WO2002052645A3 - Enhanced die-up ball grid array packages and method for making the same - Google Patents

Enhanced die-up ball grid array packages and method for making the same Download PDF

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Publication number
WO2002052645A3
WO2002052645A3 PCT/US2001/044952 US0144952W WO02052645A3 WO 2002052645 A3 WO2002052645 A3 WO 2002052645A3 US 0144952 W US0144952 W US 0144952W WO 02052645 A3 WO02052645 A3 WO 02052645A3
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WO
WIPO (PCT)
Prior art keywords
stiffener
die
substrate
another aspect
grid array
Prior art date
Application number
PCT/US2001/044952
Other languages
French (fr)
Other versions
WO2002052645A2 (en
Inventor
Sam Ziqun Zhao
Reza-Ur Rahman Khan
Brent Bacher
Original Assignee
Broadcom Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/742,366 external-priority patent/US20020079572A1/en
Application filed by Broadcom Corp filed Critical Broadcom Corp
Priority to EP01272468A priority Critical patent/EP1356516A2/en
Publication of WO2002052645A2 publication Critical patent/WO2002052645A2/en
Publication of WO2002052645A3 publication Critical patent/WO2002052645A3/en

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Abstract

An electrically and thermally enhanced die-up tape substrate ball grid array (BGA) package and die-up plastic substrate BGA package are described. A substrate that has a first surface and a second surface is provided. The stiffener has a first surface and a second surface. The second stiffener surface is attached to the first substrate surface. An IC die has a first surface and a second surface. The fist IC die surface is mounted to the first stiffener surface. A plurality of solder balls is attached to the second substrate surface. In one aspect, a heat spreader is mounted to the second IC die surface. In another aspect, the stiffener is coupled to ground to act as a ground plane. In another aspect, the substrate has a window opening that exposes portion of the second stiffener surface. The exposed portion of the second stiffener surface is configured to be coupled to a printed circuit board (PCB). In another aspect, a metal ring is attached to the first stiffener surface. In another aspect, wire bond openings in the stiffener are bridged by one or more studs.
PCT/US2001/044952 2000-12-22 2001-11-30 Enhanced die-up ball grid array packages and method for making the same WO2002052645A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP01272468A EP1356516A2 (en) 2000-12-22 2001-11-30 Enhanced die-up ball grid array packages and method for making the same

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US09/742,366 2000-12-22
US09/742,366 US20020079572A1 (en) 2000-12-22 2000-12-22 Enhanced die-up ball grid array and method for making the same
US09/984,259 2001-10-29
US09/984,259 US7132744B2 (en) 2000-12-22 2001-10-29 Enhanced die-up ball grid array packages and method for making the same

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WO2002052645A2 WO2002052645A2 (en) 2002-07-04
WO2002052645A3 true WO2002052645A3 (en) 2003-05-30

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US (1) US7132744B2 (en)
EP (1) EP1356516A2 (en)
TW (1) TW517359B (en)
WO (1) WO2002052645A2 (en)

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