WO2002084340B1 - Microlens for projection lithography and method of preparation thereof - Google Patents

Microlens for projection lithography and method of preparation thereof

Info

Publication number
WO2002084340B1
WO2002084340B1 PCT/US2002/011623 US0211623W WO02084340B1 WO 2002084340 B1 WO2002084340 B1 WO 2002084340B1 US 0211623 W US0211623 W US 0211623W WO 02084340 B1 WO02084340 B1 WO 02084340B1
Authority
WO
WIPO (PCT)
Prior art keywords
optical component
substrate
pattern
distance
image
Prior art date
Application number
PCT/US2002/011623
Other languages
French (fr)
Other versions
WO2002084340A1 (en
Inventor
Ming-Hsien Wu
George M Whitesides
Kateri E Paul
Original Assignee
Harvard College
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harvard College filed Critical Harvard College
Priority to DE60228943T priority Critical patent/DE60228943D1/en
Priority to EP02728760A priority patent/EP1377853B1/en
Publication of WO2002084340A1 publication Critical patent/WO2002084340A1/en
Publication of WO2002084340B1 publication Critical patent/WO2002084340B1/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0012—Arrays characterised by the manufacturing method
    • G02B3/0031—Replication or moulding, e.g. hot embossing, UV-casting, injection moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/002—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of materials engineered to provide properties not available in nature, e.g. metamaterials
    • G02B1/005—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of materials engineered to provide properties not available in nature, e.g. metamaterials made of photonic crystals or photonic band gap materials
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0012—Arrays characterised by the manufacturing method
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0012—Arrays characterised by the manufacturing method
    • G02B3/0018—Reflow, i.e. characterized by the step of melting microstructures to form curved surfaces, e.g. manufacturing of moulds and surfaces for transfer etching
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0056—Arrays characterized by the distribution or form of lenses arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/027—Mountings, adjusting means, or light-tight connections, for optical elements for lenses the lens being in the form of a sphere or ball
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems

Abstract

Methods and systems for effecting responses on surfaces utilizing microlens arrays including microoptical components embedded or supported by support element and positioned from the surface at a distance essentially equal to the image distance of the microoptical component with spacer elements are disclosed. Microlens arrays can be used to manipulate incident energy or radiation having a distribution in characteristic property(s) defining an object pattern to form a corresponding image pattern on a substrate surface. The energy can be light having a pattern or a specific wavelength, intensity or polarization or coherence alignment. The image pattern can have features of order 100 nn in size or less produced from corresponding object patterns having features in the order millimeters. The size of the object pattern can be reduced by the microlens arrays described by a factor of 100 or more using a single step process to form the image patterns.

Claims

68
AMENDED CLAIMS
[received by the International Bureau on 10 December 2002 (10.12.02); original claims 45-61 and 110-123 amended; remaining claims unchanged (4 pages)] providing a spacing element associated with the flexible support element, the spacing element sized to displace the optical component from an image surface by a distance essentially equal to the image distance of the optical component.
45. A device comprising an optical component supported by a flexible support element and positioned at a distance from a surface of the flexible support element that is essentially equal to the image distance of the optical component.
46. The device as in claim 45, wherein the flexible support element is optically transparent.
47. A method comprising embedding an optical component within a flexible support element such that a distance between the optical component and a surface of the flexible support element is essentially equal to the image distance of the optical component.
48. A method for inducing a response on a substrate comprising projecting a pattern of electromagnetic radiation through a device positioned adjacent a surface of the substrate, the device comprising an optical component embedded within a flexible support element and positioned from the surface of the substrate at a distance essentially equal to the image distance of the optical component.
49. The method as in claim 48, wherein the device is a microlens array.
50. The method as in claim 48, further comprising controlling at least one of a spatial distribution of intensity, a spatial distribution of wavelength, a spatial distribution of polarization, and a spatial distribution of coherence of the electromagnetic radiation.
51. A method for inducing a response on a substrate comprising projecting electromagnetic radiation through a device positioned on a surface of the substrate, the device comprising an optical component supported by a flexible support element and positioned from the substrate by a distance essentially equal to the image distance of the optical component. 69
52. The method as in claim 51, wherein the device is a microlens array.
53. The method as in claim 51, further comprising controlling at least one of a spatial distribution of intensity, a spatial distribution of wavelength, a spatial distribution of polarization, and a spatial distribution of coherence of the electromagnetic radiation.
54. A method for creating an image of a pattern on a surface of a substrate comprising projecting a pattern of electromagnetic radiation through a device comprising an optical component associated with a flexible support element to create an image of the pattern on the surface of the substrate, wherein a feature of the image is at least 100 times smaller than a corresponding feature of the pattern.
55. The method as in claim 54, wherein the device comprises a microlens array.
56. The method as in claim 54, wherein the feature of the image is at least 1000 times smaller than the corresponding feature of the pattern.
57. The method as in claim 54, further comprising the step of positioning the optical component from the surface by a distance that is essentially equal to the image distance of the optical component.
58. The method as in claim 54, wherein a spacing element is used to position the optical component.
59. The method as in claim 54, wherein the projected electromagnetic radiation effects a response that topographically alters the substrate.
60. The method as in claim 54, wherein the pattern is a three dimensional structure.
61. The method as in claim 54, wherein the pattern has a cone shape. 70
110. The method as in claim 96, wherein the pattern produced on the surface renders the surface frequency selective surface to radiation incident thereon.
111. The method as in claim 110, wherein the pattern produced on the surface comprises an optical grating.
112. The method as in claim 96, wherein the surface is essentially transparent to electromagnetic radiation of at least one wavelength and is rigid.
1 13. The method as in claim 96, wherein the surface comprises an elastomeric material.
114. A method comprising disposing at least one optical component to a transparent layer having a maximum thickness, the layer forming a flexible spacer between the optical component and a substrate in contact with the transparent layer, wherein the maximum thickness is essentially equal to an image distance of the optical component.
115. A method comprising: positioning in contact with a substrate at least one transparent microlens affixed to a transparent layer having a maximum thickness forming a spacer between the microlens and the substrate in contact with the transparent layer essentially equal to a focal length of the microlens; and projecting an image through a mask having a pattern thereon and onto the microlens to create a structure on the substrate.
116. A system comprising: a microlens comprising at least one light-focusing component associated with a flexible transparent layer such that the component is spaced apart from a plane defined by a surface of the layer by a distance essentially equal to an image distance of the light- focusing component; an electromagnetic radiation projector positioned at a predetermined distance from a mask having a pattern thereon, which mask is positioned at a predetermined distance from the microlens; and 71
a substrate positioned against the surface of the layer.
117. A method comprising: providing a microlens that comprises at least one optical component associated with a flexible transparent membrane; positioning a surface of a substrate to be imaged in contact with a surface of the membrane so that the smallest distance separating the optical component from the surface of the substrate is essentially equal to the image distance of the optical component; and projecting an image of a pattern through the optical component and onto the surface of the substrate.
118. A method comprising projecting a pattern of an energy beam through a device positioned adjacent a surface of a substrate, the device comprising at least one optical component supported by a support element, wherein the electromagnetic radiation has a specific wavelength.
119. The method as in claim 118, further comprising the step of projecting a second pattern of a second energy beam through the device.
120. The method as in claim 119, wherein the second energy beam has a second specific wavelength.
121. The method as in claim 118, further comprising the step of repeating the projecting step using a second pattern and a second specific wavelength.
122. The method as in claim 118, wherein the optical component comprises a photosensitive material.
123. The method as in claim 118, wherein the surface of the substrate is a surface of the optical component.
PCT/US2002/011623 2001-04-10 2002-04-10 Microlens for projection lithography and method of preparation thereof WO2002084340A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE60228943T DE60228943D1 (en) 2001-04-10 2002-04-10 MICROLINS FOR PROJECTION SLITHOGRAPHY AND ITS PRODUCTION PROCESS
EP02728760A EP1377853B1 (en) 2001-04-10 2002-04-10 Microlens for projection lithography and method of preparation thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US28310201P 2001-04-10 2001-04-10
US60/283,102 2001-04-10

Publications (2)

Publication Number Publication Date
WO2002084340A1 WO2002084340A1 (en) 2002-10-24
WO2002084340B1 true WO2002084340B1 (en) 2003-04-03

Family

ID=23084524

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/011623 WO2002084340A1 (en) 2001-04-10 2002-04-10 Microlens for projection lithography and method of preparation thereof

Country Status (5)

Country Link
US (2) US7057832B2 (en)
EP (1) EP1377853B1 (en)
AT (1) ATE408850T1 (en)
DE (1) DE60228943D1 (en)
WO (1) WO2002084340A1 (en)

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EP1377853A1 (en) 2004-01-07
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US7057832B2 (en) 2006-06-06
US7403338B2 (en) 2008-07-22

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