WO2002059908A3 - Polymeric materials with improved dielectric breakdown strength - Google Patents
Polymeric materials with improved dielectric breakdown strength Download PDFInfo
- Publication number
- WO2002059908A3 WO2002059908A3 PCT/US2001/048982 US0148982W WO02059908A3 WO 2002059908 A3 WO2002059908 A3 WO 2002059908A3 US 0148982 W US0148982 W US 0148982W WO 02059908 A3 WO02059908 A3 WO 02059908A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- polymeric materials
- dielectric breakdown
- breakdown strength
- improved dielectric
- novel
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA002432080A CA2432080A1 (en) | 2000-12-21 | 2001-12-18 | Polymeric materials with improved dielectric breakdown strength |
EP01994291A EP1346375A2 (en) | 2000-12-21 | 2001-12-18 | Polymeric materials with improved dielectric breakdown strength |
AU2002246701A AU2002246701A1 (en) | 2000-12-21 | 2001-12-18 | Polymeric materials with improved dielectric breakdown strength |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/745,619 US6879861B2 (en) | 2000-12-21 | 2000-12-21 | Polymeric materials with improved dielectric breakdown strength |
US09/745,619 | 2000-12-21 |
Publications (3)
Publication Number | Publication Date |
---|---|
WO2002059908A2 WO2002059908A2 (en) | 2002-08-01 |
WO2002059908A3 true WO2002059908A3 (en) | 2003-06-12 |
WO2002059908B1 WO2002059908B1 (en) | 2003-07-10 |
Family
ID=24997501
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2001/048982 WO2002059908A2 (en) | 2000-12-21 | 2001-12-18 | Polymeric materials with improved dielectric breakdown strength |
Country Status (5)
Country | Link |
---|---|
US (1) | US6879861B2 (en) |
EP (1) | EP1346375A2 (en) |
AU (1) | AU2002246701A1 (en) |
CA (1) | CA2432080A1 (en) |
WO (1) | WO2002059908A2 (en) |
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US20150224310A1 (en) | 2006-10-09 | 2015-08-13 | Endostim, Inc. | Device and Implantation System for Electrical Stimulation of Biological Systems |
US11577077B2 (en) | 2006-10-09 | 2023-02-14 | Endostim, Inc. | Systems and methods for electrical stimulation of biological systems |
US9724510B2 (en) | 2006-10-09 | 2017-08-08 | Endostim, Inc. | System and methods for electrical stimulation of biological systems |
US10537730B2 (en) * | 2007-02-14 | 2020-01-21 | Medtronic, Inc. | Continuous conductive materials for electromagnetic shielding |
US9044593B2 (en) * | 2007-02-14 | 2015-06-02 | Medtronic, Inc. | Discontinuous conductive filler polymer-matrix composites for electromagnetic shielding |
US8483842B2 (en) | 2007-04-25 | 2013-07-09 | Medtronic, Inc. | Lead or lead extension having a conductive body and conductive body contact |
US8121705B2 (en) * | 2007-06-27 | 2012-02-21 | Medtronic, Inc. | MRI-safe defibrillator electrodes |
US8000918B2 (en) * | 2007-10-23 | 2011-08-16 | Edwards Lifesciences Corporation | Monitoring and compensating for temperature-related error in an electrochemical sensor |
US9037263B2 (en) | 2008-03-12 | 2015-05-19 | Medtronic, Inc. | System and method for implantable medical device lead shielding |
US9193313B2 (en) | 2012-03-22 | 2015-11-24 | Nuax, Inc. | Methods and apparatuses involving flexible cable/guidewire/interconnects |
US9242100B2 (en) | 2012-08-07 | 2016-01-26 | Nuax, Inc. | Optical fiber-fine wire lead for electrostimulation and sensing |
US8692117B2 (en) | 2008-05-28 | 2014-04-08 | Cardia Access, Inc. | Durable fine wire electrical conductor suitable for extreme environment applications |
US9513443B2 (en) | 2008-05-28 | 2016-12-06 | John Lawrence Erb | Optical fiber-fine wire conductor and connectors |
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US8219209B2 (en) | 2008-08-15 | 2012-07-10 | Cardiac Pacemakers, Inc. | Implantable medical lead having reduced dimension tubing transition |
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US20100160756A1 (en) * | 2008-12-24 | 2010-06-24 | Edwards Lifesciences Corporation | Membrane Layer for Electrochemical Biosensor and Method of Accommodating Electromagnetic and Radiofrequency Fields |
US20100215968A1 (en) | 2009-02-26 | 2010-08-26 | Fields Lenwood L | Electrically isolating polymer composition |
US9978479B2 (en) | 2009-02-26 | 2018-05-22 | Corning Incorporated | Electrically isolating polymer composition |
US9186499B2 (en) | 2009-04-30 | 2015-11-17 | Medtronic, Inc. | Grounding of a shield within an implantable medical lead |
US20110160820A1 (en) * | 2009-12-30 | 2011-06-30 | Jackson Timothy R | Variable stiffness multi-lumen lead body for an impantable lead |
US11717681B2 (en) | 2010-03-05 | 2023-08-08 | Endostim, Inc. | Systems and methods for treating gastroesophageal reflux disease |
US8447404B2 (en) | 2010-03-05 | 2013-05-21 | Endostim, Inc. | Device and implantation system for electrical stimulation of biological systems |
CA3034833C (en) | 2010-09-30 | 2020-10-27 | Union Carbide Chemicals & Plastics Technology Llc | Polymeric compositions with voltage stabilizer additive |
AU2012242533B2 (en) | 2011-04-14 | 2016-10-20 | Endostim, Inc. | Systems and methods for treating gastroesophageal reflux disease |
US9925367B2 (en) | 2011-09-02 | 2018-03-27 | Endostim, Inc. | Laparoscopic lead implantation method |
WO2013158189A1 (en) | 2012-04-19 | 2013-10-24 | Medtronic, Inc. | Paired medical lead bodies with braided conductive shields having different physical parameter values |
US9840595B2 (en) | 2012-06-25 | 2017-12-12 | Empire Technology Development Llc | Silicone rubber |
US9623238B2 (en) | 2012-08-23 | 2017-04-18 | Endostim, Inc. | Device and implantation system for electrical stimulation of biological systems |
US9498619B2 (en) | 2013-02-26 | 2016-11-22 | Endostim, Inc. | Implantable electrical stimulation leads |
CN105848708A (en) | 2013-09-03 | 2016-08-10 | 恩多斯蒂姆股份有限公司 | Methods and systems of electrode polarity switching in electrical stimulation therapy |
US9993638B2 (en) | 2013-12-14 | 2018-06-12 | Medtronic, Inc. | Devices, systems and methods to reduce coupling of a shield and a conductor within an implantable medical lead |
WO2016014427A1 (en) | 2014-07-23 | 2016-01-28 | Medtronic, Inc. | Methods of shielding implantable medical leads and implantable medical lead extensions |
US10155111B2 (en) | 2014-07-24 | 2018-12-18 | Medtronic, Inc. | Methods of shielding implantable medical leads and implantable medical lead extensions |
US9682234B2 (en) | 2014-11-17 | 2017-06-20 | Endostim, Inc. | Implantable electro-medical device programmable for improved operational life |
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CN115692018A (en) | 2017-01-03 | 2023-02-03 | 日立能源瑞士股份公司 | Insulation system and capacitor |
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JPH01236516A (en) * | 1988-03-16 | 1989-09-21 | Hitachi Cable Ltd | Wire/cable |
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-
2000
- 2000-12-21 US US09/745,619 patent/US6879861B2/en not_active Expired - Lifetime
-
2001
- 2001-12-18 AU AU2002246701A patent/AU2002246701A1/en not_active Abandoned
- 2001-12-18 EP EP01994291A patent/EP1346375A2/en not_active Withdrawn
- 2001-12-18 WO PCT/US2001/048982 patent/WO2002059908A2/en not_active Application Discontinuation
- 2001-12-18 CA CA002432080A patent/CA2432080A1/en not_active Abandoned
Patent Citations (3)
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US4543381A (en) * | 1982-06-30 | 1985-09-24 | National Distillers And Chemical Corporation | Tree retardant additive composition for polymeric insulation |
JPS60147452A (en) * | 1984-01-11 | 1985-08-03 | Hitachi Cable Ltd | Resin composition |
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Non-Patent Citations (2)
Title |
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PATENT ABSTRACTS OF JAPAN vol. 13, no. 568 (E - 861) 15 December 1989 (1989-12-15) * |
PATENT ABSTRACTS OF JAPAN vol. 9, no. 309 (C - 318) 5 December 1985 (1985-12-05) * |
Also Published As
Publication number | Publication date |
---|---|
WO2002059908A2 (en) | 2002-08-01 |
CA2432080A1 (en) | 2002-08-01 |
AU2002246701A1 (en) | 2002-08-06 |
WO2002059908B1 (en) | 2003-07-10 |
EP1346375A2 (en) | 2003-09-24 |
US6879861B2 (en) | 2005-04-12 |
US20020082673A1 (en) | 2002-06-27 |
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