WO2001099035A3 - Sensor unit, especially for fingerprint sensors - Google Patents

Sensor unit, especially for fingerprint sensors Download PDF

Info

Publication number
WO2001099035A3
WO2001099035A3 PCT/NO2001/000238 NO0100238W WO0199035A3 WO 2001099035 A3 WO2001099035 A3 WO 2001099035A3 NO 0100238 W NO0100238 W NO 0100238W WO 0199035 A3 WO0199035 A3 WO 0199035A3
Authority
WO
WIPO (PCT)
Prior art keywords
sensor unit
chip
fingerprint sensors
substrate
sensor
Prior art date
Application number
PCT/NO2001/000238
Other languages
French (fr)
Other versions
WO2001099035A2 (en
Inventor
Mathiassen Svein
Ovidiu Vermesan
Jon Nysaether
Bjoern Erik Seeberg
Original Assignee
Idex As
Mathiassen Svein
Ovidiu Vermesan
Jon Nysaether
Bjoern Erik Seeberg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Idex As, Mathiassen Svein, Ovidiu Vermesan, Jon Nysaether, Bjoern Erik Seeberg filed Critical Idex As
Priority to JP2002503803A priority Critical patent/JP4708671B2/en
Priority to DK01938853T priority patent/DK1303828T3/en
Priority to US10/297,746 priority patent/US7251351B2/en
Priority to AU2001264429A priority patent/AU2001264429A1/en
Priority to EP01938853A priority patent/EP1303828B1/en
Priority to DE60132460T priority patent/DE60132460T2/en
Publication of WO2001099035A2 publication Critical patent/WO2001099035A2/en
Publication of WO2001099035A3 publication Critical patent/WO2001099035A3/en
Priority to US11/773,017 priority patent/US7848550B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/1335—Combining adjacent partial images (e.g. slices) to create a composite input or reference pattern; Tracking a sweeping finger movement
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16235—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a via metallisation of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H01L2924/15321—Connection portion the connection portion being formed on the die mounting surface of the substrate being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides

Landscapes

  • Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
  • Image Input (AREA)
  • Thin Film Transistor (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)

Abstract

The invention relates to a sensor chip, especially for measuring structures in a finger surface, comprising an electronic chip of a per se known type being provided with a number of sensor electrodes for capacitance measurements, the chip being positioned on an electrically insulating substrate being provided with a number of openings through which electrical conductors are provided, the ends of said conductors constituting a sensor array for capacitance measurements so that the sensor array is positioned on a first side od said substrate and the electronic chip is positioned on the other side of the substrate.
PCT/NO2001/000238 2000-06-09 2001-06-08 Sensor unit, especially for fingerprint sensors WO2001099035A2 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2002503803A JP4708671B2 (en) 2000-06-09 2001-06-08 Sensor chip especially for fingerprint sensor
DK01938853T DK1303828T3 (en) 2000-06-09 2001-06-08 Sensor chip, especially for fingerprint sensors
US10/297,746 US7251351B2 (en) 2000-06-09 2001-06-08 Sensor unit, especially for fingerprint sensors
AU2001264429A AU2001264429A1 (en) 2000-06-09 2001-06-08 Sensor unit, especially for fingerprint sensors
EP01938853A EP1303828B1 (en) 2000-06-09 2001-06-08 Sensor Unit, especially for Fingerprint Sensors
DE60132460T DE60132460T2 (en) 2000-06-09 2001-06-08 Sensor unit, in particular for fingerprint sensors
US11/773,017 US7848550B2 (en) 2000-06-09 2007-07-03 Sensor unit, especially for fingerprint sensors

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NO20003004A NO315017B1 (en) 2000-06-09 2000-06-09 Sensor chip, especially for measuring structures in a finger surface
NO20003004 2000-06-09

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US10297746 A-371-Of-International 2001-06-08
US11/773,017 Continuation US7848550B2 (en) 2000-06-09 2007-07-03 Sensor unit, especially for fingerprint sensors

Publications (2)

Publication Number Publication Date
WO2001099035A2 WO2001099035A2 (en) 2001-12-27
WO2001099035A3 true WO2001099035A3 (en) 2002-05-02

Family

ID=19911250

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/NO2001/000238 WO2001099035A2 (en) 2000-06-09 2001-06-08 Sensor unit, especially for fingerprint sensors

Country Status (12)

Country Link
US (2) US7251351B2 (en)
EP (1) EP1303828B1 (en)
JP (1) JP4708671B2 (en)
AT (1) ATE384306T1 (en)
AU (1) AU2001264429A1 (en)
CY (1) CY1107257T1 (en)
DE (1) DE60132460T2 (en)
DK (1) DK1303828T3 (en)
ES (1) ES2299488T3 (en)
NO (1) NO315017B1 (en)
PT (1) PT1303828E (en)
WO (1) WO2001099035A2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
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US8866347B2 (en) 2010-01-15 2014-10-21 Idex Asa Biometric image sensing
US9600704B2 (en) 2010-01-15 2017-03-21 Idex Asa Electronic imager using an impedance sensor grid array and method of making

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NO315017B1 (en) * 2000-06-09 2003-06-23 Idex Asa Sensor chip, especially for measuring structures in a finger surface
DE60114241T2 (en) * 2000-12-05 2006-07-13 Validity Sensors Inc., Phoenix SYSTEM AND METHOD FOR THE CAPACITIVE RECORDING OF FINGERPRINTS BY EXCEEDING
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