WO2002078083A3 - In-street integrated circuit wafer via - Google Patents
In-street integrated circuit wafer via Download PDFInfo
- Publication number
- WO2002078083A3 WO2002078083A3 PCT/US2002/008540 US0208540W WO02078083A3 WO 2002078083 A3 WO2002078083 A3 WO 2002078083A3 US 0208540 W US0208540 W US 0208540W WO 02078083 A3 WO02078083 A3 WO 02078083A3
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- WO
- WIPO (PCT)
- Prior art keywords
- integrated circuit
- saw
- lines
- holes
- wafer
- Prior art date
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Wire Bonding (AREA)
- Dicing (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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AU2002247383A AU2002247383A1 (en) | 2001-03-27 | 2002-03-19 | In-street integrated circuit wafer via |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/819,181 | 2001-03-27 | ||
US09/819,181 US6910268B2 (en) | 2001-03-27 | 2001-03-27 | Method for fabricating an IC interconnect system including an in-street integrated circuit wafer via |
Publications (2)
Publication Number | Publication Date |
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WO2002078083A2 WO2002078083A2 (en) | 2002-10-03 |
WO2002078083A3 true WO2002078083A3 (en) | 2003-03-20 |
Family
ID=25227416
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/US2002/008540 WO2002078083A2 (en) | 2001-03-27 | 2002-03-19 | In-street integrated circuit wafer via |
Country Status (4)
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US (1) | US6910268B2 (en) |
AU (1) | AU2002247383A1 (en) |
TW (1) | TW538510B (en) |
WO (1) | WO2002078083A2 (en) |
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Also Published As
Publication number | Publication date |
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US6910268B2 (en) | 2005-06-28 |
WO2002078083A2 (en) | 2002-10-03 |
TW538510B (en) | 2003-06-21 |
AU2002247383A1 (en) | 2002-10-08 |
US20020139577A1 (en) | 2002-10-03 |
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