WO2002055246A3 - Coated saw blade - Google Patents

Coated saw blade Download PDF

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Publication number
WO2002055246A3
WO2002055246A3 PCT/US2001/051167 US0151167W WO02055246A3 WO 2002055246 A3 WO2002055246 A3 WO 2002055246A3 US 0151167 W US0151167 W US 0151167W WO 02055246 A3 WO02055246 A3 WO 02055246A3
Authority
WO
WIPO (PCT)
Prior art keywords
saw blade
diamond
saw blades
coated saw
sides
Prior art date
Application number
PCT/US2001/051167
Other languages
French (fr)
Other versions
WO2002055246A2 (en
Inventor
Chris Ropoulos
Gary Di Robinson
Original Assignee
Gemsaw Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemsaw Inc filed Critical Gemsaw Inc
Priority to AU2002241785A priority Critical patent/AU2002241785A1/en
Publication of WO2002055246A2 publication Critical patent/WO2002055246A2/en
Publication of WO2002055246A3 publication Critical patent/WO2002055246A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/02—Circular saw blades
    • B23D61/025—Details of saw blade body
    • B23D61/026—Composite body, e.g. laminated, body of diverse material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D65/00—Making tools for sawing machines or sawing devices for use in cutting any kind of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/26—Deposition of carbon only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • C23C30/005—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process on hard metal substrates

Abstract

A method for coating diamond impregnated saw blades 164 with a layer of diamond or diamond-like carbon to improve performance of the saw blades. The coating may be formed only on the sides of the blade, or on both the cutting edge and sides of the saw blades. The layer 162 may be continuous or discontinuous forming a variety of possible useful patterns including grooves 164 between ridges 166.
PCT/US2001/051167 2000-11-10 2001-11-10 Coated saw blade WO2002055246A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002241785A AU2002241785A1 (en) 2000-11-10 2001-11-10 Coated saw blade

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US71047700A 2000-11-10 2000-11-10
US09/710,477 2000-11-10

Publications (2)

Publication Number Publication Date
WO2002055246A2 WO2002055246A2 (en) 2002-07-18
WO2002055246A3 true WO2002055246A3 (en) 2003-07-24

Family

ID=24854193

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/051167 WO2002055246A2 (en) 2000-11-10 2001-11-10 Coated saw blade

Country Status (2)

Country Link
AU (1) AU2002241785A1 (en)
WO (1) WO2002055246A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT515691B1 (en) 2014-03-06 2015-11-15 Reger Wilfried sawblade
CN108950479A (en) * 2018-08-16 2018-12-07 佛山市南海唐立新五金工具有限公司 Diamond-like coating saw blade preparation method and diamond-like coating saw blade

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5261385A (en) * 1992-03-27 1993-11-16 Dicing Technology Inc. Abrasive cutting blade assembly with multiple cutting edge exposures
US5885149A (en) * 1994-11-16 1999-03-23 Gillet; Thierry Homogenous abrasive tool
US5934973A (en) * 1995-10-20 1999-08-10 Boucher; John N. Semiconductor wafer dicing saw
US6062969A (en) * 1997-08-11 2000-05-16 Kopp Werkzeugmaschinen Gmbh Grinding wheel with spiral grooved face
US6074286A (en) * 1998-01-05 2000-06-13 Micron Technology, Inc. Wafer processing apparatus and method of processing a wafer utilizing a processing slurry

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5261385A (en) * 1992-03-27 1993-11-16 Dicing Technology Inc. Abrasive cutting blade assembly with multiple cutting edge exposures
US5885149A (en) * 1994-11-16 1999-03-23 Gillet; Thierry Homogenous abrasive tool
US5934973A (en) * 1995-10-20 1999-08-10 Boucher; John N. Semiconductor wafer dicing saw
US6062969A (en) * 1997-08-11 2000-05-16 Kopp Werkzeugmaschinen Gmbh Grinding wheel with spiral grooved face
US6074286A (en) * 1998-01-05 2000-06-13 Micron Technology, Inc. Wafer processing apparatus and method of processing a wafer utilizing a processing slurry

Also Published As

Publication number Publication date
AU2002241785A1 (en) 2002-07-24
WO2002055246A2 (en) 2002-07-18

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