WO2002051743A3 - Thin silicon micromachined structures - Google Patents

Thin silicon micromachined structures Download PDF

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Publication number
WO2002051743A3
WO2002051743A3 PCT/US2001/050464 US0150464W WO02051743A3 WO 2002051743 A3 WO2002051743 A3 WO 2002051743A3 US 0150464 W US0150464 W US 0150464W WO 02051743 A3 WO02051743 A3 WO 02051743A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
recesses
silicon wafer
glass
silicon
Prior art date
Application number
PCT/US2001/050464
Other languages
French (fr)
Other versions
WO2002051743A2 (en
Inventor
Cleopatra Cabuz
Jeffrey Alan Ridley
Original Assignee
Honeywell Int Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Int Inc filed Critical Honeywell Int Inc
Priority to AU2002232866A priority Critical patent/AU2002232866A1/en
Publication of WO2002051743A2 publication Critical patent/WO2002051743A2/en
Publication of WO2002051743A3 publication Critical patent/WO2002051743A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/0015—Cantilevers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/019—Bonding or gluing multiple substrate layers

Abstract

Methods for making thin silicon layers (20) suspended over recesses (30) in glass wafers or substrates (22) are disclosed. One embodiment of the present invention includes providing a thin silicon wafer (20), and a glass wafer or substrate (22). Recesses (30) are formed in one surface (24) of the glass wafer (22), and electrodes (38) are formed in the recesses (30). The silicon wafer (20) is then bonded to the glass wafer (22) over the recesses (30). The silicon wafer (20) is then etched to impart the desired suspended or silicon wafer structure. In another embodiment of the present invention, the silicon wafer (120) has a patterned metal layer (129). The silicon wafer (120) is bonded to the glass wafer (22), with the patterned metal layer (129) positioned adjacent the recesses (30) in the glass wafer (22). The silicon wafer (120) positioned adjacent the recesses (30) in the glass wafer (22). The silicon wafer (120) is selectively etched down to the metal layer (129). The metalized layer (129) may serve to seal gasses within the recessed cavities (30) of the glass wafer (22) during the silicon etching process. The metal layer (129) can then be subsequently removed.
PCT/US2001/050464 2000-12-27 2001-12-20 Thin silicon micromachined structures WO2002051743A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002232866A AU2002232866A1 (en) 2000-12-27 2001-12-20 Thin silicon micromachined structures

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/749,171 2000-12-27
US09/749,171 US6808956B2 (en) 2000-12-27 2000-12-27 Thin micromachined structures

Publications (2)

Publication Number Publication Date
WO2002051743A2 WO2002051743A2 (en) 2002-07-04
WO2002051743A3 true WO2002051743A3 (en) 2003-05-22

Family

ID=25012580

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/050464 WO2002051743A2 (en) 2000-12-27 2001-12-20 Thin silicon micromachined structures

Country Status (4)

Country Link
US (1) US6808956B2 (en)
AU (1) AU2002232866A1 (en)
TW (1) TW524770B (en)
WO (1) WO2002051743A2 (en)

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KR100501723B1 (en) * 2003-12-17 2005-07-18 삼성전자주식회사 METHOD FOR FABRICATING GYROSCOPE USING Si-METAL-Si WAFER AND GYROSCOPE FABRICATED BY THE METHOD
US7109066B2 (en) * 2004-09-22 2006-09-19 Miradia Inc. Method and device for forming spacer structures for packaging optical reflection devices
WO2006047326A1 (en) * 2004-10-21 2006-05-04 Fujifilm Dimatix, Inc. Sacrificial substrate for etching
US7494598B2 (en) * 2005-11-22 2009-02-24 Honeywell International Inc. Miniature optically transparent window
US20080032501A1 (en) * 2006-07-21 2008-02-07 Honeywell International Inc. Silicon on metal for mems devices
US8187902B2 (en) 2008-07-09 2012-05-29 The Charles Stark Draper Laboratory, Inc. High performance sensors and methods for forming the same
WO2011072600A1 (en) * 2009-12-18 2011-06-23 东南大学 Manufacturing method of wafer level glass microcavity by using foaming molding
WO2012134394A1 (en) * 2011-03-30 2012-10-04 Gautham Viswanadam Micro-device on glass
US8816689B2 (en) * 2011-05-17 2014-08-26 Saudi Arabian Oil Company Apparatus and method for multi-component wellbore electric field Measurements using capacitive sensors
CN102417155B (en) * 2011-08-17 2014-03-26 瑞声声学科技(深圳)有限公司 Production method of tri-axial accelerometer

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US6008138A (en) * 1996-03-19 1999-12-28 Robert Bosch Gmbh Process for making micromechanical structures
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Also Published As

Publication number Publication date
US20020081765A1 (en) 2002-06-27
AU2002232866A1 (en) 2002-07-08
WO2002051743A2 (en) 2002-07-04
US6808956B2 (en) 2004-10-26
TW524770B (en) 2003-03-21

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