WO2002017392A3 - Polymer redistribution of flip chip bond pads - Google Patents

Polymer redistribution of flip chip bond pads Download PDF

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Publication number
WO2002017392A3
WO2002017392A3 PCT/US2001/026436 US0126436W WO0217392A3 WO 2002017392 A3 WO2002017392 A3 WO 2002017392A3 US 0126436 W US0126436 W US 0126436W WO 0217392 A3 WO0217392 A3 WO 0217392A3
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WO
WIPO (PCT)
Prior art keywords
flip chip
bond pads
electrically
conductive polymer
chip
Prior art date
Application number
PCT/US2001/026436
Other languages
French (fr)
Other versions
WO2002017392A2 (en
Inventor
Richard H Estes
Original Assignee
Polymer Flip Chip Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polymer Flip Chip Corp filed Critical Polymer Flip Chip Corp
Publication of WO2002017392A2 publication Critical patent/WO2002017392A2/en
Publication of WO2002017392A3 publication Critical patent/WO2002017392A3/en

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Abstract

An electrical interconnection structure for a flip chip is produced for a flip chip having a plurality of chip bond pads in electrical connection with an electronic circuit, whit the chip bond pads provided on a first face of the flip chip. Electrically-conductive polymer bump bond pads are formed on the first face of the flip chip in an arrangement selected for electrical interconnection of the flip chip with a substrate. A plurality of electrically-conductive polymer redistribution traces are formed on the first face of the flip chip, each trace electrically connecting a chip bond pad to a bump bond pad. The electrically-conductive polymer bump bond pads and redistribution traces can be provided together of a common patterned electrically-conductive polymer layer by, e.g., stencilling or screen printing, to enable in one geometrically defined layer bot redistribution traces and interconnection bump bond pads. Historically, redistribution traces and bump bond pads have been provided as a metal layer, e.g., an aluminium layer, formed by, e.g., a sputtering or other metal deposition process, and geometrically defined by a separate photolithography technique. Employing an electrically-conductive polymer layer rather than a metal layer, the invention overcomes the limitations of a metal layer and expands the range of applications that are addressed by a flip chip bond pad redistribution configuration.
PCT/US2001/026436 2000-08-24 2001-08-24 Polymer redistribution of flip chip bond pads WO2002017392A2 (en)

Applications Claiming Priority (2)

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US64565400A 2000-08-24 2000-08-24
US09/645,654 2000-08-24

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WO2002017392A3 true WO2002017392A3 (en) 2003-09-25

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Publication number Priority date Publication date Assignee Title
CN100416806C (en) * 2003-08-20 2008-09-03 日月光半导体制造股份有限公司 Packaging structure with projected zone carrying crystals, crystals carried substrate and crystals carried assembly
SG133445A1 (en) * 2005-12-29 2007-07-30 Micron Technology Inc Methods for packaging microelectronic devices and microelectronic devices formed using such methods
WO2008009447A2 (en) 2006-07-21 2008-01-24 Leonhard Kurz Stiftung & Co. Kg Multilayered body comprising an electroconductive polymer layer and method for the production thereof
DE102006033887B4 (en) * 2006-07-21 2015-04-09 Leonhard Kurz Gmbh & Co. Kg Method for producing a multilayer body with conductive polymer layer
US9236366B2 (en) * 2012-12-20 2016-01-12 Intel Corporation High density organic bridge device and method

Citations (4)

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Publication number Priority date Publication date Assignee Title
US5147210A (en) * 1988-03-03 1992-09-15 Western Digital Corporation Polymer film interconnect
WO1999004430A1 (en) * 1997-07-21 1999-01-28 Aguila Technologies, Inc. Semiconductor flip-chip package and method for the fabrication thereof
US5879761A (en) * 1989-12-18 1999-03-09 Polymer Flip Chip Corporation Method for forming electrically conductive polymer interconnects on electrical substrates
US6084303A (en) * 1996-05-07 2000-07-04 Schlumberger Systems Integrated circuit comprising connection pads emerging on one surface

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5147210A (en) * 1988-03-03 1992-09-15 Western Digital Corporation Polymer film interconnect
US5879761A (en) * 1989-12-18 1999-03-09 Polymer Flip Chip Corporation Method for forming electrically conductive polymer interconnects on electrical substrates
US6084303A (en) * 1996-05-07 2000-07-04 Schlumberger Systems Integrated circuit comprising connection pads emerging on one surface
WO1999004430A1 (en) * 1997-07-21 1999-01-28 Aguila Technologies, Inc. Semiconductor flip-chip package and method for the fabrication thereof

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