WO2002063072A1 - Method and apparatus for controlling thickness uniformity of electroplated layer - Google Patents
Method and apparatus for controlling thickness uniformity of electroplated layer Download PDFInfo
- Publication number
- WO2002063072A1 WO2002063072A1 PCT/US2001/047445 US0147445W WO02063072A1 WO 2002063072 A1 WO2002063072 A1 WO 2002063072A1 US 0147445 W US0147445 W US 0147445W WO 02063072 A1 WO02063072 A1 WO 02063072A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- conductive element
- conductive
- electrically isolated
- deposition
- mask
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S204/00—Chemistry: electrical and wave energy
- Y10S204/07—Current distribution within the bath
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2003-7008507A KR20040005866A (en) | 2000-12-21 | 2001-12-11 | Method and apparatus for controlling thickness uniformity of electroplated layer |
EP01998036A EP1360348A4 (en) | 2000-12-21 | 2001-12-11 | Method and apparatus for controlling thickness uniformity of electroplated layer |
JP2002562802A JP2004518817A (en) | 2000-12-21 | 2001-12-11 | Method and apparatus for controlling thickness uniformity of an electroplated layer |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US25692400P | 2000-12-21 | 2000-12-21 | |
US60/256,924 | 2000-12-21 | ||
US09/855,059 | 2001-05-15 | ||
US09/855,059 US6802946B2 (en) | 2000-12-21 | 2001-05-15 | Apparatus for controlling thickness uniformity of electroplated and electroetched layers |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2002063072A1 true WO2002063072A1 (en) | 2002-08-15 |
Family
ID=26945682
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2001/047445 WO2002063072A1 (en) | 2000-12-21 | 2001-12-11 | Method and apparatus for controlling thickness uniformity of electroplated layer |
Country Status (7)
Country | Link |
---|---|
US (2) | US6802946B2 (en) |
EP (1) | EP1360348A4 (en) |
JP (1) | JP2004518817A (en) |
KR (1) | KR20040005866A (en) |
CN (1) | CN1551931A (en) |
TW (1) | TW539778B (en) |
WO (1) | WO2002063072A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100439571C (en) * | 2002-07-18 | 2008-12-03 | 株式会社荏原制作所 | Plating device |
Families Citing this family (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69929967T2 (en) | 1998-04-21 | 2007-05-24 | Applied Materials, Inc., Santa Clara | ELECTROPLATING SYSTEM AND METHOD FOR ELECTROPLATING ON SUBSTRATES |
US20030168344A1 (en) * | 2002-03-08 | 2003-09-11 | Applied Materials, Inc. | Selective metal deposition for electrochemical plating |
US7128823B2 (en) | 2002-07-24 | 2006-10-31 | Applied Materials, Inc. | Anolyte for copper plating |
US20040055873A1 (en) * | 2002-09-24 | 2004-03-25 | Digital Matrix Corporation | Apparatus and method for improved electroforming |
US6890413B2 (en) * | 2002-12-11 | 2005-05-10 | International Business Machines Corporation | Method and apparatus for controlling local current to achieve uniform plating thickness |
US6966976B1 (en) | 2003-01-07 | 2005-11-22 | Hutchinson Technology Incorporated | Electroplating panel with plating thickness-compensation structures |
US7201828B2 (en) * | 2003-02-25 | 2007-04-10 | Novellus Systems, Inc. | Planar plating apparatus |
KR20040094560A (en) * | 2003-05-03 | 2004-11-10 | 삼성전자주식회사 | Apparatus and Method For Electropolishing Metal On Semiconductor Devices |
US7803257B2 (en) * | 2004-10-22 | 2010-09-28 | Taiwan Semiconductor Manufacturing Company | Current-leveling electroplating/electropolishing electrode |
TW200641189A (en) * | 2005-02-25 | 2006-12-01 | Applied Materials Inc | Counter electrode encased in cation exchange membrane tube for electroplating cell |
KR100755661B1 (en) * | 2005-03-07 | 2007-09-05 | 삼성전자주식회사 | Electroplating apparatus and electroplating method using the same |
CN101368284B (en) * | 2007-08-15 | 2010-10-06 | 富葵精密组件(深圳)有限公司 | Electroplating apparatus |
US8197660B2 (en) | 2007-09-10 | 2012-06-12 | Infineon Technologies Ag | Electro chemical deposition systems and methods of manufacturing using the same |
US8309259B2 (en) | 2008-05-19 | 2012-11-13 | Arizona Board Of Regents For And On Behalf Of Arizona State University | Electrochemical cell, and particularly a cell with electrodeposited fuel |
CN102549834B (en) | 2009-10-08 | 2015-03-11 | 流体公司 | Rechargeable metal-air cell with flow management system |
US8343327B2 (en) | 2010-05-25 | 2013-01-01 | Reel Solar, Inc. | Apparatus and methods for fast chemical electrodeposition for fabrication of solar cells |
US9960312B2 (en) * | 2010-05-25 | 2018-05-01 | Kurt H. Weiner | Apparatus and methods for fast chemical electrodeposition for fabrication of solar cells |
WO2011151530A1 (en) | 2010-05-31 | 2011-12-08 | Arcelormittal Investigacion Y Desarrollo, S.L. | Method and device for measuring the thickness of a coating layer on a running strip |
WO2011163553A1 (en) | 2010-06-24 | 2011-12-29 | Fluidic, Inc. | Electrochemical cell with stepped scaffold fuel anode |
US9523155B2 (en) | 2012-12-12 | 2016-12-20 | Novellus Systems, Inc. | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating |
US8795480B2 (en) * | 2010-07-02 | 2014-08-05 | Novellus Systems, Inc. | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating |
US10094034B2 (en) | 2015-08-28 | 2018-10-09 | Lam Research Corporation | Edge flow element for electroplating apparatus |
US10233556B2 (en) | 2010-07-02 | 2019-03-19 | Lam Research Corporation | Dynamic modulation of cross flow manifold during electroplating |
US9624592B2 (en) | 2010-07-02 | 2017-04-18 | Novellus Systems, Inc. | Cross flow manifold for electroplating apparatus |
CN202550031U (en) | 2010-09-16 | 2012-11-21 | 流体公司 | Electrochemical battery system with gradual oxygen evolution electrode/fuel electrode |
ES2549592T3 (en) | 2010-10-20 | 2015-10-29 | Fluidic, Inc. | Battery reset processes for fuel electrode in frame |
JP5908251B2 (en) | 2010-11-17 | 2016-04-26 | フルイディック,インク.Fluidic,Inc. | Multi-mode charging of hierarchical anode |
EP2476784A1 (en) * | 2011-01-18 | 2012-07-18 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Method for manufacturing an electronic device by electrodeposition from an ionic liquid |
TWI550139B (en) | 2011-04-04 | 2016-09-21 | 諾菲勒斯系統公司 | Electroplating apparatus for tailored uniformity profile |
JP5731917B2 (en) * | 2011-06-30 | 2015-06-10 | 上村工業株式会社 | Surface treatment equipment and plating tank |
CN102703961A (en) * | 2012-06-08 | 2012-10-03 | 镇江华印电路板有限公司 | Method for improving electroplating uniformity |
US9909228B2 (en) * | 2012-11-27 | 2018-03-06 | Lam Research Corporation | Method and apparatus for dynamic current distribution control during electroplating |
JP6198456B2 (en) * | 2013-05-20 | 2017-09-20 | 東京エレクトロン株式会社 | Substrate processing method and template |
EP3216050B1 (en) | 2014-11-05 | 2021-09-08 | Corning Incorporated | Bottom-up electrolytic via plating method |
CN104313657A (en) * | 2014-11-10 | 2015-01-28 | 临安振有电子有限公司 | Electro-deposition device of through hole of HDI printed circuit board |
JP6107799B2 (en) * | 2014-12-03 | 2017-04-05 | トヨタ自動車株式会社 | Surface treatment method and surface treatment apparatus |
US10364505B2 (en) | 2016-05-24 | 2019-07-30 | Lam Research Corporation | Dynamic modulation of cross flow manifold during elecroplating |
CA3031513A1 (en) | 2016-07-22 | 2018-01-25 | Nantenergy, Inc. | Moisture and carbon dioxide management system in electrochemical cells |
US10692735B2 (en) | 2017-07-28 | 2020-06-23 | Lam Research Corporation | Electro-oxidative metal removal in through mask interconnect fabrication |
US11001934B2 (en) | 2017-08-21 | 2021-05-11 | Lam Research Corporation | Methods and apparatus for flow isolation and focusing during electroplating |
US10781527B2 (en) | 2017-09-18 | 2020-09-22 | Lam Research Corporation | Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating |
US10917966B2 (en) | 2018-01-29 | 2021-02-09 | Corning Incorporated | Articles including metallized vias |
TWI700401B (en) | 2018-08-21 | 2020-08-01 | 財團法人工業技術研究院 | Panel to be plated, electroplating process using the same, and chip manufactured from the same |
CN109652826A (en) * | 2019-02-22 | 2019-04-19 | 圣达电气有限公司 | The electrolytic copper foil the thickness uniformity control method of cathode roll |
WO2020231718A1 (en) | 2019-05-10 | 2020-11-19 | Nantenergy, Inc. | Nested annular metal-air cell and systems containing same |
IT201900013626A1 (en) | 2019-08-01 | 2021-02-01 | Fluid Metal 3D As | PROCEDURE AND SYSTEM OF LOCALIZED ELECTROFORMING BY JETS WITH CLOSED-LOOP FEEDBACK IN REAL TIME |
CN113265695A (en) * | 2021-05-18 | 2021-08-17 | 南京萨特科技发展有限公司 | Hanging plating jig and method for alloy foil resistor |
CN115976614A (en) * | 2021-10-14 | 2023-04-18 | 欣兴电子股份有限公司 | Electroplating apparatus and electroplating method |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6106687A (en) * | 1998-04-28 | 2000-08-22 | International Business Machines Corporation | Process and diffusion baffle to modulate the cross sectional distribution of flow rate and deposition rate |
US6251251B1 (en) * | 1998-11-16 | 2001-06-26 | International Business Machines Corporation | Anode design for semiconductor deposition |
Family Cites Families (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3328273A (en) | 1966-08-15 | 1967-06-27 | Udylite Corp | Electro-deposition of copper from acidic baths |
FR2510145B1 (en) | 1981-07-24 | 1986-02-07 | Rhone Poulenc Spec Chim | ADDITIVE FOR AN ACID ELECTROLYTIC COPPER BATH, ITS PREPARATION METHOD AND ITS APPLICATION TO COPPER PRINTED CIRCUITS |
US4643816A (en) * | 1985-05-09 | 1987-02-17 | Burlington Industries, Inc. | Plating using a non-conductive shroud and a false bottom |
US4678545A (en) * | 1986-06-12 | 1987-07-07 | Galik George M | Printed circuit board fine line plating |
US4948474A (en) | 1987-09-18 | 1990-08-14 | Pennsylvania Research Corporation | Copper electroplating solutions and methods |
DE3836521C2 (en) | 1988-10-24 | 1995-04-13 | Atotech Deutschland Gmbh | Aqueous acidic bath for the galvanic deposition of shiny and crack-free copper coatings and use of the bath |
US4954142A (en) | 1989-03-07 | 1990-09-04 | International Business Machines Corporation | Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor |
US5084071A (en) | 1989-03-07 | 1992-01-28 | International Business Machines Corporation | Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor |
US5256565A (en) | 1989-05-08 | 1993-10-26 | The United States Of America As Represented By The United States Department Of Energy | Electrochemical planarization |
JPH04143299A (en) * | 1990-10-03 | 1992-05-18 | Fujitsu Ltd | Electroplating method |
US5225034A (en) | 1992-06-04 | 1993-07-06 | Micron Technology, Inc. | Method of chemical mechanical polishing predominantly copper containing metal layers in semiconductor processing |
US5421987A (en) * | 1993-08-30 | 1995-06-06 | Tzanavaras; George | Precision high rate electroplating cell and method |
JP3397501B2 (en) | 1994-07-12 | 2003-04-14 | 株式会社東芝 | Abrasive and polishing method |
US5516412A (en) | 1995-05-16 | 1996-05-14 | International Business Machines Corporation | Vertical paddle plating cell |
US6042712A (en) | 1995-05-26 | 2000-03-28 | Formfactor, Inc. | Apparatus for controlling plating over a face of a substrate |
US5681215A (en) | 1995-10-27 | 1997-10-28 | Applied Materials, Inc. | Carrier head design for a chemical mechanical polishing apparatus |
US5795215A (en) | 1995-06-09 | 1998-08-18 | Applied Materials, Inc. | Method and apparatus for using a retaining ring to control the edge effect |
KR100232506B1 (en) | 1995-06-27 | 1999-12-01 | 포만 제프리 엘. | Copper alloys for chip and package interconnections and method of making |
US5755859A (en) | 1995-08-24 | 1998-05-26 | International Business Machines Corporation | Cobalt-tin alloys and their applications for devices, chip interconnections and packaging |
US5762544A (en) | 1995-10-27 | 1998-06-09 | Applied Materials, Inc. | Carrier head design for a chemical mechanical polishing apparatus |
US5620581A (en) | 1995-11-29 | 1997-04-15 | Aiwa Research And Development, Inc. | Apparatus for electroplating metal films including a cathode ring, insulator ring and thief ring |
US5840629A (en) | 1995-12-14 | 1998-11-24 | Sematech, Inc. | Copper chemical mechanical polishing slurry utilizing a chromate oxidant |
US5858813A (en) | 1996-05-10 | 1999-01-12 | Cabot Corporation | Chemical mechanical polishing slurry for metal layers and films |
US5793272A (en) | 1996-08-23 | 1998-08-11 | International Business Machines Corporation | Integrated circuit toroidal inductor |
US5773364A (en) | 1996-10-21 | 1998-06-30 | Motorola, Inc. | Method for using ammonium salt slurries for chemical mechanical polishing (CMP) |
US5954997A (en) | 1996-12-09 | 1999-09-21 | Cabot Corporation | Chemical mechanical polishing slurry useful for copper substrates |
US6051117A (en) * | 1996-12-12 | 2000-04-18 | Eltech Systems, Corp. | Reticulated metal article combining small pores with large apertures |
US5933753A (en) | 1996-12-16 | 1999-08-03 | International Business Machines Corporation | Open-bottomed via liner structure and method for fabricating same |
EP0932913A1 (en) | 1996-12-16 | 1999-08-04 | International Business Machines Corporation | Electroplated interconnection structures on integrated circuit chips |
US5807165A (en) | 1997-03-26 | 1998-09-15 | International Business Machines Corporation | Method of electrochemical mechanical planarization |
US5911619A (en) | 1997-03-26 | 1999-06-15 | International Business Machines Corporation | Apparatus for electrochemical mechanical planarization |
US5930669A (en) | 1997-04-03 | 1999-07-27 | International Business Machines Corporation | Continuous highly conductive metal wiring structures and method for fabricating the same |
US6132583A (en) * | 1997-05-16 | 2000-10-17 | Technic, Inc. | Shielding method and apparatus for use in electroplating process |
US5922091A (en) | 1997-05-16 | 1999-07-13 | National Science Council Of Republic Of China | Chemical mechanical polishing slurry for metallic thin film |
US5985123A (en) | 1997-07-09 | 1999-11-16 | Koon; Kam Kwan | Continuous vertical plating system and method of plating |
US6004440A (en) | 1997-09-18 | 1999-12-21 | Semitool, Inc. | Cathode current control system for a wafer electroplating apparatus |
US5897375A (en) | 1997-10-20 | 1999-04-27 | Motorola, Inc. | Chemical mechanical polishing (CMP) slurry for copper and method of use in integrated circuit manufacture |
US6027631A (en) | 1997-11-13 | 2000-02-22 | Novellus Systems, Inc. | Electroplating system with shields for varying thickness profile of deposited layer |
US6004880A (en) | 1998-02-20 | 1999-12-21 | Lsi Logic Corporation | Method of single step damascene process for deposition and global planarization |
US6071388A (en) | 1998-05-29 | 2000-06-06 | International Business Machines Corporation | Electroplating workpiece fixture having liquid gap spacer |
US6074544A (en) | 1998-07-22 | 2000-06-13 | Novellus Systems, Inc. | Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer |
US6132587A (en) | 1998-10-19 | 2000-10-17 | Jorne; Jacob | Uniform electroplating of wafers |
US6176992B1 (en) | 1998-11-03 | 2001-01-23 | Nutool, Inc. | Method and apparatus for electro-chemical mechanical deposition |
US6103085A (en) | 1998-12-04 | 2000-08-15 | Advanced Micro Devices, Inc. | Electroplating uniformity by diffuser design |
US6066030A (en) | 1999-03-04 | 2000-05-23 | International Business Machines Corporation | Electroetch and chemical mechanical polishing equipment |
US6136163A (en) | 1999-03-05 | 2000-10-24 | Applied Materials, Inc. | Apparatus for electro-chemical deposition with thermal anneal chamber |
US6297155B1 (en) | 1999-05-03 | 2001-10-02 | Motorola Inc. | Method for forming a copper layer over a semiconductor wafer |
US6197182B1 (en) | 1999-07-07 | 2001-03-06 | Technic Inc. | Apparatus and method for plating wafers, substrates and other articles |
US6299741B1 (en) | 1999-11-29 | 2001-10-09 | Applied Materials, Inc. | Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus |
US6231743B1 (en) * | 2000-01-03 | 2001-05-15 | Motorola, Inc. | Method for forming a semiconductor device |
US6354916B1 (en) * | 2000-02-11 | 2002-03-12 | Nu Tool Inc. | Modified plating solution for plating and planarization and process utilizing same |
-
2001
- 2001-05-15 US US09/855,059 patent/US6802946B2/en not_active Expired - Fee Related
- 2001-12-11 WO PCT/US2001/047445 patent/WO2002063072A1/en not_active Application Discontinuation
- 2001-12-11 CN CNA018225640A patent/CN1551931A/en active Pending
- 2001-12-11 EP EP01998036A patent/EP1360348A4/en not_active Withdrawn
- 2001-12-11 JP JP2002562802A patent/JP2004518817A/en not_active Abandoned
- 2001-12-11 KR KR10-2003-7008507A patent/KR20040005866A/en not_active Application Discontinuation
- 2001-12-20 TW TW090131629A patent/TW539778B/en not_active IP Right Cessation
-
2004
- 2004-06-18 US US10/869,850 patent/US7435323B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6106687A (en) * | 1998-04-28 | 2000-08-22 | International Business Machines Corporation | Process and diffusion baffle to modulate the cross sectional distribution of flow rate and deposition rate |
US6251251B1 (en) * | 1998-11-16 | 2001-06-26 | International Business Machines Corporation | Anode design for semiconductor deposition |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100439571C (en) * | 2002-07-18 | 2008-12-03 | 株式会社荏原制作所 | Plating device |
Also Published As
Publication number | Publication date |
---|---|
US20020079230A1 (en) | 2002-06-27 |
EP1360348A4 (en) | 2006-09-27 |
KR20040005866A (en) | 2004-01-16 |
TW539778B (en) | 2003-07-01 |
JP2004518817A (en) | 2004-06-24 |
US6802946B2 (en) | 2004-10-12 |
CN1551931A (en) | 2004-12-01 |
US20040231994A1 (en) | 2004-11-25 |
US7435323B2 (en) | 2008-10-14 |
EP1360348A1 (en) | 2003-11-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6802946B2 (en) | Apparatus for controlling thickness uniformity of electroplated and electroetched layers | |
US6610190B2 (en) | Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate | |
US6852630B2 (en) | Electroetching process and system | |
KR101765346B1 (en) | Method and apparatus for electroplating | |
US6319384B1 (en) | Pulse reverse electrodeposition for metallization and planarization of semiconductor substrates | |
US7238092B2 (en) | Low-force electrochemical mechanical processing method and apparatus | |
US9593431B2 (en) | Electroplating systems | |
JP2005501963A5 (en) | ||
EP1560949B1 (en) | Integrated plating and planarization process and apparatus therefor | |
US6858121B2 (en) | Method and apparatus for filling low aspect ratio cavities with conductive material at high rate | |
JP2005520043A (en) | Method and apparatus for avoiding particle accumulation in electrodeposition | |
US6706166B2 (en) | Method for improving an electrodeposition process through use of a multi-electrode assembly | |
US7201829B2 (en) | Mask plate design | |
US20030106807A1 (en) | Electrochemical mechanical processing with advancible sweeper | |
JP2005509092A (en) | Electrochemical mechanical processing using an advanceable sweeper | |
US20090020437A1 (en) | Method and system for controlled material removal by electrochemical polishing |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PH PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG UZ VN YU ZA ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
WWE | Wipo information: entry into national phase |
Ref document number: 1020037008507 Country of ref document: KR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2002562802 Country of ref document: JP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2001998036 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 018225640 Country of ref document: CN |
|
REG | Reference to national code |
Ref country code: DE Ref legal event code: 8642 |
|
WWP | Wipo information: published in national office |
Ref document number: 2001998036 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 1020037008507 Country of ref document: KR |
|
WWW | Wipo information: withdrawn in national office |
Ref document number: 2001998036 Country of ref document: EP |