WO2002079338A3 - Thermosetting adhesive - Google Patents

Thermosetting adhesive Download PDF

Info

Publication number
WO2002079338A3
WO2002079338A3 PCT/US2002/008802 US0208802W WO02079338A3 WO 2002079338 A3 WO2002079338 A3 WO 2002079338A3 US 0208802 W US0208802 W US 0208802W WO 02079338 A3 WO02079338 A3 WO 02079338A3
Authority
WO
WIPO (PCT)
Prior art keywords
thermosetting adhesive
glycidyl
meth
ethylene
acrylate
Prior art date
Application number
PCT/US2002/008802
Other languages
French (fr)
Other versions
WO2002079338A2 (en
Inventor
Masaaki Takeda
Kohichiro Kawate
Shigeyoshi Ishii
Naoyuki Toriumi
Koji Itoh
Tomihiro Hara
Original Assignee
3M Innovative Properties Co
Masaaki Takeda
Kohichiro Kawate
Shigeyoshi Ishii
Naoyuki Toriumi
Koji Itoh
Tomihiro Hara
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co, Masaaki Takeda, Kohichiro Kawate, Shigeyoshi Ishii, Naoyuki Toriumi, Koji Itoh, Tomihiro Hara filed Critical 3M Innovative Properties Co
Priority to AU2002247396A priority Critical patent/AU2002247396A1/en
Priority to KR10-2003-7012457A priority patent/KR20040030545A/en
Priority to EP02715180A priority patent/EP1373427A2/en
Priority to US10/470,875 priority patent/US20040063804A1/en
Publication of WO2002079338A2 publication Critical patent/WO2002079338A2/en
Publication of WO2002079338A3 publication Critical patent/WO2002079338A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04—Homopolymers or copolymers of ethene
    • C09J123/08—Copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/687—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37—Thiols
    • C08K5/375—Thiols containing six-membered aromatic rings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C08L23/0869—Acids or derivatives thereof
    • C08L23/0884—Epoxide containing esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/28—Non-macromolecular organic substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

Abstract

A thermosetting adhesive which produces no foul odor or discharged gas, or form no bubbles under irradiation, and which exhibits a satisfactorily high bonding property, even under low-dose irradiation. The thermosetting adhesive contains an ethylene-glycidyl (meth)acrylate copolymer, whose principal monomer components are an ethylene and a glycidyl (meth)acrylate, and a sulphonium salt-comprising cationic polymerization catalyst.
PCT/US2002/008802 2001-03-30 2002-03-21 Thermosetting adhesive WO2002079338A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
AU2002247396A AU2002247396A1 (en) 2001-03-30 2002-03-21 Thermosetting adhesive
KR10-2003-7012457A KR20040030545A (en) 2001-03-30 2002-03-21 Thermosetting Adhesive
EP02715180A EP1373427A2 (en) 2001-03-30 2002-03-21 Thermosetting adhesive
US10/470,875 US20040063804A1 (en) 2001-03-30 2002-03-21 Thermosetting adhesive

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001100609A JP2002294196A (en) 2001-03-30 2001-03-30 Thermosetting adhesive
JP100609/2001 2001-03-30

Publications (2)

Publication Number Publication Date
WO2002079338A2 WO2002079338A2 (en) 2002-10-10
WO2002079338A3 true WO2002079338A3 (en) 2002-11-28

Family

ID=18954038

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/008802 WO2002079338A2 (en) 2001-03-30 2002-03-21 Thermosetting adhesive

Country Status (6)

Country Link
EP (1) EP1373427A2 (en)
JP (1) JP2002294196A (en)
KR (1) KR20040030545A (en)
CN (1) CN1500127A (en)
AU (1) AU2002247396A1 (en)
WO (1) WO2002079338A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1439028A (en) * 2000-06-28 2003-08-27 住友化学工业株式会社 Insulating resin composition, adhesive resin composition and adhesive sheeting
US7358408B2 (en) 2003-05-16 2008-04-15 Az Electronic Materials Usa Corp. Photoactive compounds
US20070023141A1 (en) * 2005-07-29 2007-02-01 Tyco Electronics Corporation Hot melt adhesive for PTFE
KR101388519B1 (en) * 2007-07-23 2014-04-24 주식회사 동진쎄미켐 Method Of Fabricating Thin Film Transistor Substrate And Photosensitive Resin Composition Used To The Same
EP2874280A1 (en) * 2013-11-14 2015-05-20 Siemens Aktiengesellschaft Groove closure mass, groove closure and method for producing a groove closure
TWI799557B (en) * 2018-03-28 2023-04-21 日商琳得科股份有限公司 Resin composition, sealing sheet and sealing body

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0555058A1 (en) * 1992-02-07 1993-08-11 Toyo Ink Manufacturing Co., Ltd. (Oxo)sulfonium complex, polymerizable composition containing the complex, and method of polymerizing composition
WO2000000566A1 (en) * 1998-06-29 2000-01-06 Minnesota Mining And Manufacturing Company Hot-melt adhesive composition, heat-bonding film adhesive and adhering method using hot-melt adhesive composition
US6057382A (en) * 1998-05-01 2000-05-02 3M Innovative Properties Company Epoxy/thermoplastic photocurable adhesive composition

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0555058A1 (en) * 1992-02-07 1993-08-11 Toyo Ink Manufacturing Co., Ltd. (Oxo)sulfonium complex, polymerizable composition containing the complex, and method of polymerizing composition
US6057382A (en) * 1998-05-01 2000-05-02 3M Innovative Properties Company Epoxy/thermoplastic photocurable adhesive composition
WO2000000566A1 (en) * 1998-06-29 2000-01-06 Minnesota Mining And Manufacturing Company Hot-melt adhesive composition, heat-bonding film adhesive and adhering method using hot-melt adhesive composition

Also Published As

Publication number Publication date
WO2002079338A2 (en) 2002-10-10
CN1500127A (en) 2004-05-26
AU2002247396A1 (en) 2002-10-15
EP1373427A2 (en) 2004-01-02
KR20040030545A (en) 2004-04-09
JP2002294196A (en) 2002-10-09

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