WO2001093647A3 - Filling method - Google Patents

Filling method Download PDF

Info

Publication number
WO2001093647A3
WO2001093647A3 PCT/US2001/016956 US0116956W WO0193647A3 WO 2001093647 A3 WO2001093647 A3 WO 2001093647A3 US 0116956 W US0116956 W US 0116956W WO 0193647 A3 WO0193647 A3 WO 0193647A3
Authority
WO
WIPO (PCT)
Prior art keywords
fill material
pressure head
electronic substrate
source
filling method
Prior art date
Application number
PCT/US2001/016956
Other languages
French (fr)
Other versions
WO2001093647A2 (en
Inventor
Jesse Pedigo
Original Assignee
Honeywell Int Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/752,503 external-priority patent/US6506332B2/en
Application filed by Honeywell Int Inc filed Critical Honeywell Int Inc
Priority to JP2001588299A priority Critical patent/JP2004501513A/en
Priority to DE10196262T priority patent/DE10196262T1/en
Priority to AU2001274958A priority patent/AU2001274958A1/en
Publication of WO2001093647A2 publication Critical patent/WO2001093647A2/en
Publication of WO2001093647A3 publication Critical patent/WO2001093647A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10204—Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0182—Using a temporary spacer element or stand-off during processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates

Abstract

A method for filling vias (132) in an electronic substrate (130) which includes providing a source of fill material (141, 142); providing a pressure head (200) coupled to the source of fill material (141, 142) via a fill material inlet (120), the pressure head further comprising an elongated fill material outlet (340) which is substantially larger than the fill material inlet (120); placing the pressure head (200) in contact with the electronic substrate (130); and pressurizing the fill material to inject fill material into the vias (132) of the electronic substrate (130).
PCT/US2001/016956 2000-05-31 2001-05-24 Filling method WO2001093647A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2001588299A JP2004501513A (en) 2000-05-31 2001-05-24 Filling method
DE10196262T DE10196262T1 (en) 2000-05-31 2001-05-24 filling system
AU2001274958A AU2001274958A1 (en) 2000-05-31 2001-05-24 Filling method

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US20845600P 2000-05-31 2000-05-31
US60/208,456 2000-05-31
US09/752,503 2000-12-28
US09/752,503 US6506332B2 (en) 2000-05-31 2000-12-28 Filling method

Publications (2)

Publication Number Publication Date
WO2001093647A2 WO2001093647A2 (en) 2001-12-06
WO2001093647A3 true WO2001093647A3 (en) 2002-04-04

Family

ID=26903212

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/016956 WO2001093647A2 (en) 2000-05-31 2001-05-24 Filling method

Country Status (7)

Country Link
US (3) US6793852B2 (en)
JP (1) JP2004501513A (en)
KR (1) KR20030007753A (en)
CN (1) CN1444839A (en)
AU (1) AU2001274958A1 (en)
DE (1) DE10196262T1 (en)
WO (1) WO2001093647A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001093648A2 (en) * 2000-05-31 2001-12-06 Honeywell International Inc. Filling device
US7427562B2 (en) * 2006-11-08 2008-09-23 Motorla, Inc. Method for fabricating closed vias in a printed circuit board
US7557304B2 (en) * 2006-11-08 2009-07-07 Motorola, Inc. Printed circuit board having closed vias
GB0624562D0 (en) * 2006-12-08 2007-01-17 Airbus Uk Ltd Self Curing Injection Nozzle
DE102007053513B3 (en) * 2007-11-09 2009-07-16 Itc Intercircuit Electronic Gmbh filling station
WO2012074563A2 (en) * 2010-01-21 2012-06-07 Henkel Corporation Ultrasonic assisted filling of cavities
JP2013171862A (en) * 2012-02-17 2013-09-02 Tokyo Electron Ltd Metal paste filling method, metal paste filling device, and via plug manufacturing method
PL2636322T3 (en) * 2012-03-06 2018-10-31 Hauni Maschinenbau Gmbh Device for inserting one or more objects into a filter component of a tobacco rod and machine for the tobacco processing industry
DE102016006813B4 (en) * 2016-06-03 2021-04-08 Ksg Austria Gmbh Process for the production of a multilayer printed circuit board with contacting of inner layers as well as multilayer printed circuit board
WO2023036982A1 (en) 2021-09-10 2023-03-16 Harbour Antibodies Bv Anti-sars2-s antibodies

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US20020113330A1 (en) 2002-08-22
AU2001274958A1 (en) 2001-12-11
US6793852B2 (en) 2004-09-21
US6797224B2 (en) 2004-09-28
KR20030007753A (en) 2003-01-23
CN1444839A (en) 2003-09-24
WO2001093647A2 (en) 2001-12-06
US20020089086A1 (en) 2002-07-11
DE10196262T1 (en) 2003-05-15
JP2004501513A (en) 2004-01-15
US20020135104A1 (en) 2002-09-26
US6921505B2 (en) 2005-07-26

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