WO2002075824A2 - Method for producing adaptronic microsystems - Google Patents
Method for producing adaptronic microsystems Download PDFInfo
- Publication number
- WO2002075824A2 WO2002075824A2 PCT/DE2002/000942 DE0200942W WO02075824A2 WO 2002075824 A2 WO2002075824 A2 WO 2002075824A2 DE 0200942 W DE0200942 W DE 0200942W WO 02075824 A2 WO02075824 A2 WO 02075824A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- control elements
- matrix
- transfer carrier
- elements
- microsystems
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
Definitions
- the present invention relates to a method for producing adaptronic microsystems, in which one or more converter elements are embedded in a matrix and one or more control elements for controlling and / or for transmitting signals of the converter elements are applied to the matrix or are introduced into the matrix.
- Adaptronic microsystems of the type mentioned, in particular with actuator and / or sensor transducer elements made of piezoelectric material, are used in many areas of technology in which sensors or actuators of reduced volume are required.
- sensors or actuators of reduced volume are required.
- microsystems that can be integrated into the material.
- a reduced stiffness of the sensors and / or actuators is required, as they have adaptronic microsystems.
- a generic method for producing adaptronic microsystems is known, for example, from US Pat. No. 5,869,189.
- this method several elongated piezoelectric fibers are used as transducer elements in parallel and at a defined distance inserted into one another.
- a liquid polymer material is then poured into the mold to form a polymer matrix.
- a polyimide film is coated on one side with a thin electrode structure, applied to the not yet hardened polymer matrix and hardened together with the matrix.
- the matrix with the fibers located therein is first cured. Then the
- Electrode structure for controlling the transducer elements by means of an electron beam evaporation technique applied to the surface of the matrix.
- the object of the present invention is to specify a method for producing adaptronic microsystems which enables the control elements to be completely embedded in the matrix. and is suitable for the production of prepeg modules.
- one or more converter elements are embedded in a matrix, for example a polymer casting compound, in a known manner, and one or more control elements for controlling and / or for transmitting signals of the converter elements to the matrix are introduced onto or into the matrix ,
- the transducer learnings can be embedded in the matrix, for example, in that the initially liquid matrix material is poured into a mold in which the transducer elements are located.
- control elements are applied or introduced onto or into the matrix by first connecting the control elements detachably to a first surface of a transfer carrier, for example a sheet, sheet or plate-shaped material.
- a transfer carrier for example a sheet, sheet or plate-shaped material.
- This transfer carrier with the control elements is then introduced onto or into the matrix in such a way that the first
- transducer elements embedded in a matrix and control elements incorporated on or into the matrix is available, which can either be fully cured at the current time or further processed as a prepeg module by only partially curing.
- the present method can be used to implement an embodiment of an adaptronic microsystem in which the control elements are completely enclosed by the matrix, the electrical insulation of these control elements being achieved from the outside by the matrix material itself.
- Such a configuration - without additional inner interfaces through an additional insulation layer - offers good protection against moisture and increases the reliability and service life of the microsystem.
- Connection of the control elements to the transfer carrier be designed such that the control elements - possibly after partial hardening of the matrix - have greater adhesion to the matrix and / or the transducer elements than to the transfer carrier. This can be made possible, for example, by using suitable, non-strongly adhesive connections between the control elements and the conductive adhesives producing the transfer carrier. Also a coating or treatment of the surface of the surface which reduces the adhesion
- Transfer carrier represents a possibility for producing this boundary condition. Comparable measures with the opposite effect can be carried out to improve the adhesion to the matrix and / or the converter elements.
- electrode structures are preferably applied as control elements on the transfer carrier. This can already be done as a prefabrication step for the manufacturing process.
- the electrodes can be implemented, for example, in a known manner as large-area plate electrodes, as line electrodes or in an interdigital arrangement. Linear electrode structures are either congruent on the front and back of the matrix, or are introduced onto or into the matrix with a lateral displacement relative to one another.
- Electrode structure As material or material form for the Electrode structure comes an electrically conductive film or an electrically conductive film, for example made of metal, carbon or an electrolyte, an electrically conductive network or grid, which can consist of the same materials, as well as intrinsically or extrinsically conductive materials or composite systems, such as paste or adhesive in any hardening state in question.
- control elements such as light guides
- the transducer elements can be exposed to an electromagnetic field with light guides.
- Such light guides can, for. B. in similar structures as conventional electrically conductive electrodes in the microsystem.
- the control elements can be applied to the matrix or introduced into the matrix in such a way that they are in direct contact with the converter elements.
- a matrix material layer of adjustable thickness can also be implemented between the control elements and the converter elements. This can further improve the product properties, for example for long-term resistance, since an intermediate layer made of the matrix material breaks down local peaks in the electrical field, which could otherwise permanently damage, for example, piezoceramic fibers.
- Point-to-point contacting or a partial or complete encapsulation of the converter elements with the control elements can also be achieved if the control elements are not yet or not yet fully cured adhesive are formed and pressed onto the transducer elements.
- control elements can be connected to the transfer carrier by means of a printing technique, for example screen printing or pad printing, by means of an inkjet technique, by dispensing or by other suitable application techniques. Closed or open-pore materials can be used as transfer carriers.
- Polymer films are particularly suitable, e.g. B. made of polyester, PP, PE, or FEP, non-woven paper or coated paper.
- Piezoelectrics, magnetostrictives, shape memory alloys or nanotubes, for example made of carbon can be used as active material of the transducer elements in the present method.
- the geometry of the transducer elements can be freely selected depending on the desired application.
- the transducer elements can, for example, be round, oval, long or short, flat or else three-dimensionally complex, such as long and wavy.
- the transducer elements can be isotropically disordered, i. H. be statistically distributed, embedded under a preferred orientation or also highly ordered (anisotropic) in the matrix material.
- a three-dimensionally complex arrangement for example as a mesh-like fabric or an arrangement in several layers, can also be realized with the present method.
- the material of the matrix or the casting compound can be either inorganic or organic, for example as a polymer, or by a mixture of organic and inorganic materials. Both materials that can be hardened using a single hardening mechanism and materials that can be combined with one another are possible. Combined curing is carried out, for example, by combined UV radiation and thermal curing of a polymer. To produce the microsystem as a prepeg, a multi-stage hardening is preferably carried out.
- the present method can be used to implement microsystems in which the actuator and / or sensory transducer elements can be controlled by means of an electrical, magnetic or electromagnetic field via the control elements.
- the microsystems can be implemented in such a way that the control elements can be controlled individually or in any size / many groups.
- the control elements or groups of control elements can of course also be controlled in a phase-shifted manner in a known manner. Suitable control techniques depending on the desired adaptronic effect and structure of the microsystem are familiar to the person skilled in the art.
- the present microsystem can be constructed, for example, from piezoelectric elements in order to utilize the d31 or the d33 effect.
- the electrical connections Conclusions can in this case be achieved in part by the provision of collecting electrodes, for example in the case of linear control elements, of connecting pads, for example as soldering points for contacting by the user, and / or of conventional supply lines.
- the electrically conductive feed lines can be in the form of wire, stranded wire, multi-core cable, paste, adhesive, flexible film, tissue or as an electrically conductive liquid (e.g. electrolyte) be trained.
- a possible variable orientation and mutual chaining of anisotropically operating microsystems may require providing several contact points for each of the microsystems.
- Such contact points can be formed, for example, by plug connections.
- the long-term reliability of the contact points can be improved by the additional introduction of an adhesive.
- the adhesive required for this can originate, for example, from the microsystem itself, in which, for. B. UV curing in the area of the connection pads is prevented with a combination curing casting compound, with the possibility of thermal post-curing after the plug connection has been produced.
- the necessary adhesive from the actual component, for. B. a prepeg originate itself or be fed separately.
- the gluing allows - at least selectively - metallic contact of the partners of the plug connection and maintains them permanently.
- the electrical connections can be made of the same material or different materials consist. For example, they can be applied to the transfer carrier together with the control elements and transferred to the matrix with this.
- the present method is advantageously suitable for the electroding of microsystems to be produced using prepeg technology.
- the piezo fibers piezo fiber laminate
- the prepeg polymer matrix are gelled onto transfer carriers as transducer elements between two opposite, congruently positioned electrode structures. This condition can be maintained at room temperature. If required, these prepegs can be laminated in CFRP / GFRP laminate layers. The material composite is then cured as usual (e.g. autoclave) using temperature and pressure.
- microsystems manufactured in prepeg technology are to stack the electrodized piezo fiber laminate congruently on one another in the gelled state, in order thereby to produce stacked microsystems. These stacked microsystems can then only be cured without the application of additional adhesive by applying pressure and temperature, so that the individual microsystems fuse together without the formation of an interface between them. This increases the long-term stability of such systems to a considerable extent, since there are no contact surfaces for moisture or other external influences, such as those formed by a boundary layer.
- the present method is briefly explained again below using an exemplary embodiment in conjunction with the figure.
- the single figure shows various process steps in the production of a microsystem according to the present method.
- the following exemplary embodiment shows the production of an adaptronic microsystem in which piezoelectric fibers are used as transducer elements and electrically conductive electrodes made of conductive adhesive are used as control elements.
- a polymer film is first provided as a transfer carrier 4.
- An electrically conductive adhesive for forming an interdigital electrode structure 3 is applied to the surface of this transfer carrier 4 (first surface) by means of screen printing.
- the electrically conductive adhesive is then z. B. fully cured by means of UV radiation or temperature or only partially cured ( Figure la).
- the piezoelectric fibers 2 are embedded in a liquid polymer matrix 1, as can be seen from FIG. 1b, and hardened or hardened if necessary.
- the transfer support 4 provided with the interdigital electrode structure 3 is covered on both sides immediately pressed onto the polymer matrix 2 or pressed into this matrix so that the electrodes 3 touch the fibers 2.
- the matrix 1 is then cured by means of radiation or temperature. The hardening takes place under defined mechanical pressure in order to maintain contact between the piezoelectric fibers 2 and the electrodes 3 and thus to ensure the electrical contact. If a corresponding contact pressure is applied, it is also possible to press the fibers 2 into the hardened conductive adhesive of the electrodes 3, so that the electrodes 3 completely or partially envelop the fibers 2.
- the transfer carrier 4 is pulled off. It is of crucial importance here that the adhesion of the electrodes 3 to the transfer carrier 4 is less than to the polymer matrix 1 (FIG. 1d).
- FIG. 1d After removal of the transfer carrier 4, there is a microsystem 5, as shown in FIG. 1d.
- the electrodes 3 have direct contact with the fibers 2 and at the same time are completely enclosed by the polymer matrix 1.
- an embodiment can also be implemented in which the electrodes 3 in FIG. 1c are not pressed against the piezo fibers 2, so that a gap with polymer material remains between the piezo fibers 2 and the electrodes 3. If the polymer matrix 1 is not fully cured, a plurality of such microsystems 5 can also be stacked one above the other and only then cured completely using mechanical pressure - and possibly temperature and / or UV radiation - so that a stacked microsystem is created (see FIG. 1). ,
- control elements e.g. B. electrodes
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10291136T DE10291136B4 (en) | 2001-03-16 | 2002-03-15 | Process for the production of adaptronic microsystems |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10112862 | 2001-03-16 | ||
DE10112862.2 | 2001-03-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002075824A2 true WO2002075824A2 (en) | 2002-09-26 |
WO2002075824A3 WO2002075824A3 (en) | 2003-05-22 |
Family
ID=7677808
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2002/000942 WO2002075824A2 (en) | 2001-03-16 | 2002-03-15 | Method for producing adaptronic microsystems |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE10291136B4 (en) |
WO (1) | WO2002075824A2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1645350A1 (en) * | 2004-10-08 | 2006-04-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Casting with integrated functional elements and manufacturing process |
DE102006047411A1 (en) * | 2006-09-29 | 2008-04-03 | Technische Universität Dresden | Transducer material module e.g. thermoplastic piezo-ceramic module, manufacturing method for e.g. vehicle construction, involves disconnecting function module for component as thermo-plastic composite compatible transducer material module |
US7665300B2 (en) | 2005-03-11 | 2010-02-23 | Massachusetts Institute Of Technology | Thin, flexible actuator array to produce complex shapes and force distributions |
WO2018104047A1 (en) * | 2016-12-08 | 2018-06-14 | Gottfried Wilhelm Leibniz Universität Hannover | Method for applying an electrical microstructure, elastomer structure, fiber composite component, and tire |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0411790A (en) * | 1990-04-28 | 1992-01-16 | Ngk Spark Plug Co Ltd | Electrode layer forming film for piezoelectric electrostrictive element or capacity element |
US5869189A (en) * | 1994-04-19 | 1999-02-09 | Massachusetts Institute Of Technology | Composites for structural control |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19829202B4 (en) * | 1998-06-30 | 2005-06-30 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Microsystem, process for its preparation and its use |
-
2002
- 2002-03-15 DE DE10291136T patent/DE10291136B4/en not_active Expired - Fee Related
- 2002-03-15 WO PCT/DE2002/000942 patent/WO2002075824A2/en not_active Application Discontinuation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0411790A (en) * | 1990-04-28 | 1992-01-16 | Ngk Spark Plug Co Ltd | Electrode layer forming film for piezoelectric electrostrictive element or capacity element |
US5869189A (en) * | 1994-04-19 | 1999-02-09 | Massachusetts Institute Of Technology | Composites for structural control |
Non-Patent Citations (3)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 016, no. 162 (E-1192), 20. April 1992 (1992-04-20) & JP 04 011790 A (NGK SPARK PLUG CO LTD), 16. Januar 1992 (1992-01-16) -& JP 04 011790 A (NGK SPARK PLUG CO LTD) 16. Januar 1992 (1992-01-16) * |
SCHAEFER H ET AL: "Polymeric materials for adaptronic fibre modules" FIRST INTERNATIONAL IEEE CONFERENCE ON POLYMERS AND ADHESIVES IN MICROELECTRONICS AND PHOTONICS. INCORPORATING POLY, PEP & ADHESIVES IN ELECTRONICS, POTSDAM, GERMANY, 21. - 24. Oktober 2001, Seiten 98-103, XP002231273 IEEE, USA ISBN: 0-7803-7220-4 * |
WILKIE W K ET AL: "Low-cost piezocomposite actuator for structural control applications" SMART STRUCTURES AND MATERIALS 2000: INDUSTRIAL AND COMMERCIAL APPLICATIONS OF SMART STRUCTURES TECHNOLOGIES, NEWPORT BEACH, CA, USA, Bd. 3991, 7. - 9. M{rz 2000, Seiten 323-334, XP000952354 Proceedings of the SPIE - The International Society for Optical Engineering ISSN: 0277-786X * |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1645350A1 (en) * | 2004-10-08 | 2006-04-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Casting with integrated functional elements and manufacturing process |
US7665300B2 (en) | 2005-03-11 | 2010-02-23 | Massachusetts Institute Of Technology | Thin, flexible actuator array to produce complex shapes and force distributions |
DE102006047411A1 (en) * | 2006-09-29 | 2008-04-03 | Technische Universität Dresden | Transducer material module e.g. thermoplastic piezo-ceramic module, manufacturing method for e.g. vehicle construction, involves disconnecting function module for component as thermo-plastic composite compatible transducer material module |
WO2018104047A1 (en) * | 2016-12-08 | 2018-06-14 | Gottfried Wilhelm Leibniz Universität Hannover | Method for applying an electrical microstructure, elastomer structure, fiber composite component, and tire |
CN110073727A (en) * | 2016-12-08 | 2019-07-30 | 汉诺威戈特弗里德威廉莱布尼茨大学 | For applying method, elastomer structure, fiber composite component and the tire of electrical microstructure |
Also Published As
Publication number | Publication date |
---|---|
DE10291136D2 (en) | 2004-04-15 |
WO2002075824A3 (en) | 2003-05-22 |
DE10291136B4 (en) | 2008-01-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2545598B1 (en) | Bending transducer | |
DE19620826C2 (en) | Piezoelectric bending transducer and method for its production | |
EP2027600A1 (en) | Printed circuit board element having at least one component embedded therein and method for embedding at least one component in a printed circuit board element | |
EP1168463A1 (en) | Fiber composite with integrated piezoelectric actor or sensor | |
EP1527483B1 (en) | External electrode on a piezoceramic multi-layer actuator | |
EP2852970B1 (en) | Method for producing an electronic subassembly | |
EP1019972B1 (en) | Piezo-electric element | |
DE102009030693A1 (en) | Electroactive elastomer actuator and process for its preparation | |
EP2136419B1 (en) | Multilayer actuator and method for producing same | |
DE19829216C1 (en) | Electromechanical transducer and manufacturing method | |
EP2351166B1 (en) | Method for connecting two parts mechanically and electrically at the same time | |
CH705539A1 (en) | A dielectric actuator. | |
DE10058096A1 (en) | Adaptronic microsystem has actuating and sensing microelements embedded in matrix material, and no boundary surface at contact points between insulation and matrix material | |
WO2002075824A2 (en) | Method for producing adaptronic microsystems | |
DE602004009987T2 (en) | Piezoelectric device and method of manufacturing a piezoelectric device | |
DE102006051080A1 (en) | Multilayer actuators with interdigital electrodes | |
WO1992002961A1 (en) | Bonding of a piezo-electric bending transducer | |
EP1724849A2 (en) | Piezoelectric element | |
DE102007004893B4 (en) | Piezoelectric multilayer actuator and method for its production | |
DE102004004737A1 (en) | Piezoactuator and a method for its production | |
DE3223801A1 (en) | Process for producing a piezoelectric actuator | |
DE102004042373A1 (en) | Laminated piezoelectric element for precision-positioning device, e.g. fuel injection valve for automobile, has side electrodes that lead electrically to internal electrode layers and that are formed by sintering ultra fine metal particles | |
EP1846959B1 (en) | Piezoelectric element | |
DE102009022584A1 (en) | Method for material fit connection of parts with an adhesive, comprises applying the adhesive on the surface of the parts to be connected with one another | |
EP3542405B1 (en) | Piezoelectric transmission and/or reception device, vibration sensor comprising a piezoelectric transmission and/or reception device of said type, and method for manufacturing a piezoelectric transmission and/or reception device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): AE AL AM AT AU AZ BA BB BG BR BY CA CH CN CR CU CZ DE DK DM EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
REF | Corresponds to |
Ref document number: 10291136 Country of ref document: DE Date of ref document: 20040415 Kind code of ref document: P |
|
WWE | Wipo information: entry into national phase |
Ref document number: 10291136 Country of ref document: DE |
|
122 | Ep: pct application non-entry in european phase | ||
NENP | Non-entry into the national phase |
Ref country code: JP |
|
WWW | Wipo information: withdrawn in national office |
Ref document number: JP |
|
REG | Reference to national code |
Ref country code: DE Ref legal event code: 8607 |