WO2002093996A1 - Manufacture of electronics enclosure having a metallized shielding layer - Google Patents
Manufacture of electronics enclosure having a metallized shielding layer Download PDFInfo
- Publication number
- WO2002093996A1 WO2002093996A1 PCT/US2002/012908 US0212908W WO02093996A1 WO 2002093996 A1 WO2002093996 A1 WO 2002093996A1 US 0212908 W US0212908 W US 0212908W WO 02093996 A1 WO02093996 A1 WO 02093996A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- feed material
- enclosure part
- shielding layer
- interior surface
- enclosure
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
- C23C4/06—Metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
- C23C4/123—Spraying molten metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
- C23C4/131—Wire arc spraying
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0015—Gaskets or seals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0045—Casings being rigid plastic containers having a coating of shielding material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BR0208927-0A BR0208927A (en) | 2001-05-10 | 2002-04-23 | Fabrication of electronics components that have a metallic shield layer |
EP02723950A EP1386527A1 (en) | 2001-05-10 | 2002-04-23 | Manufacture of electronics enclosure having a metallized shielding layer |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US28992001P | 2001-05-10 | 2001-05-10 | |
US60/289,920 | 2001-05-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2002093996A1 true WO2002093996A1 (en) | 2002-11-21 |
Family
ID=23113733
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2002/012908 WO2002093996A1 (en) | 2001-05-10 | 2002-04-23 | Manufacture of electronics enclosure having a metallized shielding layer |
Country Status (4)
Country | Link |
---|---|
US (1) | US6763576B2 (en) |
EP (1) | EP1386527A1 (en) |
BR (1) | BR0208927A (en) |
WO (1) | WO2002093996A1 (en) |
Families Citing this family (43)
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US20060250782A1 (en) * | 2005-05-09 | 2006-11-09 | Delta Electronics, Inc. | Packaging process and structure of electronic device |
US20070069613A1 (en) * | 2005-09-29 | 2007-03-29 | Alexander Dinota | Outdoor base station housing assembly |
US7491899B2 (en) * | 2005-10-06 | 2009-02-17 | Laird Technologies, Inc. | EMI shields and related manufacturing methods |
US7994372B2 (en) * | 2005-10-31 | 2011-08-09 | Specialty Coating Systems, Inc. | Parylene variants and methods of synthesis and use |
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US20080225504A1 (en) * | 2007-03-14 | 2008-09-18 | Chichernea Virgil A | Lightweight electromagnetic interference shielding for automotive igniters |
US7504592B1 (en) | 2007-08-31 | 2009-03-17 | Laird Technologies, Inc. | Electromagnetic interference shields and related manufacturing methods |
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US8173911B2 (en) * | 2008-11-26 | 2012-05-08 | Flir Systems, Inc. | Electronic package |
WO2010144770A1 (en) * | 2009-06-12 | 2010-12-16 | Lord Corporation | Method for shielding a substrate from electromagnetic interference |
CN104988447A (en) * | 2010-02-01 | 2015-10-21 | 科卢斯博知识产权有限公司 | Nickel based thermal spray powder and coating, and method for making the same |
US9075576B2 (en) | 2010-02-25 | 2015-07-07 | Blackberry Limited | Keypads for mobile devices and method of manufacturing the same |
US8884779B2 (en) | 2011-06-24 | 2014-11-11 | Medtronic, Inc. | EMI shield for medical device telemetry antenna |
KR102159690B1 (en) * | 2012-10-04 | 2020-09-24 | 쳄링 센서스 앤드 일렉트로닉 시스템스 인코포레이트 | Shieldings for metal detector heads and manufacturing methods thereof |
US9721772B2 (en) * | 2013-01-25 | 2017-08-01 | General Electric Company | Ion chamber enclosure material to increase gamma radiation sensitivity |
US9249602B1 (en) * | 2013-10-15 | 2016-02-02 | Elana Greer | Key with integrated attachment device |
WO2017001888A1 (en) | 2015-06-29 | 2017-01-05 | Bosch Car Multimedia Portugal, S.A. | Conductive polymeric housing for electronic component |
CA3006855A1 (en) | 2015-11-22 | 2017-05-26 | Atmospheric Plasma Solutions, Inc. | Method and device for promoting adhesion of metallic surfaces |
JP2017188597A (en) * | 2016-04-07 | 2017-10-12 | アズビル株式会社 | Board unit and manufacturing method of board unit |
GB2561552A (en) * | 2017-04-11 | 2018-10-24 | Little Linda | Mobile mobility |
WO2019070296A1 (en) * | 2017-10-06 | 2019-04-11 | Hewlett-Packard Development Company, L.P. | Radio-frequency absorption in electronic devices |
EP3550632B1 (en) * | 2018-04-05 | 2021-10-20 | Autoneum Management AG | Upper covering part forming a lid for battery housing for an electric vehicle |
CN110331361A (en) * | 2019-08-21 | 2019-10-15 | Oppo(重庆)智能科技有限公司 | Anti- electromagnetic interference matrix and preparation method thereof and electronic equipment |
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-
2002
- 2002-04-23 WO PCT/US2002/012908 patent/WO2002093996A1/en not_active Application Discontinuation
- 2002-04-23 EP EP02723950A patent/EP1386527A1/en not_active Withdrawn
- 2002-04-23 BR BR0208927-0A patent/BR0208927A/en not_active Application Discontinuation
- 2002-05-01 US US10/137,229 patent/US6763576B2/en not_active Expired - Lifetime
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4578310A (en) * | 1985-07-22 | 1986-03-25 | Michael Landey | Method of producing adherent metallic film |
DE4205803A1 (en) * | 1992-02-26 | 1993-09-02 | Deutsche Aerospace | Electromagnetic compatible chamber - comprises inner walls coated with resistance material |
US5559677A (en) * | 1994-04-29 | 1996-09-24 | Motorola, Inc. | Method of forming a device by selectively thermal spraying a metallic conductive material thereon |
US6001426A (en) * | 1996-07-25 | 1999-12-14 | Utron Inc. | High velocity pulsed wire-arc spray |
US6110537A (en) * | 1996-11-15 | 2000-08-29 | Honeywell Inc. | Coating integrated circuits using thermal spray |
GB2320929A (en) * | 1997-01-02 | 1998-07-08 | Gen Electric | Electric arc spray process for applying a heat transfer enhancement metallic coating |
WO2000029635A2 (en) * | 1998-11-13 | 2000-05-25 | Thermoceramix, L.L.C. | System and method for applying a metal layer to a substrate |
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Title |
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JACKMAN J L: "EMI SHIELDING TECHNIQUES FOR PLASTIC PACKAGING", ACM. PROCEEDINGS OF THE ANNUAL CONFERENCE, XX, XX, 1984, pages 1 - 5, XP000892291 * |
Also Published As
Publication number | Publication date |
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US6763576B2 (en) | 2004-07-20 |
BR0208927A (en) | 2004-04-27 |
EP1386527A1 (en) | 2004-02-04 |
US20020166682A1 (en) | 2002-11-14 |
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