WO2002073329A2 - Valve control system for atomic layer deposition chamber - Google Patents
Valve control system for atomic layer deposition chamber Download PDFInfo
- Publication number
- WO2002073329A2 WO2002073329A2 PCT/US2002/006778 US0206778W WO02073329A2 WO 2002073329 A2 WO2002073329 A2 WO 2002073329A2 US 0206778 W US0206778 W US 0206778W WO 02073329 A2 WO02073329 A2 WO 02073329A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- valve
- programmable logic
- logic controller
- electrically
- control computer
- Prior art date
Links
- 238000000231 atomic layer deposition Methods 0.000 title abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 69
- 230000008569 process Effects 0.000 claims abstract description 49
- 239000004065 semiconductor Substances 0.000 claims abstract description 18
- 238000004891 communication Methods 0.000 claims abstract description 7
- 238000010926 purge Methods 0.000 claims description 19
- 239000007787 solid Substances 0.000 claims description 13
- 230000004044 response Effects 0.000 claims description 9
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 230000003252 repetitive effect Effects 0.000 abstract description 5
- 230000001351 cycling effect Effects 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 34
- 235000012431 wafers Nutrition 0.000 description 15
- 239000010409 thin film Substances 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000000277 atomic layer chemical vapour deposition Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000427 thin-film deposition Methods 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000006396 nitration reaction Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- NXHILIPIEUBEPD-UHFFFAOYSA-H tungsten hexafluoride Chemical compound F[W](F)(F)(F)(F)F NXHILIPIEUBEPD-UHFFFAOYSA-H 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D11/00—Control of flow ratio
- G05D11/02—Controlling ratio of two or more flows of fluid or fluent material
- G05D11/13—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means
- G05D11/131—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means by measuring the values related to the quantity of the individual components
- G05D11/133—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means by measuring the values related to the quantity of the individual components with discontinuous action
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T436/00—Chemistry: analytical and immunological testing
- Y10T436/10—Composition for standardization, calibration, simulation, stabilization, preparation or preservation; processes of use in preparation for chemical testing
- Y10T436/104998—Glucose, ketone, nitrate standard or control
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T436/00—Chemistry: analytical and immunological testing
- Y10T436/12—Condition responsive control
Definitions
- This invention is concerned with semiconductor manufacturing processes, and is more particularly concerned with apparatus and methods for controlling deposition chambers .
- Semiconductor devices are made on substrates, such as silicon wafers or glass plates, for use in computers, monitors, and the like. These devices are made by a sequence of fabrication steps, such as thin film deposition, oxidation or nitration, etching, polishing, and thermal and lithographic processing. Thin film deposition typically is performed in a low-pressure processing chamber. In chemical vapor deposition, a wafer or other substrate is loaded into a processing chamber and is exposed to a process gas under suitable conditions for deposition of the process gas or a component of the process gas in the form of a thin film on the wafer.
- ALD atomic layer deposition
- ACVD atomic layer chemical vapor deposition
- many thin film layers are deposited on the wafer in a repetitive process in which the wafer is alternately exposed to more than one process gas.
- Each cycle of an ALD process entails opening and closing a number of valves which control the flow to the processing chamber of process gases or a purge gas. Because each cycle is repeated numerous times, the amount of time required to generate, transmit and execute valve opening and closing commands may be a significant factor in the overall elapsed time required to complete an ALD process.
- the present inventors have recognized that a key to improving throughput for ALD processes lies in shortening the "refresh time" for valve control commands, where "refresh time” refers to the time required to generate, transmit and execute a command.
- valve control system for a semiconductor processing chamber.
- the valve control system includes a system control computer and a plurality of electrically controlled valves associated with a processing chamber.
- the valve control system further includes a programmable logic controller in communication with the system control computer and operatively coupled to the electrically controlled valves.
- the programmable logic controller may control the electrically controlled valves with a refresh time of less than ten milliseconds, and preferably with a refresh time on the order of one millisecond (msec) .
- the valve control system may further include an interface board and a driver circuit coupling the programmable logic controller to the electrically controlled valves.
- the interface board may include solid state relays.
- the programmable logic controller may include an output power supply adapted to provide an output signal from the programmable logic controller.
- the valve control system may further include an interlock circuit operatively coupled to the output power supply and adapted to disable the output power supply upon occurrence of an interlock condition.
- the system control computer may be operatively coupled to the output power supply of the programmable logic controller and may be adapted to disable the output power supply in response to an operator input signal .
- the valve control system may include a control panel operatively connected to the system control computer and adapted to receive input from a human operator.
- the plurality of electrically controlled valves of the valve control system may include a first valve, a second valve and a third valve. The first valve may be coupled to a source of a first process gas, the second valve may be coupled to a source of a second process gas, and the third valve may be coupled to a source of a purge gas.
- a method of operating a valve associated with a semiconductor processing chamber includes generating an operation command for the valve, transmitting the generated operation command to the valve, and executing the transmitted operation command at the valve.
- the generating, transmitting and executing steps may all be performed within a time period that does not exceed 10 msec.
- a method of operating a valve associated with a semiconductor processing chamber includes providing an electrically-controlled valve and downloading a process recipe command from a system control computer to a programmable logic controller.
- the method further includes repeatedly generating open and close commands at the programmable logic controller in accordance with the downloaded process recipe command.
- the method according to this aspect of the invention may further include flowing a process gas or a purge gas to the semiconductor processing chamber in response to the opening of the electrically-controlled valve .
- commands to open or close valves for process gases or purge gas may be generated and executed with a refresh time on the order of one millisecond. With such a rapid refresh time, the many repetitive gas flow cycles required for ALD can be performed in an efficient manner, thereby increasing throughput.
- aspects of the invention also call for a hardware interlock operating through the output power supply of the programmable logic controller so that safety requirements are satisfied.
- solid state relays are employed in interface circuitry which interconnects the PLC with the valves. The use of solid state relays allows the system to operate with a long life, notwithstanding the very numerous open-close cycles required for ALD processing.
- FIG. 1 is a schematic block diagram of a valve control system provided in accordance with an embodiment of the invention
- FIG. 2 is a schematic diagram of an interface board that is part of the system of FIG. 1;
- FIG. 3 is a flow chart that illustrates valve control operations for an ALD process.
- FIG. 1 is a schematic block diagram of the valve control system.
- reference numeral 10 generally refers to the valve control system.
- the valve control system 10 is for controlling a plurality of electrically-controlled valves 12 installed in association with a processing chamber 14.
- the processing chamber 14 may be a conventional chemical vapor deposition chamber, modified to optimize the throughput for ALD processing.
- the modifications to the processing chamber 14 may include installing the valves 12 directly on the lid of the processing chamber 14, and providing a process position for the substrate (not shown) that is very close to the gas distribution fixture (not shown) in the processing chamber 14. Both of these modifications are designed to minimize the gas exposure cycle time.
- the valves 12, as noted before, are electronically-controlled valves, and are preferably type NC valves available from Fuj ikin of America Inc., Santa Clara, California. Each valve 12 is connected to a respective gas source 16.
- the gas sources 16 may include two or more process gas sources and a purge gas source.
- the valve control system 10 includes a system control computer 18 and a programmable logic controller (PLC) 20 that is in data communication with the system control computer 18 via a communication channel 22.
- PLC programmable logic controller
- the system control computer 18 and the PLC 20 are programmed to operate in accordance with a master-slave arrangement such that the system control computer 18 delegates to the PLC 20 control of the valves 12. More particularly, the system control computer 18 may download to the PLC 20 data that defines a valve operation recipe, and the PLC 20 then controls the valves 12 to carry out the downloaded valve control recipe.
- the system control computer 18 may be a conventional personal computer programmed to control operation of the processing chamber 14. Aside from the process and purge gas valve control functions delegated to the PLC 20, the system control computer 18 may control all other functions of the processing chamber 14, including control of, e.g., heaters, lifts, pumps, and valves such as exhaust valves that are different from the valves 12 controlled through the PLC 20.
- a conventional control panel 24, adapted to receive operator input, is connected to the system control computer 18.
- the PLC 20 is connected to the valves 12 via an interface board 26 and drivers 28.
- the drivers 28 may be constituted by circuitry sold by Fujikin under model number 23-6C-DR.
- the layout of interface board 26 is schematically illustrated in FIG. 2.
- FIG. 2 is self-explanatory, but it will be noted that each signal channel of the board 26 includes a respective solid state relay 30.
- the interface board 26 serves to isolate the output of the PLC 20 from the drivers 28.
- PLC 20 may be constituted by a conventional device such as the Allen Bradley-MicroLogix model 1500.
- the PLC 20 includes an output power supply 32 which provides power for signals outputted by the PLC 20 via field effect transistors (FETs) which are not shown.
- An interlock circuit 34 is coupled to the power supply 32 of the PLC 20. In accordance with conventional practice, the interlock circuit 34 is adapted to receive sensor signals to indicate conditions for which immediate shutdown of the process operation is required.
- interlock conditions such as opening of the gas cabinet door (not shown) .
- the interlock circuit 34 upon the interlock circuit 34 receiving a signal indicative of an interlock condition, the interlock circuit 34 disables the power supply 32 of PLC 20, thereby causing immediate closure of any open valve 12.
- the system control computer 18 is also coupled to the power supply 32 of PLC 20 for the purpose of disabling the power supply 32 and thereby shutting any open valve 12 upon receipt of a shutdown signal received from a human operator via control panel 24.
- the system control computer 18 may download commands to the PLC 20, including a recipe for valve operation during an ALD process, via the communications channel 22. Moreover, the PLC 20 may send data messages to the system control computer 18 via the communication channel 22. Such data messages may include acknowledgement messages and status messages that indicate, for example, a number of gas exposure cycles that have been performed from a recipe in process, or that indicate that a recipe has been completed.
- the system control computer 18 controls components of the processing chamber 14 to carry out functions such as loading a wafer for processing in the chamber 14, positioning the wafer at an appropriate place in the chamber 14 for processing, and pumping out the chamber 14.
- the system control computer 18 downloads to the PLC 20 data that indicates the process recipe in terms of control of the valves 12.
- the PLC 20 outputs command signals to the valves 12 by way of interface board 26 and drivers 28, to selectively open and close the valves 12, and thereby to selectively expose the wafer in the processing chamber 14 to gases from gas sources 16.
- FIG. 3 is a flow chart that illustrates a sequence of functions initiated by the PLC 20 in connection with an ALD process performed in the processing chamber 14.
- step 50 Initially in the process of FIG. 3 is a step 50, at which the PLC 20 increments a counter, which may have been reset in an initialization procedure (not shown) .
- step 52 at which the PLC 20 generates and outputs a command to open a first one of the valves 12.
- the first one of the valves 12 is connected to a source of a first process gas, which may be, for example, silane (SiH 4 ) or diborane (B 2 H 2 ) .
- the first valve then opens in response to the command from the PLC 20 and the first process gas enters the first processing chamber 14 and impinges on the wafer to deposit a first thin film on the wafer.
- the first valve is maintained in an open condition for a predetermined period of time which may be, for example, tens of milliseconds.
- the PLC 20 generates and transmits a command to close the first valve (step 54) .
- the first valve is closed in response to the closing command.
- the PLC 20 issues a command to open a second valve (step 56) which may be connected to a source of purge gas such as argon. Purge gas then flows into the chamber 14. Purging continues for a predetermined period of time, which may be on the order of a few hundred milliseconds, and then, with a predetermined timing, the PLC 20 issues a command (step 58) to close the second valve, thereby ending the purging.
- a second valve may be connected to a source of purge gas such as argon.
- Purge gas then flows into the chamber 14.
- Purging continues for a predetermined period of time, which may be on the order of a few hundred milliseconds, and then, with a predetermined timing, the PLC 20 issues a command (step 58) to close the second valve, thereby ending the purging.
- step 60 the PLC 20 generates and transmits a command to open a third one of the valves 12.
- the third valve is connected to a second source of process gas, which may be, for example, tungsten fluoride (WF 6 ) .
- WF 6 tungsten fluoride
- the second process gas Upon the opening of the third valve, the second process gas enters the chamber 14 and impinges on the wafer to deposit a second thin film layer on the wafer.
- the third valve may be maintained in an open position for a predetermined period of time which may be tens of milliseconds.
- the PLC 20 issues a command to close the third valve (62) and simultaneously issues a command to open the second valve (step 64) to initiate another purge.
- step 66 The purging continues for a predetermined period of time, which may be the same as the purge of step 56, and the purge is then terminated upon the PLC 20 issuing a command (step 66) to close the second valve .
- steps 52-66 a brief stage in which a thin film is deposited on the wafer using a first process gas is followed by a purge stage, and then followed by a second brief stage in which a thin film is deposited on the wafer using a second process gas, followed by a second purge.
- These four stages may be considered to make up one cycle, and entail four commands to open valves and four commands to close valves.
- control system 10 is arranged, and the valves 12 are selected, so that the refresh time required to generate, transmit and execute a valve opening or closing command takes less than ten milliseconds. For example, generation and transmission of the command may take less than 1 millisecond and execution of the command by the valve may take about 3 milliseconds. Such would not have been the case if, in accordance with conventional practices, valve operation signals for each valve opening and closing had been generated by and transmitted from the system control computer 18. Conventional practices in this regard might require up to one second or more for generation and transmission of each valve control command.
- the fast refresh time provided by the present invention is also supported by the selection of the valves 12 and the drivers 28 of the types referred to above and by the use of solid state relays in interface board 26.
- step 66 is a decision block 68 at which it is determined whether the recipe for the ALD process has been completed. If not (i.e., if further cycles are required) , the procedure of FIG. 3 loops back from decision block 68 to step 50 so that the counter is incremented and the cycle of steps 52-66 is performed again.
- a typical recipe for an ALD process may call for as few as 10 to 20 cycles or as many as 200-300 cycles or more. Once the number of cycles called for by the recipe has. been performed, a positive determination is made at step 68 and the ALD process is completed (step 70) . This may involve, for example, removing the wafer from the processing chamber 14.
- the refresh cycle for process and purge gas valve opening and closing commands is quite short with the arrangement of the present invention, the numerous valve operation cycles required for ALD can be performed rapidly, thereby enhancing throughput for the ALD process.
- the control system of the present invention may be arranged so that a hardware interlock is provided via the output power supply of the PLC 20; consequently safety regulations requiring hardware interlocks are complied with.
- the signal path from the PLC 20 to the valves 12 may be implemented with high-speed and long-life solid state relays, so that a short refresh time is achieved, and the control system is durable notwithstanding the very numerous repetitive operations required of the relays.
- valves selected for the system of the present invention respond very rapidly to operational command signals so that the refresh time is minimized.
- the valve control arrangement of the present invention also has the advantage of reducing the processing burden on the system control computer, since the large number of repetitive commands required for ALD processing are generated by the PLC 20 rather than the system control computer 18.
- the cyclic operating mode described in connection with FIG. 3 is advantageous for ALD operations, it is also contemplated to operate the control system 10 in a non-cyclic operating mode, in which commands for directly opening or closing valves 12 may be generated by the system control computer 18 and transmitted one by one via the PLC
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2002255664A AU2002255664A1 (en) | 2001-03-07 | 2002-03-06 | Valve control system for atomic layer deposition chamber |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/800,881 US6734020B2 (en) | 2001-03-07 | 2001-03-07 | Valve control system for atomic layer deposition chamber |
US09/800,881 | 2001-03-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002073329A2 true WO2002073329A2 (en) | 2002-09-19 |
WO2002073329A3 WO2002073329A3 (en) | 2003-12-11 |
Family
ID=25179620
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2002/006778 WO2002073329A2 (en) | 2001-03-07 | 2002-03-06 | Valve control system for atomic layer deposition chamber |
Country Status (7)
Country | Link |
---|---|
US (2) | US6734020B2 (en) |
JP (1) | JP2002329674A (en) |
KR (1) | KR20020071765A (en) |
CN (1) | CN1529839A (en) |
AU (1) | AU2002255664A1 (en) |
TW (1) | TW569310B (en) |
WO (1) | WO2002073329A2 (en) |
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US6861094B2 (en) | 2002-04-25 | 2005-03-01 | Micron Technology, Inc. | Methods for forming thin layers of materials on micro-device workpieces |
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US8518184B2 (en) | 2003-12-10 | 2013-08-27 | Micron Technology, Inc. | Methods and systems for controlling temperature during microfeature workpiece processing, E.G., CVD deposition |
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US9023436B2 (en) | 2004-05-06 | 2015-05-05 | Micron Technology, Inc. | Methods for depositing material onto microfeature workpieces in reaction chambers and systems for depositing materials onto microfeature workpieces |
US8997686B2 (en) | 2010-09-29 | 2015-04-07 | Mks Instruments, Inc. | System for and method of fast pulse gas delivery |
US9348339B2 (en) | 2010-09-29 | 2016-05-24 | Mks Instruments, Inc. | Method and apparatus for multiple-channel pulse gas delivery system |
US10031531B2 (en) | 2011-02-25 | 2018-07-24 | Mks Instruments, Inc. | System for and method of multiple channel fast pulse gas delivery |
US10126760B2 (en) | 2011-02-25 | 2018-11-13 | Mks Instruments, Inc. | System for and method of fast pulse gas delivery |
US10353408B2 (en) | 2011-02-25 | 2019-07-16 | Mks Instruments, Inc. | System for and method of fast pulse gas delivery |
US10969799B2 (en) | 2011-02-25 | 2021-04-06 | Mks Instruments, Inc. | System for and method of fast pulse gas delivery |
Also Published As
Publication number | Publication date |
---|---|
WO2002073329A3 (en) | 2003-12-11 |
CN1529839A (en) | 2004-09-15 |
US6734020B2 (en) | 2004-05-11 |
TW569310B (en) | 2004-01-01 |
JP2002329674A (en) | 2002-11-15 |
US20040143370A1 (en) | 2004-07-22 |
US20020127745A1 (en) | 2002-09-12 |
US7201803B2 (en) | 2007-04-10 |
AU2002255664A1 (en) | 2002-09-24 |
KR20020071765A (en) | 2002-09-13 |
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