WO2002046713A3 - Automated system with improved height sensing - Google Patents

Automated system with improved height sensing Download PDF

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Publication number
WO2002046713A3
WO2002046713A3 PCT/US2001/048318 US0148318W WO0246713A3 WO 2002046713 A3 WO2002046713 A3 WO 2002046713A3 US 0148318 W US0148318 W US 0148318W WO 0246713 A3 WO0246713 A3 WO 0246713A3
Authority
WO
WIPO (PCT)
Prior art keywords
height
automated system
height sensing
sensing
created
Prior art date
Application number
PCT/US2001/048318
Other languages
French (fr)
Other versions
WO2002046713A2 (en
Inventor
Paul R Haugen
David Fishbaine
Eric P Rudd
David M Kranz
Carl E Haugen
Adam Reinhardt
Original Assignee
Cyberoptics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cyberoptics Corp filed Critical Cyberoptics Corp
Publication of WO2002046713A2 publication Critical patent/WO2002046713A2/en
Publication of WO2002046713A3 publication Critical patent/WO2002046713A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing

Abstract

An automated system (210) includes improved height sensing. In one aspect, a oon-head camera (209) performs the dual functions of fiducial imaging and height sensing using an auxiliary off-axis light source (412) and triangulation. In another aspect, an on-head height sensor (304) is positioned to measure height at a location that is not beneath any nozzles. The sensor (304) provides height information at a plurality of locations over the board (203), and a height map of the board is created. In yet another aspect of the invention, the above features are combined to provide an on-head camera (209) that images fiducials and measures height at a plurality of locations such that a height map is created.
PCT/US2001/048318 2000-12-08 2001-12-07 Automated system with improved height sensing WO2002046713A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US25424700P 2000-12-08 2000-12-08
US60/254,247 2000-12-08
US27528101P 2001-03-13 2001-03-13
US60/275,281 2001-03-13

Publications (2)

Publication Number Publication Date
WO2002046713A2 WO2002046713A2 (en) 2002-06-13
WO2002046713A3 true WO2002046713A3 (en) 2003-01-09

Family

ID=26943927

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/048318 WO2002046713A2 (en) 2000-12-08 2001-12-07 Automated system with improved height sensing

Country Status (2)

Country Link
US (1) US6678062B2 (en)
WO (1) WO2002046713A2 (en)

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Also Published As

Publication number Publication date
US20020078580A1 (en) 2002-06-27
US6678062B2 (en) 2004-01-13
WO2002046713A2 (en) 2002-06-13

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