WO2002077918A2 - Verfahren zur herstellung einer kontaktlose chipkarte sowie entsprechend hergestellte chipkarte - Google Patents
Verfahren zur herstellung einer kontaktlose chipkarte sowie entsprechend hergestellte chipkarte Download PDFInfo
- Publication number
- WO2002077918A2 WO2002077918A2 PCT/DE2002/000949 DE0200949W WO02077918A2 WO 2002077918 A2 WO2002077918 A2 WO 2002077918A2 DE 0200949 W DE0200949 W DE 0200949W WO 02077918 A2 WO02077918 A2 WO 02077918A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- antenna
- electronic component
- substrates
- chip card
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
Definitions
- the present invention relates to a method for
- transponder unit Production of a transponder unit with at least one chip and an antenna, in particular for the production of a contactless chip card, as well as such a transponder unit.
- contactless chip cards consist of two electrical components, namely a chip module and an antenna that is electrically connected to the chip module.
- other components such as more microchips for
- Data storage, optical displays, batteries, etc. can be integrated in the chip card.
- These electronic components are applied to an electrically non-conductive base substrate, which conventionally consists of plastic, is built into the card and thus forms part of the card.
- the chips are partly processed bare, which means that the silicon chip is not additionally housed in a housing, but partly the silicon chips are previously installed in a corresponding housing.
- the one in the housing housed chip is then generally referred to as a chip module.
- both the unhoused and the wrapped variant are meant for chips.
- transponder units are arranged on a base substrate.
- the arrangement takes place in a regular, grid-like arrangement, with arrangements of approx. 3 x 8 or 6 x. 6 are the usual useful sizes.
- a method for arranging a transponder unit having at least one chip and a wire coil on a substrate is known from DE 44 10 732 C2.
- a single substrate layer is used in order to build up the various components thereon.
- the antenna is applied to the substrate as the first component.
- three different processes namely the etching process, the printing process and the wire laying process.
- the base substrate is completely coated with copper.
- Photolithography process the coil is imaged and the excess copper is etched away.
- the coil contour is printed on using electrically conductive ink or paste. Screen printing processes are generally used.
- electrically conductive wire is applied to a substrate along the coil contour and fastened there in a punctiform manner or along the entire contour.
- the next step is the application of the chip modules and the further electronic components, the components being mounted on the same substrate in all known methods ,
- the components are assembled in such a way that the contact surface of the component is congruent with the contact surface of the previously assembled component.
- the components are applied sequentially.
- the electrical contacting of the components then takes place.
- the contact surfaces of the individual components are connected to each other.
- the following processes are usually used: Soldering, electrically conductive gluing and TC bonding, which is also called micro welding.
- soldering During soldering, additional solder material is applied between the connection points of the components and thermally remelted after component assembly.
- an electrically conductive adhesive is additionally introduced between the components, which is cured after component assembly.
- the curing usually takes place under the influence of temperature or UV light.
- the present invention is intended to overcome the disadvantages mentioned of a method for producing a transponder unit with at least one chip and an antenna, in particular for producing a contactless chip card.
- the invention solves the problem by a method according to claim 1, in which the individual components, in particular coil and chip, are applied to different substrates and are mounted separately from one another.
- the measures of the invention initially have the result that, in the event of a fault, for example when the chip is applied to the corresponding substrate, at most these parts become unusable, while the separately manufactured antenna unit, in which there is considerable structural outlay, is not affected by such a fault is.
- the measures of the invention have the consequence that the antenna unit, consisting of the second substrate and the antenna coil, can be prefabricated independently of the chip, so that an antenna unit can be used for different chip parts, consisting of the substrate and a chip applied or embedded on the first substrate Can be found. This is significant since different chip parts may differ only in the software or different data they contain. OJ> tt
- CD BJi P CD ⁇ io ⁇ ⁇ ⁇ - P ff ⁇ ⁇ - H rt i ii ⁇ ⁇ H ü • ⁇ PP & ö P rt 0 l_l. ⁇ - ii CD P o ⁇ . ⁇ - P- P ⁇
- the chip module surface is “rubbed" into the substrate.
- the individual substrates are brought together in an exact position and pressed together.
- the substrates must be brought together in such a way that the contact surfaces of the components of one substrate are congruent with the contact surfaces of the components of the next substrate.
- the electrical contacting of the components inevitably comes about when the substrates are brought together and pressed. This can either be done without an additional contacting step or, alternatively, an additional contacting step can be carried out after the merging. All three of the previously mentioned contacting methods can be used.
- the pressing of the substrate layers is usually carried out hot and is called lamination.
- the various substrate layers can even be fused, so that a hermetically sealed bond with internal electronics results.
- This composite can then be further processed as a basic card body.
- Thin components are simply "sunk” and melted into the substrate layers during pressing
- thicker components in particular thick chip modules
- can alternatively be another Substrate layers are introduced into the structure, this substrate layer not having its own components but only having cutouts.
- the cutouts are arranged so that the raised areas of the thick components come to lie in them.
- leveling layers are installed and processed as a separate substrate between the other substrate layers.
- a transponder unit manufactured with the method according to the present invention is defined by the independent independent claim.
- Figure 1 is a top view of a contactless card and its internal components.
- Fig. 2 shows the top view of the arrangement of the benefits of contactless cards during the manufacturing process
- Fig. 3 shows the two substrate layers during the merge
- Fig. 1 shows an embodiment of a contactless chip card.
- the outer contour 1 of the card corresponds to the standard contour for chip cards as described in ISO standard 7816.
- the antenna 3 is manufactured using wire-laying technology.
- a wire conductor is applied to a substrate in accordance with the antenna contour.
- the contact point 4 results.
- the electrical contact can arise here by simply pressing together.
- additional contacting methods described above can be used.
- the thickness of the map shown generally corresponds to the thickness of ISO maps as also described in ISO standard 7816.
- Fig. 2 shows the arrangement of benefits of the individual transponders during the production of contactless cards.
- the substrates described here are not designed for each individual card, but are arranged in larger formats. Usage formats that are common in industry are 3 x 8 or 6 x 6. There are also many other different formats.
- the transponders are arranged in a grid pattern with constant intervals in the longitudinal direction 5 and in the transverse direction 6. For simplicity of illustration, only a 3 ⁇ 3 utility format is shown in FIG. 2.
- the design of the individual transponders 7 on the panel is completely identical.
- Each individual transponder here consists of a chip module 8 and an associated antenna 9.
- auxiliary lines 10 are often printed onto the substrates in order to simplify assembly. These guidelines mark the exact spaces between the individual transponders on the substrate.
- Substrate 11 supports antennas 12, which are arranged exactly in the defined arrangement of positions and positions.
- Auxiliary lines 13 can be applied to the antenna substrate, which simplify the alignment of the two substrates.
- the antennas 12 lie on the underside of the substrate, that is to say on the side facing the second substrate.
- the second substrate 14 shows the substrate on which the chip modules 15 are already preassembled. The chip modules are already fixed on the substrate using the previously described methods.
- the chip modules 15 are on the
- the two substrates 11 and 14 are aligned and pressed together.
- FIG. 4 shows a cross-sectional view of the joined substrates of a transponder.
- the lower substrate 16 on which the chip module 17 is arranged can be seen.
- the antenna 19 and the contact surfaces 23 of the chip module overlap. The electrical connection is formed at this point.
- a compensation substrate 21 is also shown. This substrate does not support components, but only contains an opening 22, in which the chip module 17 comes to rest after the assembly process.
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10291280T DE10291280D2 (de) | 2001-03-22 | 2002-03-16 | Verfahren zur Herstellung einer kontaktlosen Chipkarte sowie entsprechend hergestellte Chipkarte |
US10/472,688 US7229022B2 (en) | 2001-03-22 | 2002-03-16 | Method for producing a contactless chip card and chip card produced according to said method |
AU2002250820A AU2002250820A1 (en) | 2001-03-22 | 2002-03-16 | Method for producing a contactless chip card and chip card produced according to said method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10114355.9 | 2001-03-22 | ||
DE10114355A DE10114355A1 (de) | 2001-03-22 | 2001-03-22 | Verfahren zur Herstellung einer kontaktlosen multifunktionalen Chipkarte sowie entsprechend hergestellte Chipkarte |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002077918A2 true WO2002077918A2 (de) | 2002-10-03 |
WO2002077918A3 WO2002077918A3 (de) | 2002-11-14 |
Family
ID=7678765
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2002/000949 WO2002077918A2 (de) | 2001-03-22 | 2002-03-16 | Verfahren zur herstellung einer kontaktlose chipkarte sowie entsprechend hergestellte chipkarte |
Country Status (4)
Country | Link |
---|---|
US (1) | US7229022B2 (de) |
AU (1) | AU2002250820A1 (de) |
DE (2) | DE10114355A1 (de) |
WO (1) | WO2002077918A2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008068023A1 (de) * | 2006-12-08 | 2008-06-12 | Giesecke & Devrient Gmbh | Herstellung kartenförmiger datenträger |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6772505B1 (en) * | 2003-03-04 | 2004-08-10 | The Goodyear Tire & Rubber Company | Method of assembly an annular antenna to a transponder |
JP2005135354A (ja) * | 2003-10-08 | 2005-05-26 | Toshiba Tec Corp | 無線タグ読取り装置及びこの装置に使用する無線タグモジュール並びに無線タグ付き物品及びこの物品を収納する収納箱 |
JP2006031336A (ja) * | 2004-07-15 | 2006-02-02 | Fujitsu Ltd | Rfidタグの製造方法 |
EP2039460A3 (de) * | 2004-11-02 | 2014-07-02 | HID Global GmbH | Verlegevorrichtung, Kontaktiervorrichtung, Zustellsystem, Verlege- und Kontaktiereinheit, herstellungsanlage, Verfahren zur Herstellung und eine Transpondereinheit |
EP1724712A1 (de) * | 2005-05-11 | 2006-11-22 | Stmicroelectronics Sa | Micromodul, speziell für eine Smart Card |
DE102006005909A1 (de) * | 2006-02-09 | 2007-08-23 | Karl Knauer Kg | Produkt mit integriertem Transponder |
DE102006012708A1 (de) * | 2006-03-17 | 2007-09-20 | Polyic Gmbh & Co. Kg | Verfahren zur Herstellung eines aktiven oder passiven elektrischen Bauteils sowie elektrisches Bauteil |
WO2008037592A1 (en) | 2006-09-26 | 2008-04-03 | Advanced Micromechanic And Automation Technology Ltd | Method of connecting an antenna to a transponder chip and corresponding transponder inlay |
US7971339B2 (en) * | 2006-09-26 | 2011-07-05 | Hid Global Gmbh | Method and apparatus for making a radio frequency inlay |
US20080179404A1 (en) * | 2006-09-26 | 2008-07-31 | Advanced Microelectronic And Automation Technology Ltd. | Methods and apparatuses to produce inlays with transponders |
US8286332B2 (en) * | 2006-09-26 | 2012-10-16 | Hid Global Gmbh | Method and apparatus for making a radio frequency inlay |
US7581308B2 (en) | 2007-01-01 | 2009-09-01 | Advanced Microelectronic And Automation Technology Ltd. | Methods of connecting an antenna to a transponder chip |
US7546671B2 (en) * | 2006-09-26 | 2009-06-16 | Micromechanic And Automation Technology Ltd. | Method of forming an inlay substrate having an antenna wire |
US8322624B2 (en) * | 2007-04-10 | 2012-12-04 | Feinics Amatech Teoranta | Smart card with switchable matching antenna |
US7979975B2 (en) * | 2007-04-10 | 2011-07-19 | Feinics Amatech Teavanta | Methods of connecting an antenna to a transponder chip |
US8608080B2 (en) * | 2006-09-26 | 2013-12-17 | Feinics Amatech Teoranta | Inlays for security documents |
US8240022B2 (en) * | 2006-09-26 | 2012-08-14 | Feinics Amatech Teorowita | Methods of connecting an antenna to a transponder chip |
US7980477B2 (en) * | 2007-05-17 | 2011-07-19 | Féinics Amatech Teoranta | Dual interface inlays |
EP2034429A1 (de) * | 2007-09-05 | 2009-03-11 | Assa Abloy AB | Herstellungsverfahren für eine Karte und mit diesem Verfahren hergestellte Karte |
ES2355682T3 (es) * | 2007-09-18 | 2011-03-30 | Hid Global Ireland Teoranta | Procedimiento para la unión de un conductor de cable dispuesto sobre un sustrato. |
US8141786B2 (en) * | 2008-01-18 | 2012-03-27 | Texas Instruments Incorporated | Thin smart card module having strap on carrier |
DE102008046407B4 (de) * | 2008-09-09 | 2015-12-03 | Infineon Technologies Ag | Datenträger für kontaktlose Datenübertragung und ein Verfahren zur Herstellung eines solchen Datenträgers |
US8724340B2 (en) | 2008-09-09 | 2014-05-13 | Infineon Technologies Ag | Data carrier for contactless data transmission and a method for producing such a data carrier |
DE102009038620B4 (de) | 2009-08-26 | 2012-05-24 | Melzer Maschinenbau Gmbh | Verfahren und Vorrichtung zur Herstellung einer Transpondereinheit |
US8186603B2 (en) * | 2009-09-22 | 2012-05-29 | On Track Innovation Ltd. | Contactless smart sticker |
US8613132B2 (en) | 2009-11-09 | 2013-12-24 | Feinics Amatech Teoranta | Transferring an antenna to an RFID inlay substrate |
WO2011063270A1 (en) | 2009-11-19 | 2011-05-26 | Cubic Corporation | Variable pitch mandrel wound antennas and systems and methods of making same |
EP2567349B1 (de) * | 2010-05-04 | 2014-11-12 | Féinics AmaTech Teoranta | Fertigung von rfid-einlagen |
US8870080B2 (en) | 2010-08-12 | 2014-10-28 | Féinics Amatech Teoranta | RFID antenna modules and methods |
CN102653041A (zh) * | 2011-03-04 | 2012-09-05 | 上海一芯智能科技有限公司 | 一种非接触智能卡天线焊接工艺 |
WO2013032921A1 (en) * | 2011-08-26 | 2013-03-07 | Identive Group, Inc. | Card lamination |
AU2013214133A1 (en) | 2012-02-05 | 2014-07-31 | Feinics Amatech Teoranta | RFID antenna modules and methods |
EP3005242A1 (de) | 2013-05-28 | 2016-04-13 | Féinics AmaTech Teoranta | Antennenmodule für doppelschnittstellen-chipkarten, verstärkungsantennenkonfigurationen und verfahren |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19533983A1 (de) * | 1995-09-14 | 1997-04-10 | Wendisch Karl Heinz | Chipkarte mit Antennenwicklung |
WO1998045804A1 (de) * | 1997-04-04 | 1998-10-15 | Telbus Gesellschaft Für Elektronische Kommunikations-Systeme Mbh | Chipkarte mit nietverbindung |
FR2775810A1 (fr) * | 1998-03-09 | 1999-09-10 | Gemplus Card Int | Procede de fabrication de cartes sans contact |
FR2790849A1 (fr) * | 1999-03-12 | 2000-09-15 | Gemplus Card Int | Procede de fabrication pour dispositif electronique du type carte sans contact |
Family Cites Families (10)
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US4171477A (en) * | 1976-03-16 | 1979-10-16 | International Business Machines Corporation | Micro-surface welding |
DE4337921C2 (de) * | 1993-11-06 | 1998-09-03 | Ods Gmbh & Co Kg | Kontaktlose Chipkarte mit Antennenspule |
WO1996009175A1 (fr) * | 1994-09-22 | 1996-03-28 | Rohm Co., Ltd. | Carte de ci du type sans contact et procede de fabrication de cette carte |
DE19549431A1 (de) * | 1995-09-14 | 1997-03-27 | Wendisch Karl Heinz | Chipträgerfolie für eine Chipkarte mit Antennenwicklung |
US6036099A (en) * | 1995-10-17 | 2000-03-14 | Leighton; Keith | Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom |
JPH10320519A (ja) * | 1997-05-19 | 1998-12-04 | Rohm Co Ltd | Icカード通信システムにおける応答器 |
FR2780551B1 (fr) * | 1998-06-29 | 2001-09-07 | Inside Technologies | Micromodule electronique integre et procede de fabrication d'un tel micromodule |
DE19846237A1 (de) * | 1998-10-07 | 2000-04-13 | Fraunhofer Ges Forschung | Verfahren zur Herstellung eines Mikrotransponders |
US5989994A (en) * | 1998-12-29 | 1999-11-23 | Advantest Corp. | Method for producing contact structures |
KR100309161B1 (ko) * | 1999-10-11 | 2001-11-02 | 윤종용 | 메모리 카드 및 그 제조방법 |
-
2001
- 2001-03-22 DE DE10114355A patent/DE10114355A1/de not_active Withdrawn
-
2002
- 2002-03-16 DE DE10291280T patent/DE10291280D2/de not_active Expired - Lifetime
- 2002-03-16 AU AU2002250820A patent/AU2002250820A1/en not_active Abandoned
- 2002-03-16 US US10/472,688 patent/US7229022B2/en not_active Expired - Lifetime
- 2002-03-16 WO PCT/DE2002/000949 patent/WO2002077918A2/de not_active Application Discontinuation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19533983A1 (de) * | 1995-09-14 | 1997-04-10 | Wendisch Karl Heinz | Chipkarte mit Antennenwicklung |
WO1998045804A1 (de) * | 1997-04-04 | 1998-10-15 | Telbus Gesellschaft Für Elektronische Kommunikations-Systeme Mbh | Chipkarte mit nietverbindung |
FR2775810A1 (fr) * | 1998-03-09 | 1999-09-10 | Gemplus Card Int | Procede de fabrication de cartes sans contact |
FR2790849A1 (fr) * | 1999-03-12 | 2000-09-15 | Gemplus Card Int | Procede de fabrication pour dispositif electronique du type carte sans contact |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008068023A1 (de) * | 2006-12-08 | 2008-06-12 | Giesecke & Devrient Gmbh | Herstellung kartenförmiger datenträger |
Also Published As
Publication number | Publication date |
---|---|
US20040155114A1 (en) | 2004-08-12 |
AU2002250820A1 (en) | 2002-10-08 |
DE10291280D2 (de) | 2004-04-15 |
WO2002077918A3 (de) | 2002-11-14 |
US7229022B2 (en) | 2007-06-12 |
DE10114355A1 (de) | 2002-10-17 |
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