5661669A (en) * 1993-12-17 1997-08-26 Texas Instruments Incorporated Method for controlling semiconductor wafer processing
US5740033A (en) * 1992-10-13 1998-04-14 The Dow Chemical Company Model predictive controller
WO1999025520A1 (en) * 1997-11-18 1999-05-27 Speedfam-Ipec Corporation Method and apparatus for modeling a chemical mechanical polishing process
WO2000000874A1 (en) * 1998-06-26 2000-01-06 Advanced Micro Devices, Inc. System and method for controlling the manufacture of discrete parts in semiconductor fabrication using model predictive control

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5599423A (en) * 1995-06-30 1997-02-04 Applied Materials, Inc. Apparatus and method for simulating and optimizing a chemical mechanical polishing system
CA2255915A1 (en) * 1997-03-15 1998-09-24 Makino Milling Machine Co., Ltd. Machining processor
US5926690A (en) * 1997-05-28 1999-07-20 Advanced Micro Devices, Inc. Run-to-run control process for controlling critical dimensions
US6148239A (en) * 1997-12-12 2000-11-14 Advanced Micro Devices, Inc. Process control system using feed forward control threads based on material groups
US6405144B1 (en) * 2000-01-18 2002-06-11 Advanced Micro Devices, Inc. Method and apparatus for programmed latency for improving wafer-to-wafer uniformity

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5740033A (en) * 1992-10-13 1998-04-14 The Dow Chemical Company Model predictive controller
US5661669A (en) * 1993-12-17 1997-08-26 Texas Instruments Incorporated Method for controlling semiconductor wafer processing
WO1999025520A1 (en) * 1997-11-18 1999-05-27 Speedfam-Ipec Corporation Method and apparatus for modeling a chemical mechanical polishing process
WO2000000874A1 (en) * 1998-06-26 2000-01-06 Advanced Micro Devices, Inc. System and method for controlling the manufacture of discrete parts in semiconductor fabrication using model predictive control

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108490787A (en) * 2018-04-29 2018-09-04 天津大学 Saturation system Composite nonlinear feedback control device design method based on event triggering

Also Published As

Publication number Publication date
WO2001075534A2 (en) 2001-10-11
US20010039462A1 (en) 2001-11-08
AU2001249724A1 (en) 2001-10-15

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