WO2003008140A3 - Apparatus for processing a workpiece - Google Patents
Apparatus for processing a workpiece Download PDFInfo
- Publication number
- WO2003008140A3 WO2003008140A3 PCT/US2002/023297 US0223297W WO03008140A3 WO 2003008140 A3 WO2003008140 A3 WO 2003008140A3 US 0223297 W US0223297 W US 0223297W WO 03008140 A3 WO03008140 A3 WO 03008140A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- workpiece
- head
- liquid
- processing
- rotors
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2002322587A AU2002322587A1 (en) | 2001-07-16 | 2002-07-10 | Apparatus for processing a workpiece |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/907,552 US6492284B2 (en) | 1999-01-22 | 2001-07-16 | Reactor for processing a workpiece using sonic energy |
US09/907,522 | 2001-07-16 | ||
US09/907,552 | 2001-07-16 | ||
US09/907,522 US6680253B2 (en) | 1999-01-22 | 2001-07-16 | Apparatus for processing a workpiece |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2003008140A2 WO2003008140A2 (en) | 2003-01-30 |
WO2003008140A3 true WO2003008140A3 (en) | 2003-11-06 |
Family
ID=27129490
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2002/023297 WO2003008140A2 (en) | 2001-07-16 | 2002-07-10 | Apparatus for processing a workpiece |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU2002322587A1 (en) |
TW (1) | TW559571B (en) |
WO (1) | WO2003008140A2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8500968B2 (en) * | 2010-08-13 | 2013-08-06 | Applied Materials, Inc. | Deplating contacts in an electrochemical plating apparatus |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3727620A (en) * | 1970-03-18 | 1973-04-17 | Fluoroware Of California Inc | Rinsing and drying device |
US4132567A (en) * | 1977-10-13 | 1979-01-02 | Fsi Corporation | Apparatus for and method of cleaning and removing static charges from substrates |
JPS59208831A (en) * | 1983-05-13 | 1984-11-27 | Hitachi Tokyo Electronics Co Ltd | Applicator |
US4750505A (en) * | 1985-04-26 | 1988-06-14 | Dainippon Screen Mfg. Co., Ltd. | Apparatus for processing wafers and the like |
JPS63185029A (en) * | 1987-01-28 | 1988-07-30 | Hitachi Ltd | Wafer treatment apparatus |
US4903717A (en) * | 1987-11-09 | 1990-02-27 | Sez Semiconductor-Equipment Zubehoer Fuer die Halbleiterfertigung Gesellschaft m.b.H | Support for slice-shaped articles and device for etching silicon wafers with such a support |
US5168886A (en) * | 1988-05-25 | 1992-12-08 | Semitool, Inc. | Single wafer processor |
US5222310A (en) * | 1990-05-18 | 1993-06-29 | Semitool, Inc. | Single wafer processor with a frame |
US5591262A (en) * | 1994-03-24 | 1997-01-07 | Tazmo Co., Ltd. | Rotary chemical treater having stationary cleaning fluid nozzle |
-
2002
- 2002-07-10 WO PCT/US2002/023297 patent/WO2003008140A2/en not_active Application Discontinuation
- 2002-07-10 AU AU2002322587A patent/AU2002322587A1/en not_active Abandoned
- 2002-07-16 TW TW91115829A patent/TW559571B/en not_active IP Right Cessation
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3727620A (en) * | 1970-03-18 | 1973-04-17 | Fluoroware Of California Inc | Rinsing and drying device |
US4132567A (en) * | 1977-10-13 | 1979-01-02 | Fsi Corporation | Apparatus for and method of cleaning and removing static charges from substrates |
JPS59208831A (en) * | 1983-05-13 | 1984-11-27 | Hitachi Tokyo Electronics Co Ltd | Applicator |
US4750505A (en) * | 1985-04-26 | 1988-06-14 | Dainippon Screen Mfg. Co., Ltd. | Apparatus for processing wafers and the like |
JPS63185029A (en) * | 1987-01-28 | 1988-07-30 | Hitachi Ltd | Wafer treatment apparatus |
US4903717A (en) * | 1987-11-09 | 1990-02-27 | Sez Semiconductor-Equipment Zubehoer Fuer die Halbleiterfertigung Gesellschaft m.b.H | Support for slice-shaped articles and device for etching silicon wafers with such a support |
US5168886A (en) * | 1988-05-25 | 1992-12-08 | Semitool, Inc. | Single wafer processor |
US5222310A (en) * | 1990-05-18 | 1993-06-29 | Semitool, Inc. | Single wafer processor with a frame |
US5445172A (en) * | 1990-05-18 | 1995-08-29 | Semitool, Inc. | Wafer holder with flexibly mounted gripping fingers |
US5591262A (en) * | 1994-03-24 | 1997-01-07 | Tazmo Co., Ltd. | Rotary chemical treater having stationary cleaning fluid nozzle |
Also Published As
Publication number | Publication date |
---|---|
TW559571B (en) | 2003-11-01 |
WO2003008140A2 (en) | 2003-01-30 |
AU2002322587A1 (en) | 2003-03-03 |
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