WO2002005332A3 - Loadlock chamber - Google Patents

Loadlock chamber Download PDF

Info

Publication number
WO2002005332A3
WO2002005332A3 PCT/US2001/041238 US0141238W WO0205332A3 WO 2002005332 A3 WO2002005332 A3 WO 2002005332A3 US 0141238 W US0141238 W US 0141238W WO 0205332 A3 WO0205332 A3 WO 0205332A3
Authority
WO
WIPO (PCT)
Prior art keywords
chamber
chamber portion
define
loadlock
opening
Prior art date
Application number
PCT/US2001/041238
Other languages
French (fr)
Other versions
WO2002005332A2 (en
Inventor
Ilya Perlov
Original Assignee
Applied Materials Inc
Ilya Perlov
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc, Ilya Perlov filed Critical Applied Materials Inc
Priority to US10/332,195 priority Critical patent/US20040096300A1/en
Priority to AU2001273667A priority patent/AU2001273667A1/en
Publication of WO2002005332A2 publication Critical patent/WO2002005332A2/en
Publication of WO2002005332A3 publication Critical patent/WO2002005332A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

In a first aspect, a loadlock chamber is provided that includes: (1) a first chamber portion adapted to remain stationary; (2) a second chamber portion adapted to move relative to the first chamber portion; and (3) a substrate handler located between the first and second chamber portions. The loadlock chamber is adapted to assume: (a) a closed position wherein the first and second chamber portions contact one another so as to define a region capable of maintaining a vacuum pressure; (b) an opened position wherein the second chamber portion moves away from the first chamber portion so as to define an opening; and (c) a load position wherein at least a portion of the substrate handler extends through the opening. Systems and methods in accordance with these and other aspects also are provided.
PCT/US2001/041238 2000-07-07 2001-06-30 Loadlock chamber WO2002005332A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/332,195 US20040096300A1 (en) 2001-06-30 2001-06-30 Loadlock chamber
AU2001273667A AU2001273667A1 (en) 2000-07-07 2001-06-30 Loadlock chamber

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US21714400P 2000-07-07 2000-07-07
US60/217,144 2000-07-07

Publications (2)

Publication Number Publication Date
WO2002005332A2 WO2002005332A2 (en) 2002-01-17
WO2002005332A3 true WO2002005332A3 (en) 2002-05-10

Family

ID=22809832

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/041238 WO2002005332A2 (en) 2000-07-07 2001-06-30 Loadlock chamber

Country Status (4)

Country Link
CN (1) CN1440564A (en)
AU (1) AU2001273667A1 (en)
TW (1) TW541589B (en)
WO (1) WO2002005332A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE602006006671D1 (en) 2005-06-17 2009-06-18 Merz Pharma Gmbh & Co Kgaa DEVICE AND METHOD FOR THE FERMENTATIVE MANUFACTURE OF BIOLOGICALLY ACTIVE COMPOUNDS
TW201639063A (en) 2015-01-22 2016-11-01 應用材料股份有限公司 Batch heating and cooling chamber or loadlock

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0764973A2 (en) * 1991-10-25 1997-03-26 Electrotech Limited Processing system
US5788447A (en) * 1995-08-05 1998-08-04 Kokusai Electric Co., Ltd. Substrate processing apparatus
WO1999013504A1 (en) * 1997-09-10 1999-03-18 Tokyo Electron Limited A load-lock mechanism and processing apparatus
US6034000A (en) * 1997-07-28 2000-03-07 Applied Materials, Inc. Multiple loadlock system

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0764973A2 (en) * 1991-10-25 1997-03-26 Electrotech Limited Processing system
US5788447A (en) * 1995-08-05 1998-08-04 Kokusai Electric Co., Ltd. Substrate processing apparatus
US6034000A (en) * 1997-07-28 2000-03-07 Applied Materials, Inc. Multiple loadlock system
WO1999013504A1 (en) * 1997-09-10 1999-03-18 Tokyo Electron Limited A load-lock mechanism and processing apparatus
US6338626B1 (en) * 1997-09-10 2002-01-15 Tokyo Electron Limited Load-lock mechanism and processing apparatus

Also Published As

Publication number Publication date
WO2002005332A2 (en) 2002-01-17
AU2001273667A1 (en) 2002-01-21
TW541589B (en) 2003-07-11
CN1440564A (en) 2003-09-03

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