WO2002102549A1 - Feedforward and feedback control for conditioning of chemical mechanical polishing pad - Google Patents
Feedforward and feedback control for conditioning of chemical mechanical polishing pad Download PDFInfo
- Publication number
- WO2002102549A1 WO2002102549A1 PCT/US2002/019062 US0219062W WO02102549A1 WO 2002102549 A1 WO2002102549 A1 WO 2002102549A1 US 0219062 W US0219062 W US 0219062W WO 02102549 A1 WO02102549 A1 WO 02102549A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- conditioning
- pad
- material removal
- removal rate
- wafer
- Prior art date
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/03—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent according to the final size of the previously ground workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/18—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the presence of dressing tools
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/19—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by positioning or contouring control systems, e.g. to control position from one programmed point to another or to control movement along a programmed continuous path
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
- G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32053—Adjust work parameter as function of other cell
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32065—Synchronise set points of processes
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45031—Manufacturing semiconductor wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
- H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P80/00—Climate change mitigation technologies for sector-wide applications
- Y02P80/40—Minimising material used in manufacturing processes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02746548A EP1399295A1 (en) | 2001-06-19 | 2002-06-17 | Feedforward and feedback control for conditioning of chemical mechanical polishing pad |
JP2003505116A JP2005518285A (en) | 2001-06-19 | 2002-06-17 | Feedforward and feedback control for conditioning chemical mechanical polishing pads |
KR1020037016638A KR100904866B1 (en) | 2001-06-19 | 2002-06-17 | A computer implemented method for conditioning, conditioning apparatus and computer-readable medium |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29887801P | 2001-06-19 | 2001-06-19 | |
US60/298,878 | 2001-06-19 | ||
US30578201P | 2001-07-16 | 2001-07-16 | |
US60/305,782 | 2001-07-16 | ||
US31874101P | 2001-09-12 | 2001-09-12 | |
US60/318,741 | 2001-09-12 | ||
US09/998,384 US7101799B2 (en) | 2001-06-19 | 2001-11-30 | Feedforward and feedback control for conditioning of chemical mechanical polishing pad |
US09/998,384 | 2001-11-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2002102549A1 true WO2002102549A1 (en) | 2002-12-27 |
Family
ID=27501749
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2002/019062 WO2002102549A1 (en) | 2001-06-19 | 2002-06-17 | Feedforward and feedback control for conditioning of chemical mechanical polishing pad |
Country Status (6)
Country | Link |
---|---|
US (2) | US7101799B2 (en) |
EP (1) | EP1399295A1 (en) |
JP (1) | JP2005518285A (en) |
KR (1) | KR100904866B1 (en) |
CN (1) | CN1535196A (en) |
WO (1) | WO2002102549A1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2004087375A1 (en) * | 2003-03-25 | 2004-10-14 | Neopad Technologies Corporation | Chip customized polish pads for chemical mechanical planarization (cmp) |
CN1301184C (en) * | 2003-12-16 | 2007-02-21 | 汪开庆 | Optical grinding machine and method for processing sapphire crystal substrate for semiconductor use |
US8655478B2 (en) | 2008-09-26 | 2014-02-18 | Ebara Corporation | Dressing method, method of determining dressing conditions, program for determining dressing conditions, and polishing apparatus |
EP2035187A4 (en) * | 2006-06-28 | 2015-09-09 | 3M Innovative Properties Co | Abrasive articles, cmp monitoring system and method |
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US7160739B2 (en) | 2001-06-19 | 2007-01-09 | Applied Materials, Inc. | Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles |
US6660637B2 (en) * | 2001-09-28 | 2003-12-09 | Infineon Technologies Ag | Process for chemical mechanical polishing |
US7175503B2 (en) | 2002-02-04 | 2007-02-13 | Kla-Tencor Technologies Corp. | Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device |
US20030199112A1 (en) | 2002-03-22 | 2003-10-23 | Applied Materials, Inc. | Copper wiring module control |
US7131891B2 (en) * | 2003-04-28 | 2006-11-07 | Micron Technology, Inc. | Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces |
DE102004024737A1 (en) * | 2004-05-19 | 2005-12-15 | Voith Paper Patent Gmbh | production optimization |
US7477958B2 (en) * | 2005-05-11 | 2009-01-13 | International Business Machines Corporation | Method of release and product flow management for a manufacturing facility |
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TWI287483B (en) * | 2005-12-23 | 2007-10-01 | Ind Tech Res Inst | A removal rate estimating method of a chemical mechanical polishing process under mixed products or mixed layers |
US7366575B2 (en) * | 2005-12-30 | 2008-04-29 | Intel Corporation | Wafer polishing control |
WO2007082556A1 (en) * | 2006-01-23 | 2007-07-26 | Freescale Semiconductor, Inc. | Method and apparatus for conditioning a cmp pad |
US7451122B2 (en) * | 2006-03-29 | 2008-11-11 | Honeywell International Inc. | Empirical design of experiments using neural network models |
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US7899571B2 (en) * | 2008-11-05 | 2011-03-01 | Texas Instruments Incorporated | Predictive method to improve within wafer CMP uniformity through optimized pad conditioning |
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KR101956838B1 (en) * | 2009-11-03 | 2019-03-11 | 어플라이드 머티어리얼스, 인코포레이티드 | Endpoint method using peak location of spectra contour plots versus time |
TWI381904B (en) * | 2009-12-03 | 2013-01-11 | Nat Univ Chung Cheng | The method of detecting the grinding characteristics and service life of the polishing pad |
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JP2013525126A (en) * | 2010-04-20 | 2013-06-20 | アプライド マテリアルズ インコーポレイテッド | Closed loop control for improved polishing pad profile |
KR20130059312A (en) * | 2010-04-30 | 2013-06-05 | 어플라이드 머티어리얼스, 인코포레이티드 | Pad conditioning sweep torque modeling to achieve constant removal rate |
US8758085B2 (en) * | 2010-10-21 | 2014-06-24 | Applied Materials, Inc. | Method for compensation of variability in chemical mechanical polishing consumables |
US20120270477A1 (en) * | 2011-04-22 | 2012-10-25 | Nangoy Roy C | Measurement of pad thickness and control of conditioning |
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US9289875B2 (en) * | 2012-04-25 | 2016-03-22 | Applied Materials, Inc. | Feed forward and feed-back techniques for in-situ process control |
JP6193623B2 (en) * | 2012-06-13 | 2017-09-06 | 株式会社荏原製作所 | Polishing method and polishing apparatus |
JP2014053505A (en) * | 2012-09-07 | 2014-03-20 | Toshiba Corp | Semiconductor device manufacturing method, semiconductor wafer and semiconductor device manufacturing apparatus |
JP5964262B2 (en) * | 2013-02-25 | 2016-08-03 | 株式会社荏原製作所 | Method for adjusting profile of polishing member used in polishing apparatus, and polishing apparatus |
US9286930B2 (en) * | 2013-09-04 | 2016-03-15 | Seagate Technology Llc | In-situ lapping plate mapping device |
KR101916211B1 (en) * | 2015-12-07 | 2018-11-07 | 주식회사 케이씨텍 | Chemical mechanical polishing apparatus and method |
US10312128B2 (en) * | 2015-12-31 | 2019-06-04 | Taiwan Semiconductor Manufacturing Company Ltd. | Chemical-mechanical polish (CMP) devices, tools, and methods |
CN107633103A (en) * | 2016-07-15 | 2018-01-26 | 中国科学院微电子研究所 | A kind of CMP model parameter optimization method and device |
CN106323152B (en) * | 2016-09-05 | 2018-10-02 | 清华大学 | The offline segment processing method and processing system of CMP metal film thickness measurement data |
CN107234495B (en) * | 2017-07-24 | 2019-01-29 | 黄亦翔 | Establish the method for average material removal rate prediction model and the method for predicted velocity |
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US11389928B2 (en) * | 2017-11-30 | 2022-07-19 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for conditioning polishing pad |
US11511381B2 (en) * | 2018-08-29 | 2022-11-29 | Illinois Tool Works Inc. | Movement control of material removal systems |
US10916503B2 (en) | 2018-09-11 | 2021-02-09 | International Business Machines Corporation | Back end of line metallization structure |
US20200130136A1 (en) * | 2018-10-29 | 2020-04-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical mechanical polishing apparatus and method |
CN113574474A (en) * | 2019-03-15 | 2021-10-29 | 3M创新有限公司 | Polishing semiconductor wafers using causal models |
CN113263436B (en) * | 2020-05-29 | 2022-08-30 | 台湾积体电路制造股份有限公司 | Chemical mechanical polishing system and method of use |
US11794305B2 (en) | 2020-09-28 | 2023-10-24 | Applied Materials, Inc. | Platen surface modification and high-performance pad conditioning to improve CMP performance |
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US8965555B2 (en) | 2008-09-26 | 2015-02-24 | Ebara Corporation | Dressing method, method of determining dressing conditions, program for determining dressing conditions, and polishing apparatus |
Also Published As
Publication number | Publication date |
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US7413986B2 (en) | 2008-08-19 |
EP1399295A1 (en) | 2004-03-24 |
US20060009129A1 (en) | 2006-01-12 |
CN1535196A (en) | 2004-10-06 |
US20030027424A1 (en) | 2003-02-06 |
US7101799B2 (en) | 2006-09-05 |
KR100904866B1 (en) | 2009-06-26 |
JP2005518285A (en) | 2005-06-23 |
KR20040010753A (en) | 2004-01-31 |
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