WO2002029862A3 - Integrated semiconductor substrate bevel cleaning apparatus and method - Google Patents

Integrated semiconductor substrate bevel cleaning apparatus and method Download PDF

Info

Publication number
WO2002029862A3
WO2002029862A3 PCT/US2001/042412 US0142412W WO0229862A3 WO 2002029862 A3 WO2002029862 A3 WO 2002029862A3 US 0142412 W US0142412 W US 0142412W WO 0229862 A3 WO0229862 A3 WO 0229862A3
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor substrate
cleaning apparatus
integrated semiconductor
bevel cleaning
substrate bevel
Prior art date
Application number
PCT/US2001/042412
Other languages
French (fr)
Other versions
WO2002029862A2 (en
Inventor
Yeuk-Fai Edwin Mok
Alexander Ko
Bernardo Donoso
Joseph J Stevens
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of WO2002029862A2 publication Critical patent/WO2002029862A2/en
Publication of WO2002029862A3 publication Critical patent/WO2002029862A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/6723—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber

Abstract

An integrated semiconductor substrate bevel cleaning system that enables transfer of substrates through the bevel cleaner either with or without substrate processing within the bevel cleaner. The invention provides an integrated bevel cleaning apparatus comprising a transfer position, a rinsing position and an etching position.
PCT/US2001/042412 2000-10-04 2001-10-01 Integrated semiconductor substrate bevel cleaning apparatus and method WO2002029862A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US23790800P 2000-10-04 2000-10-04
US60/237,908 2000-10-04
US09/785,815 US20030213772A9 (en) 1999-07-09 2001-02-16 Integrated semiconductor substrate bevel cleaning apparatus and method
US09/785,815 2001-02-16

Publications (2)

Publication Number Publication Date
WO2002029862A2 WO2002029862A2 (en) 2002-04-11
WO2002029862A3 true WO2002029862A3 (en) 2003-01-23

Family

ID=26931153

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/042412 WO2002029862A2 (en) 2000-10-04 2001-10-01 Integrated semiconductor substrate bevel cleaning apparatus and method

Country Status (3)

Country Link
US (1) US20030213772A9 (en)
TW (1) TW516086B (en)
WO (1) WO2002029862A2 (en)

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US7101799B2 (en) * 2001-06-19 2006-09-05 Applied Materials, Inc. Feedforward and feedback control for conditioning of chemical mechanical polishing pad
US7698012B2 (en) 2001-06-19 2010-04-13 Applied Materials, Inc. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
US6722943B2 (en) * 2001-08-24 2004-04-20 Micron Technology, Inc. Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces
US20030199112A1 (en) 2002-03-22 2003-10-23 Applied Materials, Inc. Copper wiring module control
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US6884152B2 (en) 2003-02-11 2005-04-26 Micron Technology, Inc. Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces
WO2004114375A1 (en) * 2003-06-13 2004-12-29 Sophia Wen Method and apparatus for thin-layer chemical processing of semiconductor wafers
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US20080319879A1 (en) * 2007-06-15 2008-12-25 Jim Carroll Optimized Communication Billing Management System
US9285168B2 (en) * 2010-10-05 2016-03-15 Applied Materials, Inc. Module for ozone cure and post-cure moisture treatment
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US20150107619A1 (en) * 2013-10-22 2015-04-23 Taiwan Semiconductor Manufacturing Company Limited Wafer particle removal
KR101575129B1 (en) * 2014-01-13 2015-12-08 피에스케이 주식회사 Apparatus and method for transporting substrate, and apparatus for treating substrate
BE1025599B9 (en) * 2017-09-28 2019-05-28 Unilin B V B A METHOD FOR MANUFACTURING STRUCTURED PERSONAL ELEMENTS
CN112086382B (en) * 2020-08-03 2022-08-19 北京烁科精微电子装备有限公司 Wafer cleaning equipment
WO2022031268A1 (en) * 2020-08-04 2022-02-10 Applied Materials, Inc. Apparatus for removing photoresist off of photomask

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Also Published As

Publication number Publication date
TW516086B (en) 2003-01-01
US20020113039A1 (en) 2002-08-22
US20030213772A9 (en) 2003-11-20
WO2002029862A2 (en) 2002-04-11

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