WO2002057514A2 - Method and apparatus for electrodeposition or etching of uniform film with minimal edge exclusion on substrate - Google Patents
Method and apparatus for electrodeposition or etching of uniform film with minimal edge exclusion on substrate Download PDFInfo
- Publication number
- WO2002057514A2 WO2002057514A2 PCT/US2001/051158 US0151158W WO02057514A2 WO 2002057514 A2 WO2002057514 A2 WO 2002057514A2 US 0151158 W US0151158 W US 0151158W WO 02057514 A2 WO02057514 A2 WO 02057514A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wafer
- ofthe
- shaping plate
- region
- electrolyte
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01994521A EP1332243A2 (en) | 2000-11-03 | 2001-11-02 | Method and apparatus for electrodeposition or etching of uniform films with minimal edge exclusion on substrate |
AU2002246910A AU2002246910A1 (en) | 2000-11-03 | 2001-11-02 | Method and apparatus for electrodeposition or etching of uniform film with minimal edge exclusion on substrate |
JP2002558562A JP4034655B2 (en) | 2000-11-03 | 2001-11-02 | Method and apparatus for electrodepositing a uniform thin film onto a substrate with minimal edge exclusion |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US24521100P | 2000-11-03 | 2000-11-03 | |
US60/245,211 | 2000-11-03 | ||
US09/760,757 US6610190B2 (en) | 2000-11-03 | 2001-01-17 | Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate |
US09/760,757 | 2001-01-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002057514A2 true WO2002057514A2 (en) | 2002-07-25 |
WO2002057514A3 WO2002057514A3 (en) | 2003-02-06 |
Family
ID=26937071
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2001/051158 WO2002057514A2 (en) | 2000-11-03 | 2001-11-02 | Method and apparatus for electrodeposition or etching of uniform film with minimal edge exclusion on substrate |
Country Status (8)
Country | Link |
---|---|
US (3) | US6610190B2 (en) |
EP (1) | EP1332243A2 (en) |
JP (1) | JP4034655B2 (en) |
KR (1) | KR100801270B1 (en) |
CN (1) | CN1253608C (en) |
AU (1) | AU2002246910A1 (en) |
TW (1) | TW511167B (en) |
WO (1) | WO2002057514A2 (en) |
Cited By (4)
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WO2003041126A2 (en) * | 2001-11-02 | 2003-05-15 | Nutool, Inc. | Electrochemical mechanical processing with advancible sweeper |
WO2005045906A1 (en) * | 2003-10-29 | 2005-05-19 | Asm Nutool, Inc. | System and method for electroless surface conditioning |
US7097755B2 (en) | 1998-12-01 | 2006-08-29 | Asm Nutool, Inc. | Electrochemical mechanical processing with advancible sweeper |
TWI410531B (en) * | 2010-05-07 | 2013-10-01 | Taiwan Semiconductor Mfg | Vertical plating equipment and plating method thereof |
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US7686935B2 (en) * | 1998-10-26 | 2010-03-30 | Novellus Systems, Inc. | Pad-assisted electropolishing |
US6902659B2 (en) * | 1998-12-01 | 2005-06-07 | Asm Nutool, Inc. | Method and apparatus for electro-chemical mechanical deposition |
US7204917B2 (en) | 1998-12-01 | 2007-04-17 | Novellus Systems, Inc. | Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same |
US6413388B1 (en) * | 2000-02-23 | 2002-07-02 | Nutool Inc. | Pad designs and structures for a versatile materials processing apparatus |
US6497800B1 (en) * | 2000-03-17 | 2002-12-24 | Nutool Inc. | Device providing electrical contact to the surface of a semiconductor workpiece during metal plating |
US6610190B2 (en) * | 2000-11-03 | 2003-08-26 | Nutool, Inc. | Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate |
US6251235B1 (en) | 1999-03-30 | 2001-06-26 | Nutool, Inc. | Apparatus for forming an electrical contact with a semiconductor substrate |
US6534116B2 (en) * | 2000-08-10 | 2003-03-18 | Nutool, Inc. | Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence |
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US6852208B2 (en) | 2000-03-17 | 2005-02-08 | Nutool, Inc. | Method and apparatus for full surface electrotreating of a wafer |
US7754061B2 (en) * | 2000-08-10 | 2010-07-13 | Novellus Systems, Inc. | Method for controlling conductor deposition on predetermined portions of a wafer |
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US6815354B2 (en) * | 2001-10-27 | 2004-11-09 | Nutool, Inc. | Method and structure for thru-mask contact electrodeposition |
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US6833063B2 (en) * | 2001-12-21 | 2004-12-21 | Nutool, Inc. | Electrochemical edge and bevel cleaning process and system |
US7029567B2 (en) * | 2001-12-21 | 2006-04-18 | Asm Nutool, Inc. | Electrochemical edge and bevel cleaning process and system |
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US7128823B2 (en) | 2002-07-24 | 2006-10-31 | Applied Materials, Inc. | Anolyte for copper plating |
US7090750B2 (en) * | 2002-08-26 | 2006-08-15 | Micron Technology, Inc. | Plating |
US20040226654A1 (en) * | 2002-12-17 | 2004-11-18 | Akihisa Hongo | Substrate processing apparatus and substrate processing method |
US7201828B2 (en) * | 2003-02-25 | 2007-04-10 | Novellus Systems, Inc. | Planar plating apparatus |
US20050173260A1 (en) * | 2003-03-18 | 2005-08-11 | Basol Bulent M. | System for electrochemical mechanical polishing |
DE602004018631D1 (en) * | 2003-04-24 | 2009-02-05 | Afshin Ahmadian | EN |
US7335288B2 (en) * | 2003-09-18 | 2008-02-26 | Novellus Systems, Inc. | Methods for depositing copper on a noble metal layer of a work piece |
US7064057B2 (en) * | 2003-11-21 | 2006-06-20 | Asm Nutool, Inc. | Method and apparatus for localized material removal by electrochemical polishing |
US7648622B2 (en) * | 2004-02-27 | 2010-01-19 | Novellus Systems, Inc. | System and method for electrochemical mechanical polishing |
US20060183321A1 (en) * | 2004-09-27 | 2006-08-17 | Basol Bulent M | Method for reduction of gap fill defects |
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2001
- 2001-01-17 US US09/760,757 patent/US6610190B2/en not_active Expired - Lifetime
- 2001-05-28 TW TW090112769A patent/TW511167B/en not_active IP Right Cessation
- 2001-11-02 JP JP2002558562A patent/JP4034655B2/en not_active Expired - Fee Related
- 2001-11-02 WO PCT/US2001/051158 patent/WO2002057514A2/en not_active Application Discontinuation
- 2001-11-02 AU AU2002246910A patent/AU2002246910A1/en not_active Abandoned
- 2001-11-02 KR KR1020027008660A patent/KR100801270B1/en not_active IP Right Cessation
- 2001-11-02 EP EP01994521A patent/EP1332243A2/en not_active Withdrawn
- 2001-11-02 CN CNB018044514A patent/CN1253608C/en not_active Expired - Fee Related
-
2003
- 2003-06-11 US US10/460,032 patent/US6942780B2/en not_active Expired - Lifetime
-
2005
- 2005-09-13 US US11/225,913 patent/US20060006060A1/en not_active Abandoned
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US6001235A (en) * | 1997-06-23 | 1999-12-14 | International Business Machines Corporation | Rotary plater with radially distributed plating solution |
US5976331A (en) * | 1998-04-30 | 1999-11-02 | Lucent Technologies Inc. | Electrodeposition apparatus for coating wafers |
US6132587A (en) * | 1998-10-19 | 2000-10-17 | Jorne; Jacob | Uniform electroplating of wafers |
EP1037263A2 (en) * | 1999-03-05 | 2000-09-20 | Applied Materials, Inc. | Apparatus for electro-chemical deposition of copper with the capability of in-situ thermal annealing |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7097755B2 (en) | 1998-12-01 | 2006-08-29 | Asm Nutool, Inc. | Electrochemical mechanical processing with advancible sweeper |
WO2003041126A2 (en) * | 2001-11-02 | 2003-05-15 | Nutool, Inc. | Electrochemical mechanical processing with advancible sweeper |
WO2003041126A3 (en) * | 2001-11-02 | 2003-11-06 | Nutool Inc | Electrochemical mechanical processing with advancible sweeper |
WO2005045906A1 (en) * | 2003-10-29 | 2005-05-19 | Asm Nutool, Inc. | System and method for electroless surface conditioning |
TWI410531B (en) * | 2010-05-07 | 2013-10-01 | Taiwan Semiconductor Mfg | Vertical plating equipment and plating method thereof |
Also Published As
Publication number | Publication date |
---|---|
AU2002246910A1 (en) | 2002-07-30 |
WO2002057514A3 (en) | 2003-02-06 |
US20020053516A1 (en) | 2002-05-09 |
US6942780B2 (en) | 2005-09-13 |
TW511167B (en) | 2002-11-21 |
CN1253608C (en) | 2006-04-26 |
US20030209429A1 (en) | 2003-11-13 |
JP4034655B2 (en) | 2008-01-16 |
US6610190B2 (en) | 2003-08-26 |
EP1332243A2 (en) | 2003-08-06 |
CN1433487A (en) | 2003-07-30 |
US20060006060A1 (en) | 2006-01-12 |
JP2005501963A (en) | 2005-01-20 |
KR20020095179A (en) | 2002-12-20 |
KR100801270B1 (en) | 2008-02-04 |
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