WO2002077918A3 - Verfahren zur herstellung einer kontaktlose chipkarte sowie entsprechend hergestellte chipkarte - Google Patents

Verfahren zur herstellung einer kontaktlose chipkarte sowie entsprechend hergestellte chipkarte Download PDF

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Publication number
WO2002077918A3
WO2002077918A3 PCT/DE2002/000949 DE0200949W WO02077918A3 WO 2002077918 A3 WO2002077918 A3 WO 2002077918A3 DE 0200949 W DE0200949 W DE 0200949W WO 02077918 A3 WO02077918 A3 WO 02077918A3
Authority
WO
WIPO (PCT)
Prior art keywords
chip card
producing
substrate
antenna
electronic component
Prior art date
Application number
PCT/DE2002/000949
Other languages
English (en)
French (fr)
Other versions
WO2002077918A2 (de
Inventor
Manfred Rietzler
Original Assignee
Intec Holding Gmbh
Manfred Rietzler
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intec Holding Gmbh, Manfred Rietzler filed Critical Intec Holding Gmbh
Priority to DE10291280T priority Critical patent/DE10291280D2/de
Priority to US10/472,688 priority patent/US7229022B2/en
Priority to AU2002250820A priority patent/AU2002250820A1/en
Publication of WO2002077918A2 publication Critical patent/WO2002077918A2/de
Publication of WO2002077918A3 publication Critical patent/WO2002077918A3/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar

Abstract

Es wird ein Verfahren vorgeschlagen zur Herstellung eines Transponders, insbesondere einer kontaktlosen Chipkarte (1), mit zumindest einem elektronischen Bauteil (Chipmodul 2) und zumindest einer Antenne (3), wobei das zumindest eine elektronische Bauteil (2) auf einem als Bauteileträger dienenden, nichtleitenden Substrat angeordnet ist. Auch die zumindest eine Antenne wird auf einem nichtleitenden Sustrat angeordnet ist, wobei das zumindest eine elektronischen Bauteil (2) auf einem ersten Substrat und die Antenne (3) auf einem zweiten aufgebracht wird und danach durch das lagerichtige Zusammenführen der einzelnen Substrate die gesamte Schaltung (1) hergestellt wird.Die Kontaktierung der Bauelemente (2, 3) erfolgt nach dem Zusammenführen der verschiedenen Substrate mittels Hilfsstoffen wie Lot oder Klebstoff oder ohne Hilfsstoffe mittels Mikroschweißen. Die nichtleitenden Substrate bilden einen Grundkartenkörper aus.
PCT/DE2002/000949 2001-03-22 2002-03-16 Verfahren zur herstellung einer kontaktlose chipkarte sowie entsprechend hergestellte chipkarte WO2002077918A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE10291280T DE10291280D2 (de) 2001-03-22 2002-03-16 Verfahren zur Herstellung einer kontaktlosen Chipkarte sowie entsprechend hergestellte Chipkarte
US10/472,688 US7229022B2 (en) 2001-03-22 2002-03-16 Method for producing a contactless chip card and chip card produced according to said method
AU2002250820A AU2002250820A1 (en) 2001-03-22 2002-03-16 Method for producing a contactless chip card and chip card produced according to said method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10114355.9 2001-03-22
DE10114355A DE10114355A1 (de) 2001-03-22 2001-03-22 Verfahren zur Herstellung einer kontaktlosen multifunktionalen Chipkarte sowie entsprechend hergestellte Chipkarte

Publications (2)

Publication Number Publication Date
WO2002077918A2 WO2002077918A2 (de) 2002-10-03
WO2002077918A3 true WO2002077918A3 (de) 2002-11-14

Family

ID=7678765

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2002/000949 WO2002077918A2 (de) 2001-03-22 2002-03-16 Verfahren zur herstellung einer kontaktlose chipkarte sowie entsprechend hergestellte chipkarte

Country Status (4)

Country Link
US (1) US7229022B2 (de)
AU (1) AU2002250820A1 (de)
DE (2) DE10114355A1 (de)
WO (1) WO2002077918A2 (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6772505B1 (en) * 2003-03-04 2004-08-10 The Goodyear Tire & Rubber Company Method of assembly an annular antenna to a transponder
JP2005135354A (ja) * 2003-10-08 2005-05-26 Toshiba Tec Corp 無線タグ読取り装置及びこの装置に使用する無線タグモジュール並びに無線タグ付き物品及びこの物品を収納する収納箱
JP2006031336A (ja) * 2004-07-15 2006-02-02 Fujitsu Ltd Ｒｆｉｄタグの製造方法
EP2039460A3 (de) * 2004-11-02 2014-07-02 HID Global GmbH Verlegevorrichtung, Kontaktiervorrichtung, Zustellsystem, Verlege- und Kontaktiereinheit, herstellungsanlage, Verfahren zur Herstellung und eine Transpondereinheit
EP1724712A1 (de) * 2005-05-11 2006-11-22 Stmicroelectronics Sa Micromodul, speziell für eine Smart Card
DE102006005909A1 (de) * 2006-02-09 2007-08-23 Karl Knauer Kg Produkt mit integriertem Transponder
DE102006012708A1 (de) * 2006-03-17 2007-09-20 Polyic Gmbh & Co. Kg Verfahren zur Herstellung eines aktiven oder passiven elektrischen Bauteils sowie elektrisches Bauteil
WO2008037592A1 (en) 2006-09-26 2008-04-03 Advanced Micromechanic And Automation Technology Ltd Method of connecting an antenna to a transponder chip and corresponding transponder inlay
US7971339B2 (en) * 2006-09-26 2011-07-05 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US20080179404A1 (en) * 2006-09-26 2008-07-31 Advanced Microelectronic And Automation Technology Ltd. Methods and apparatuses to produce inlays with transponders
US8286332B2 (en) * 2006-09-26 2012-10-16 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US7581308B2 (en) 2007-01-01 2009-09-01 Advanced Microelectronic And Automation Technology Ltd. Methods of connecting an antenna to a transponder chip
US7546671B2 (en) * 2006-09-26 2009-06-16 Micromechanic And Automation Technology Ltd. Method of forming an inlay substrate having an antenna wire
US8322624B2 (en) * 2007-04-10 2012-12-04 Feinics Amatech Teoranta Smart card with switchable matching antenna
US7979975B2 (en) * 2007-04-10 2011-07-19 Feinics Amatech Teavanta Methods of connecting an antenna to a transponder chip
US8608080B2 (en) * 2006-09-26 2013-12-17 Feinics Amatech Teoranta Inlays for security documents
US8240022B2 (en) * 2006-09-26 2012-08-14 Feinics Amatech Teorowita Methods of connecting an antenna to a transponder chip
DE102006057949A1 (de) * 2006-12-08 2008-06-12 Giesecke & Devrient Gmbh Herstellung kartenförmiger Datenträger
US7980477B2 (en) * 2007-05-17 2011-07-19 Féinics Amatech Teoranta Dual interface inlays
EP2034429A1 (de) * 2007-09-05 2009-03-11 Assa Abloy AB Herstellungsverfahren für eine Karte und mit diesem Verfahren hergestellte Karte
ES2355682T3 (es) * 2007-09-18 2011-03-30 Hid Global Ireland Teoranta Procedimiento para la unión de un conductor de cable dispuesto sobre un sustrato.
US8141786B2 (en) * 2008-01-18 2012-03-27 Texas Instruments Incorporated Thin smart card module having strap on carrier
DE102008046407B4 (de) * 2008-09-09 2015-12-03 Infineon Technologies Ag Datenträger für kontaktlose Datenübertragung und ein Verfahren zur Herstellung eines solchen Datenträgers
US8724340B2 (en) 2008-09-09 2014-05-13 Infineon Technologies Ag Data carrier for contactless data transmission and a method for producing such a data carrier
DE102009038620B4 (de) 2009-08-26 2012-05-24 Melzer Maschinenbau Gmbh Verfahren und Vorrichtung zur Herstellung einer Transpondereinheit
US8186603B2 (en) * 2009-09-22 2012-05-29 On Track Innovation Ltd. Contactless smart sticker
US8613132B2 (en) 2009-11-09 2013-12-24 Feinics Amatech Teoranta Transferring an antenna to an RFID inlay substrate
WO2011063270A1 (en) 2009-11-19 2011-05-26 Cubic Corporation Variable pitch mandrel wound antennas and systems and methods of making same
EP2567349B1 (de) * 2010-05-04 2014-11-12 Féinics AmaTech Teoranta Fertigung von rfid-einlagen
US8870080B2 (en) 2010-08-12 2014-10-28 Féinics Amatech Teoranta RFID antenna modules and methods
CN102653041A (zh) * 2011-03-04 2012-09-05 上海一芯智能科技有限公司 一种非接触智能卡天线焊接工艺
WO2013032921A1 (en) * 2011-08-26 2013-03-07 Identive Group, Inc. Card lamination
AU2013214133A1 (en) 2012-02-05 2014-07-31 Feinics Amatech Teoranta RFID antenna modules and methods
EP3005242A1 (de) 2013-05-28 2016-04-13 Féinics AmaTech Teoranta Antennenmodule für doppelschnittstellen-chipkarten, verstärkungsantennenkonfigurationen und verfahren

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19533983A1 (de) * 1995-09-14 1997-04-10 Wendisch Karl Heinz Chipkarte mit Antennenwicklung
WO1998045804A1 (de) * 1997-04-04 1998-10-15 Telbus Gesellschaft Für Elektronische Kommunikations-Systeme Mbh Chipkarte mit nietverbindung
FR2775810A1 (fr) * 1998-03-09 1999-09-10 Gemplus Card Int Procede de fabrication de cartes sans contact
FR2790849A1 (fr) * 1999-03-12 2000-09-15 Gemplus Card Int Procede de fabrication pour dispositif electronique du type carte sans contact

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4171477A (en) * 1976-03-16 1979-10-16 International Business Machines Corporation Micro-surface welding
DE4337921C2 (de) * 1993-11-06 1998-09-03 Ods Gmbh & Co Kg Kontaktlose Chipkarte mit Antennenspule
WO1996009175A1 (fr) * 1994-09-22 1996-03-28 Rohm Co., Ltd. Carte de ci du type sans contact et procede de fabrication de cette carte
DE19549431A1 (de) * 1995-09-14 1997-03-27 Wendisch Karl Heinz Chipträgerfolie für eine Chipkarte mit Antennenwicklung
US6036099A (en) * 1995-10-17 2000-03-14 Leighton; Keith Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom
JPH10320519A (ja) * 1997-05-19 1998-12-04 Rohm Co Ltd Ｉｃカード通信システムにおける応答器
FR2780551B1 (fr) * 1998-06-29 2001-09-07 Inside Technologies Micromodule electronique integre et procede de fabrication d'un tel micromodule
DE19846237A1 (de) * 1998-10-07 2000-04-13 Fraunhofer Ges Forschung Verfahren zur Herstellung eines Mikrotransponders
US5989994A (en) * 1998-12-29 1999-11-23 Advantest Corp. Method for producing contact structures
KR100309161B1 (ko) * 1999-10-11 2001-11-02 윤종용 메모리 카드 및 그 제조방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19533983A1 (de) * 1995-09-14 1997-04-10 Wendisch Karl Heinz Chipkarte mit Antennenwicklung
WO1998045804A1 (de) * 1997-04-04 1998-10-15 Telbus Gesellschaft Für Elektronische Kommunikations-Systeme Mbh Chipkarte mit nietverbindung
FR2775810A1 (fr) * 1998-03-09 1999-09-10 Gemplus Card Int Procede de fabrication de cartes sans contact
FR2790849A1 (fr) * 1999-03-12 2000-09-15 Gemplus Card Int Procede de fabrication pour dispositif electronique du type carte sans contact

Also Published As

Publication number Publication date
US20040155114A1 (en) 2004-08-12
AU2002250820A1 (en) 2002-10-08
DE10291280D2 (de) 2004-04-15
US7229022B2 (en) 2007-06-12
DE10114355A1 (de) 2002-10-17
WO2002077918A2 (de) 2002-10-03

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