WO2001094253A3 - Bulk silicon structures with thin film flexible elements - Google Patents

Bulk silicon structures with thin film flexible elements Download PDF

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Publication number
WO2001094253A3
WO2001094253A3 PCT/US2001/017020 US0117020W WO0194253A3 WO 2001094253 A3 WO2001094253 A3 WO 2001094253A3 US 0117020 W US0117020 W US 0117020W WO 0194253 A3 WO0194253 A3 WO 0194253A3
Authority
WO
WIPO (PCT)
Prior art keywords
thin film
sacrificial material
flexible elements
bulk silicon
film flexible
Prior art date
Application number
PCT/US2001/017020
Other languages
French (fr)
Other versions
WO2001094253A2 (en
Inventor
John Matthew Chong
Original Assignee
Calient Networks Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Calient Networks Inc filed Critical Calient Networks Inc
Publication of WO2001094253A2 publication Critical patent/WO2001094253A2/en
Publication of WO2001094253A3 publication Critical patent/WO2001094253A3/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/35—Optical coupling means having switching means
    • G02B6/3564—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details
    • G02B6/3584—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details constructional details of an associated actuator having a MEMS construction, i.e. constructed using semiconductor technology such as etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00182—Arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a transducer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00642—Manufacture or treatment of devices or systems in or on a substrate for improving the physical properties of a device
    • B81C1/0065—Mechanical properties
    • B81C1/00666—Treatments for controlling internal stress or strain in MEMS structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/045—Optical switches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0109—Bridges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0323—Grooves
    • B81B2203/033—Trenches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0102—Surface micromachining
    • B81C2201/0105—Sacrificial layer
    • B81C2201/0109—Sacrificial layers not provided for in B81C2201/0107 - B81C2201/0108
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/35—Optical coupling means having switching means
    • G02B6/351—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements
    • G02B6/3512—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements the optical element being reflective, e.g. mirror
    • G02B6/3518—Optical coupling means having switching means involving stationary waveguides with moving interposed optical elements the optical element being reflective, e.g. mirror the reflective optical element being an intrinsic part of a MEMS device, i.e. fabricated together with the MEMS device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/35—Optical coupling means having switching means
    • G02B6/354—Switching arrangements, i.e. number of input/output ports and interconnection types
    • G02B6/3554—3D constellations, i.e. with switching elements and switched beams located in a volume
    • G02B6/3556—NxM switch, i.e. regular arrays of switches elements of matrix type constellation
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/35—Optical coupling means having switching means
    • G02B6/3564—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details
    • G02B6/3568—Mechanical details of the actuation mechanism associated with the moving element or mounting mechanism details characterised by the actuating force
    • G02B6/357—Electrostatic force

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Micromachines (AREA)
  • Weting (AREA)
  • Pressure Sensors (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)

Abstract

A method for forming a suspend structure with thin film flexible elements is disclosed. In one embodiment, the method etches a trench in a bulk substrate around to be released components. The trench is filled with sacrificial material. The surface of the sacrificial material is planarized. Thin film hinge material is patterned and etched on the surface of the sacrificial material. The bulk substrate is then etched from the backside to pre-release the sacrificial material. The sacrificial material is etched to remove the sacrificial material, thus forming a suspended structure with thin film hinges.
PCT/US2001/017020 2000-06-02 2001-05-24 Bulk silicon structures with thin film flexible elements WO2001094253A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US58595000A 2000-06-02 2000-06-02
US09/585,950 2000-06-02

Publications (2)

Publication Number Publication Date
WO2001094253A2 WO2001094253A2 (en) 2001-12-13
WO2001094253A3 true WO2001094253A3 (en) 2002-04-04

Family

ID=24343674

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/017020 WO2001094253A2 (en) 2000-06-02 2001-05-24 Bulk silicon structures with thin film flexible elements

Country Status (1)

Country Link
WO (1) WO2001094253A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7209274B2 (en) 2001-06-02 2007-04-24 Capella Photonics, Inc. High fill-factor bulk silicon mirrors
US6695457B2 (en) 2001-06-02 2004-02-24 Capella Photonics, Inc. Bulk silicon mirrors with hinges underneath
US9706646B2 (en) 2013-01-15 2017-07-11 Arizona Board of Regenst acting for and on behalf of Arizona State University Origami enabled manufacturing systems and methods
US10153519B2 (en) 2013-12-27 2018-12-11 Arizona Board Of Regents On Behalf Of Arizona State University Deformable origami batteries
WO2016049444A1 (en) 2014-09-26 2016-03-31 Arizona Board Of Regents On Behalf Of Arizona State University Stretchable batteries
WO2016109652A1 (en) 2015-01-02 2016-07-07 Arizona Board Of Regents On Behalf Of Arizona State University Archimedean spiral design for deformable electronics
US10502991B2 (en) 2015-02-05 2019-12-10 The Arizona Board Of Regents On Behalf Of Arizona State University Origami displays and methods for their manufacture
US10390698B2 (en) 2016-06-16 2019-08-27 Arizona Board Of Regents On Behalf Of Arizona State University Conductive and stretchable polymer composite

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3493820A (en) * 1966-12-01 1970-02-03 Raytheon Co Airgap isolated semiconductor device
US5583373A (en) * 1994-03-07 1996-12-10 National Semiconductor Corporation Apparatus for achieving mechanical and thermal isolation of portions of integrated monolithic circuits
US5629790A (en) * 1993-10-18 1997-05-13 Neukermans; Armand P. Micromachined torsional scanner
EP0834759A2 (en) * 1996-09-27 1998-04-08 Mcnc Microelectromechanical devices including rotating plates and related methods
US5907425A (en) * 1995-12-19 1999-05-25 The Board Of Trustees Of The Leland Stanford Junior University Miniature scanning confocal microscope
DE19757181A1 (en) * 1997-12-19 1999-07-01 Bosch Gmbh Robert Arrangement for coupling glass fibers
WO1999067666A1 (en) * 1998-06-05 1999-12-29 Astarte Fiber Networks, Inc. Mirror based fiber optic switch and control system

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3493820A (en) * 1966-12-01 1970-02-03 Raytheon Co Airgap isolated semiconductor device
US5629790A (en) * 1993-10-18 1997-05-13 Neukermans; Armand P. Micromachined torsional scanner
US5583373A (en) * 1994-03-07 1996-12-10 National Semiconductor Corporation Apparatus for achieving mechanical and thermal isolation of portions of integrated monolithic circuits
US5907425A (en) * 1995-12-19 1999-05-25 The Board Of Trustees Of The Leland Stanford Junior University Miniature scanning confocal microscope
EP0834759A2 (en) * 1996-09-27 1998-04-08 Mcnc Microelectromechanical devices including rotating plates and related methods
DE19757181A1 (en) * 1997-12-19 1999-07-01 Bosch Gmbh Robert Arrangement for coupling glass fibers
WO1999067666A1 (en) * 1998-06-05 1999-12-29 Astarte Fiber Networks, Inc. Mirror based fiber optic switch and control system

Also Published As

Publication number Publication date
WO2001094253A2 (en) 2001-12-13

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